Abstract: An atomic layer deposition system is provided, including: a main body, a platform, a gas distribution showerhead assembly and a first ring member. The main body defines a reaction chamber, and the platform is located in the reaction chamber. The gas distribution showerhead assembly is disposed on the main body and includes at least one gas inlet channel and at least one gas diffusion plate. Each of the at least one gas diffusion plate includes a plurality of through holes. The first ring member defines a radial direction and is disposed between the platform and the at least one gas diffusion plate. A region of the at least one gas diffusion plate distributed with the plurality of through holes defines an outermost distribution profile. An inner circumferential wall of the first ring member and the outermost distribution profile keep a distance in the radial direction.

Abstract: A method and a kit for detecting Mycobacterium tuberculosis are provided. The method includes a step of performing a nested qPCR assay to a specimen. The nested qPCR assay includes a first round of amplification using external primers and a second round of amplification using internal primers and a probe. The external primers have sequences of SEQ ID NOs. 1 and 2, and the internal primers and the probe have sequences of SEQ ID NOs. 3 to 5.

Abstract: A device unlocking method and an electronic device are provided. The method includes: detecting fingerprint information of a user by a first sensor of the electronic device; authenticating the fingerprint information and temporarily storing an authentication result of the fingerprint information; after authenticating the fingerprint information, detecting operation environment information related to the electronic device by a second sensor of the electronic device; and in response to the operation environment information meeting a default condition, unlocking the electronic device according to the authentication result.

Abstract: A semiconductor device includes a fin extending from a substrate. The fin has a source/drain region and a channel region. The channel region includes a first semiconductor layer and a second semiconductor layer disposed over the first semiconductor layer and vertically separated from the first semiconductor layer by a spacing area. A high-k dielectric layer at least partially wraps around the first semiconductor layer and the second semiconductor layer. A metal layer is formed along opposing sidewalls of the high-k dielectric layer. The metal layer includes a first material. The spacing area is free of the first material.

Abstract: There is provided a locker with a motion sensor. The motion sensor identifies whether an object is put into or taken out from the locker by calculating coordinates of the object using a motion detection algorithm, by calculating a moving vector of the object using an image time differential algorithm or by comparing a current image frame and a background image frame, and outputs a put-in signal and a taken-out signal to a post control system.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A motion detection method applied into an image sensor device includes: providing a plurality of regions of interest (ROIs) on at least one monitoring image; for each region of interest (ROI): detecting whether at least one motion event occurs within the each ROI; and determining a priority level of the each ROI according to at least one feature information of the at least one motion event; and determining an alarm schedule of the ROIs for a user according to a plurality of priority levels of the ROIs.

Abstract: An antenna device, including a case assembly, a first waveguide assembly, and a second waveguide assembly, is provided. A cavity is defined by an interior of the case assembly, and a first side of the case assembly has a slot penetrating the case assembly. At least part of the first waveguide assembly is located within the cavity and is connected to the first side. A projection of the first waveguide assembly to the first side is symmetrically located on two sides of the slot. The second waveguide assembly is located outside the case assembly, is close to the first side, and is connected to the slot. The second waveguide assembly is suitable for transmitting an antenna signal to the cavity through the slot and the first waveguide assembly. The antenna signal resonates in the cavity and radiates outward from a second side of the cavity opposite to the first side.

Abstract: A keyboard key device includes a keycap and a substrate unit. The substrate unit includes a light-emitting component, a light guide plate, and a light transmission plate. The light guide plate has first and second end surfaces, and at least one light-condensing hole. The first end surface is formed with an uneven microstructure for diffuse reflection of light rays. The light transmission plate has first and second side surfaces, and an outer reflective layer coated on the second side surface. A portion of light rays emitted from the light-emitting component and into the light transmission plate pass through the outer reflective layer, and the remainder of the light rays are reflected by the outer reflective layer.

