Abstract: An electronic device and a non-transitory computer-readable storage medium are provided. The electronic device includes a storage module and a processing module. The storage module is configured to store at least one program instruction. The processing module is coupled to the storage module, and is configured to load the at least one program instruction to perform the following steps: parsing a plurality of cells in an analysis area in a data sheet to identify each of the cells as a formula cell or a non-formula cell; classifying the formula cells so that the formula cells having similar formula expressions fall into the same formula group; analyzing a formula structure of the formula expressions of each formula group to output at least one recommended chart option.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: An electronic switch device and an electronic switch system are provided, wherein the electronic switch system includes: an electronic switch device, which includes: a sensing module, which includes: a pressure sensing module for providing a pressure sensing signal; and a touch control sensing module disposed on the pressure sensing module for providing a touch control sensing signal; and a comparator circuit coupled to the sensing module for receiving the pressure sensing signal.

Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.

Abstract: A button mechanism is provided, including a button element, a magnet connected to the button, a hollow tube, a first coil, and a second coil. The first and second coils are disposed on the tube. When the first coil generates a first magnetic field, the magnet is magnetically attracted by the first coil, and the button element is positioned in the first position. When the second coil generates a second magnetic field, the magnet is attracted by the second coil, and the button element is positioned in the second position.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first metal layer over a substrate, forming a dielectric layer over the first metal layer. The method includes forming a trench in the dielectric layer, and performing a surface treatment process on a sidewall surface of the trench to form a hydrophobic layer. The hydrophobic layer is formed on a sidewall surface of the dielectric layer. The method further includes depositing a metal material in the trench and over the hydrophobic layer to form a via structure.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A semiconductor device including a first die and a second die bonded to one another. The first die includes a first passivation layer over a substrate, and first bond pads in the first passivation layer. The second die includes a second passivation layer, which may be bonded to the first passivation layer, and second bond pads in the second passivation layer, which may be bonded to the first bond pads. The second bond pads include inner bond pads and outer bond pads. The outer bond pads may have a greater diameter than the inner bond pads as well as the first bond pads.

Abstract: A stylus including a pen body and a magnetic attraction assembly is provided. The magnetic attraction assembly includes a magnet and a magnetic conductive structure. The magnet is disposed at a first position in the pen body. The magnetic conductive structure is disposed in the pen body and connected to the magnet to be magnetized by the magnet, and two end portions of the magnetic conductive structure are respectively located at a second position and a third position in the pen body. The magnetic attraction assembly is adapted to magnetically attract an electronic device at two of the first position, the second position and the third position.

Abstract: A key module includes a bracket, a circuit film assembly, a keycap, and a connecting structure. The bracket includes a bottom plate and a bracket pivotal portion protruding from the bottom plate. The circuit film assembly is disposed on the bracket and includes a plurality of film layers and a supporting portion formed by at least one of the film layers. The supporting portion is located beside the bracket pivotal portion. The keycap is disposed above the bracket and the circuit film assembly and includes a keycap pivotal portion. The connecting structure is disposed between the bracket and the keycap and includes a first pivot pivotally disposed at the bracket pivotal portion and a second pivot pivotally disposed at the keycap pivotal portion. The supporting portion beside the bracket pivotal portion supports the first pivot, such that the first pivot continuously contacts the bracket pivotal portion.

Abstract: A stylus including a pen body and a magnetic attraction assembly is provided. The magnetic attraction assembly includes a magnet and a magnetic conductive structure. The magnet is disposed at a first position in the pen body. The magnetic conductive structure is disposed in the pen body and connected to the magnet to be magnetized by the magnet, and two end portions of the magnetic conductive structure are respectively located at a second position and a third position in the pen body. The magnetic attraction assembly is adapted to magnetically attract an electronic device at two of the first position, the second position and the third position.

