Abstract: A portable electronic device includes a lower member, an upper member, a strip-storing unit and an electric connecting strip. The lower member is provided with a keyboard module. The upper member is slidably disposed on the lower member. The strip-storing unit is disposed in the lower member. The electric connecting strip is retractably disposed in the strip-storing unit, and two ends thereof are respectively connected to the upper member and the lower member. When the upper member slides on the lower member, a part of the electric connecting strip is pulled out or pulled back into the strip-storing unit.

Abstract: A portable electronic device includes a lower member, an upper member, a strip-storing unit and an electric connecting strip. The lower member is provided with a keyboard module. The upper member is slidably disposed on the lower member. The strip-storing unit is disposed in the lower member. The electric connecting strip is retractably disposed in the strip-storing unit, and two ends thereof are respectively connected to the upper member and the lower member. When the upper member slides on the lower member, a part of the electric connecting strip is pulled out or pulled back into the strip-storing unit.

Abstract: An electronic device comprises a body, a recording medium, and a detachable element. The body comprises a first recess, defined in the body. The recording medium is disposed in the first recess. The detachable element is detachably disposed on the recording medium in a removal direction of the recording medium to hinder removal thereof.

Abstract: An electronic device. The electronic device comprising a host, and a module structure is disposed in the host for calculating data. The module structure has a first substrate, a process unit, a heat-dissipating device and a second substrate. The first substrate is a motherboard of the electronic device, and the process unit is disposed on the first substrate, and the heat-dissipating device is attached to the process unit and disposed on the first substrate. The first substrate and the second substrate have the same structure and texture. The first substrate and the second substrate are blanketed from a multi-layer structure or sheet used for the motherboard.

Abstract: An electronic device comprises a body, a recording medium, and a detachable element. The body comprises a first recess, defined in the body. The recording medium is disposed in the first recess. The detachable element is detachably disposed on the recording medium in a removal direction of the recording medium to hinder removal thereof.

Abstract: An electronic device. A host is equipped with a circuit including a first and second heat source. A heat-dissipating module has a conductive assembly disposed on the first heat source and a first fan assembly located between a surroundings and the conductive assembly. As an initial airflow of the surroundings passes the first heat source, its temperature increases, but is lower than the second heat source. As the airflow passes the second heat source, temperature increases again, and is then expelled to the exterior of the host.

Abstract: An electronic device. The electronic device comprising a host, and a module structure is disposed in the host for calculating data. The module structure has a first substrate, a process unit, a heat-dissipating device and a second substrate. The first substrate is a motherboard of the electronic device, and the process unit is disposed on the first substrate, and the heat-dissipating device is attached to the process unit and disposed on the first substrate. The first substrate and the second substrate have the same structure and texture. The first substrate and the second substrate are blanketed from a multi-layer structure or sheet used for the motherboard.

Abstract: A heat dissipation apparatus is described. The heat dissipation apparatus reduces noise of a notebook computer. The apparatus comprises a heat sink, at least one heat pipe, at least one heat column, a plurality of heat exhausting fins, and at least one fan device. The heat sink catches the heat energy on the central processing unit of the notebook computer. The heat energy is transferred from the heat sink to the heat pipes, and then to the heat columns. The heat columns delivers the heat energy to the heat exhausting fins parallel to each other in a vertical direction and the fan device blows the heat out of the computer. The fan device has an outlet angle aligned with an inlet angle of the heat exhausting fins, and therefore the noise of the computer is reduced. In particular, a heat plate is coupled between the heat columns and the heat pipes. Hence, the heat can be more efficiently delivered to the heat exhausting fins directly from sidewalls of the heat exhausting fins and by way of the columns.

Abstract: A heat dissipation apparatus is described. The heat dissipation apparatus is used in an electrical product, and especially in a notebook computer. The heat dissipation apparatus has two cooling fans, at least one heat pipe, and at least two heat dissipation fins. The first fan sucks cooling air from outside of the electrical product. The heat pipe coupling with a heat source transfers heat generated by the heat source to the heat dissipation fins. The first heat dissipation fin and the first fan remove part of the heat out of the electrical product. The second heat dissipation fin further connects with the heat source and the heat pipe to utilize the second fan to remove part of the heat exhausted by the first fan from the electrical product. The heat dissipation apparatus further comprises a third heat dissipation fin and a second heat pipe. The second heat pipe efficiently transfers the heat to each of the heat dissipation fins.

Abstract: A heat dissipation apparatus is described. The heat dissipation apparatus is used in an electrical product, and especially in a notebook computer. The heat dissipation apparatus has two cooling fans, at least one heat pipe, and at least two heat dissipation fins. The first fan sucks cooling air from outside of the electrical product. The heat pipe coupling with a heat source transfers heat generated by the heat source to the heat dissipation fins. The first heat dissipation fin and the first fan remove part of the heat out of the electrical product. The second heat dissipation fin further connects with the heat source and the heat pipe to utilize the second fan to remove part of the heat exhausted by the first fan from the electrical product. The heat dissipation apparatus further comprises a third heat dissipation fin and a second heat pipe. The second heat pipe efficiently transfers the heat to each of the heat dissipation fins.

Abstract: A double heat exchange module for a portable computer, which is applied to cool an integrated circuit within the portable computer. The double heat exchange module includes a thermally conductive structure, a fan, and a heat exchanger. The thermally conductive structure is coupled with the integrated circuit, for conducting heat from the integrated circuit. The fan facilitates airflow from the air inlet to the air outlet. The heat exchanger disposed at the fan and coupled with the thermal conductive structure is used for double heat transfer and includes an inflow portion located at the air inlet and an outflow portion located at the air outlet.

Abstract: A heat dissipation apparatus is described. The heat dissipation apparatus reduces noise of a notebook computer. The apparatus comprises a heat sink, at least one heat pipe, at least one heat column, a plurality of heat exhausting fins, and at least one fan device. The heat sink catches the heat energy on the central processing unit of the notebook computer. The heat energy is transferred from the heat sink to the heat pipes, and then to the heat columns. The heat columns delivers the heat energy to the heat exhausting fins parallel to each other in a vertical direction and the fan device blows the heat out of the computer. The fan device has an outlet angle aligned with an inlet angle of the heat exhausting fins, and therefore the noise of the computer is reduced. In particular, a heat plate is coupled between the heat columns and the heat pipes. Hence, the heat can be more efficiently delivered to the heat exhausting fins directly from sidewalls of the heat exhausting fins and by way of the columns.

Abstract: A double heat exchange module for a portable computer, which is applied to cool an integrated circuit within the portable computer. The double heat exchange module includes a thermally conductive structure, a fan, and a heat exchanger. The thermally conductive structure is coupled with the integrated circuit, for conducting heat from the integrated circuit. The fan facilitates airflow from the air inlet to the air outlet. The heat exchanger disposed at the fan and coupled with the thermal conductive structure is used for double heat transfer and includes an inflow portion located at the air inlet and an outflow portion located at the air outlet.