Abstract: An antenna device, including a case assembly, a first waveguide assembly, and a second waveguide assembly, is provided. A cavity is defined by an interior of the case assembly, and a first side of the case assembly has a slot penetrating the case assembly. At least part of the first waveguide assembly is located within the cavity and is connected to the first side. A projection of the first waveguide assembly to the first side is symmetrically located on two sides of the slot. The second waveguide assembly is located outside the case assembly, is close to the first side, and is connected to the slot. The second waveguide assembly is suitable for transmitting an antenna signal to the cavity through the slot and the first waveguide assembly. The antenna signal resonates in the cavity and radiates outward from a second side of the cavity opposite to the first side.

Abstract: A keyboard key device includes a keycap and a substrate unit. The substrate unit includes a light-emitting component, a light guide plate, and a light transmission plate. The light guide plate has first and second end surfaces, and at least one light-condensing hole. The first end surface is formed with an uneven microstructure for diffuse reflection of light rays. The light transmission plate has first and second side surfaces, and an outer reflective layer coated on the second side surface. A portion of light rays emitted from the light-emitting component and into the light transmission plate pass through the outer reflective layer, and the remainder of the light rays are reflected by the outer reflective layer.

Abstract: A backlight module adapted for use in an input device includes a circuit board, a light guide plate, a plurality of light-emitting elements, and a reflective structure. The light guide plate disposed on the circuit board is formed with a microstructure. The reflective structure includes a reflective plate disposed on the light guide plate opposite to the circuit board, and a first reflective layer disposed on the reflective plate opposite to the light guide plate. The first reflective layer is configured to allow a portion of a light emitted from the light-emitting elements to pass therethrough, and to allow a portion of the light to be reflected back to the light guide plate and then be diffuse reflected by the microstructure formed on the light guide plate.

Abstract: A flicker-free linear LED drive circuit is disclosed. The flicker-free linear LED drive circuit converts the input voltage of the external power supply to form an output current to the LED. The flicker-free linear LED drive circuit includes a measuring module, a regulating module and a rectifier module. The flicker-free linear LED drive circuit is characterized in that the measuring module is configured to measure the phase angle of the input voltage after full-wave rectification; the regulating module is used to form the complex voltage signal according to the measurement signal in the voltage waveform of the regulating module for the half-wave period, the conduction angle range formed at the fixed power is used as the basis for electrical conduction in the half-wave period of the input voltage.

Abstract: A flicker-free linear LED drive circuit is disclosed. The flicker-free linear LED drive circuit converts the input voltage of the external power supply to form an output current to the LED. The flicker-free linear LED drive circuit includes a measuring module, a regulating module and a rectifier module. The flicker-free linear LED drive circuit is characterized in that the measuring module is configured to measure the phase angle of the input voltage after full-wave rectification; the regulating module is used to form the complex voltage signal according to the measurement signal in the voltage waveform of the regulating module for the half-wave period, the conduction angle range formed at the fixed power is used as the basis for electrical conduction in the half-wave period of the input voltage.

Abstract: A high-voltage linear drive and memory dimming LED lighting device is disclosed. The lighting device includes a high voltage linear constant current circuit, a control IC, a first LED string and a second LED string. The control IC is electrically connected to the high voltage linear constant current circuit, and the control IC is directly driven by receiving high voltage signals. Wherein, the control IC includes a voltage regulator module, a switching module and a memory module. The voltage regulator module is electrically connected to the high voltage linear constant current circuit; the switching module is electrically connected to the voltage regulator module and includes at least two electronic switches; and the memory module is electrically connected to the switching module.

Abstract: An additive manufacturing method for a 3D object is provided and includes (a) providing a 3D digital model of the 3D object; (b) dividing the 3D digital model into repeat arrangement of at least one type of polyhedral 3D units and an X-Y plane is an acute angle or an obtuse angle; (c) cutting the 3D digital model along a Z-axis into a plurality of 2D slices; (d) defining a scanning path covering one of the 2D slices; (e) providing an energy beam to a material on a working plane along the scanning path to form a construction layer corresponding to the one of the 2D slices; and (f) repeating the steps (d) and (e) to build up the 3D object by adding a plurality of construction layers in sequence.