Abstract: A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.

Abstract: A staining kit is provided, including a first pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, CD8, CD45, and CTLA4; a second pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, dendritic cell, and CD45; a third pattern including antibodies against T cell, B cell, NK cell, monocyte, CD8, CD45, CD45RA, CD62L, CD197, CX3CR1 and TCR??; and a fourth pattern including antibodies against B cell, CD23, CD38, CD40, CD45 and IgM, wherein the antibodies of each pattern are labeled with fluorescent dyes. A method of identifying characterized immune cell subsets of a disease and a method of predicting the likelihood of NPC in a subject in the need thereof using the staining kit are also provided.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: Methods and systems for dry etching are disclosed. The system includes a wafer clamp ring having a central opening through which a substrate may be treated and a plurality of smaller, outer support holes for receiving pins from plunger assemblies. The outer support holes are tapered and change in diameter. The tapered shape reduces horizontal shifting of the wafer clamp ring which can occur as the wafer clamp ring is moved up-and-down during operational use. The reduced shifting increases wafer yield along the edges of the wafer.

Abstract: A battery assembly includes a battery holding unit and a battery unit removably held by the battery holding unit. The battery unit includes a battery, a first engaging portion and a second engaging portion disposed on an end portion of the battery. The battery holding unit includes a holding member selectively engaging with the first engaging portion or the second engaging portion to hold the battery unit at a first position or a second position. When the holding member and the first engaging portion relatively move away from each other, the battery unit moves from the first position to the second position at which the holding member engages with the second engaging portion, and the second engaging portion is allowed to rotate along a surface of the end portion to disengage from the holding member and to remove the battery unit from the battery holding unit.

Abstract: A battery assembly includes a battery holding unit and a battery unit removably held by the battery holding unit. The battery unit includes a battery, a first engaging portion and a second engaging portion disposed on an end portion of the battery. The battery holding unit includes a holding member selectively engaging with the first engaging portion or the second engaging portion to hold the battery unit at a first position or a second position. When the holding member and the first engaging portion relatively move away from each other, the battery unit moves from the first position to the second position at which the holding member engages with the second engaging portion, and the second engaging portion is allowed to rotate along a surface of the end portion to disengage from the holding member and to remove the battery unit from the battery holding unit.

Abstract: A system, a server and a method for reproducing topological change using device events are provided. Using a server to collect device messages of network devices in a network environment and after determining and producing a device event that includes reproducing data based on the collected device messages, the device event is sent to a reproducing client. The reproducing client updates and displays topological change in the network in accordance with the reproducing data in the device event. The system and the method can use a GUI to display topological change in the network, and achieve the effect of understanding the change in linking state of network devices in the network intuitively.

Abstract: A parent-child leadframe type transformer includes a ferrite core module, a child leadframe and a parent leadframe. The parent leadframe has a first opening and a second opening on both ends. The length of the second opening is greater than the length of the first opening along the same axial direction. A containing space is defined between the first and second openings. The child leadframe has a coil winding slot and a through hole for installing the ferrite core module. The axial length of the child leadframe falls between the first and second openings, such that the child leadframe and the ferrite core module can be passed through the second opening, but limited by the first opening. The child leadframe, ferrite core module and parent leadframe are positioned to define a parent-child type transformer structure for reducing the overall height and complying with the safety regulation standards.