Abstract: A key module includes a bracket, a circuit film assembly, a keycap, and a connecting structure. The bracket includes a bottom plate and a bracket pivotal portion protruding from the bottom plate. The circuit film assembly is disposed on the bracket and includes a plurality of film layers and a supporting portion formed by at least one of the film layers. The supporting portion is located beside the bracket pivotal portion. The keycap is disposed above the bracket and the circuit film assembly and includes a keycap pivotal portion. The connecting structure is disposed between the bracket and the keycap and includes a first pivot pivotally disposed at the bracket pivotal portion and a second pivot pivotally disposed at the keycap pivotal portion. The supporting portion beside the bracket pivotal portion supports the first pivot, such that the first pivot continuously contacts the bracket pivotal portion.

Abstract: A key includes a substrate, a keycap, a connection component, and protruding structures. The connection component includes a first connection member and a second connection member, and the first connection member and the second connection member are between the substrate and the keycap. The protruding structures are disposed on the upper surface of the first connection member and disposed on the upper surface of the second connection member. When the keycap is pressed to a pressed position, the protruding structures on the first connection member and on the second connection member abut against the bottom surface of the keycap, so that a gap is formed between the keycap and the connection component. Therefore, the bottom surface of the keycap does not contact the upper surface of the first connection member and the upper surface of the second connection member so as to prevent from generating keystroke noises.

Abstract: A key includes a substrate, a keycap, a connection component, and protruding structures. The connection component includes a first connection member and a second connection member, and the first connection member and the second connection member are between the substrate and the keycap. The protruding structures are disposed on the upper surface of the first connection member and disposed on the upper surface of the second connection member. When the keycap is pressed to a pressed position, the protruding structures on the first connection member and on the second connection member abut against the bottom surface of the keycap, so that a gap is formed between the keycap and the connection component. Therefore, the bottom surface of the keycap does not contact the upper surface of the first connection member and the upper surface of the second connection member so as to prevent from generating keystroke noises.

Abstract: A keyboard device includes a base plate and a plurality of keyswitches disposed on the base plate. At least one of the keyswitches includes a keycap, two linkages, and two magnetic attraction members. The linkages are connected between the base plate and the keycap and configured to guide the movements of the keycap toward and away from the base plate. The magnetic attraction members are rotatably connected to the linkages, respectively, and are configured to attract each other. When the magnetic attraction members abut against each other, the keycap is at a highest position relative to the base plate. When the keycap moves toward the base plate from the highest position, the magnetic attraction members are separated from each other.

Abstract: A driving device includes: a transmission mechanism; a driving mechanism, moved with the transmission mechanism; a linkage mechanism, moved with the driving mechanism and including a locking unit; and a housing, including an accommodation seat and sealing cover, the accommodation seat accepting the transmission, driving and linkage mechanisms, the sealing cover in combination with the accommodation seat to seal the transmission, driving and linkage mechanisms, one end of the linkage mechanism partly extended out of the sealing seat, and the locking unit partly pressed against an inner side wall of the accommodation seat. Whereby, the transmission mechanism is actuated to drive the driving mechanism to rotate, allowing the driving mechanism to drive the linkage mechanism to rotate; the action of the transmission mechanism is stopped, the locking unit locks the linkage mechanism, thereby capable of preventing power waste and the damage of the transmission mechanism and driving mechanism.

Abstract: Disclosed are a supplementary bushing, a test probe, and a supplementary testing device. The supplementary bushing has a closed end, an open end, a receiving groove, and at least one first fixing portion. The closed end has a first contact, and the receiving groove is concavely formed from an open end towards the closed end. The first fixing portion is disposed on an inner surface of the receiving groove. The test probe is installed in the receiving hole of a base of the supplementary testing device and has a testing end and a connecting end. The testing end has a second contact, a second fixing portion and a stop portion.

Abstract: A test pin contact buffer, fixed to a test pin base, is a sheet-like structure made of a composite material including a conductive material and an insulating material, and defines at least one contact area corresponding to at least one test pin of the test pin base. The contact area has at least one cutout hole, an insulating deformation structure and a conductive head structure. The insulating deformation structure is extendable and made of the insulating material and extends outward from the conductive head structure. The cutout hole enables the contact area to be in a partial hollow state, which is beneficial for deformation of the insulating deformation structure. The test pin can be used for performing measurement in an indirect manner, reducing the wear of the test pin, prolonging the service life, and improving the measurement speed and efficiency.