Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A dynamic correction system of a manufacturing process using wire is provided. The dynamic correction system includes a driving device, a path sensor, and a controller. The driving device is configured to: drive a carrier with a motion parameter and encapsulate the carrier with a wire. The path sensor is configured to obtain an actual path information of the wire encapsulating the carrier. The controller is configured to: obtain an actual path of the wire encapsulating the carrier according to the actual path information; obtain an actual path difference between a target path and the actual path; determine whether the actual path difference is greater than a predetermined error; and, when the actual path difference is greater than the predetermined error, control the driving device to change the motion parameter to cause the actual path of the wire encapsulating the carrier to approach the target path.

Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.

Abstract: A dynamic correction system of a manufacturing process using wire is provided. The dynamic correction system includes a driving device, a path sensor, and a controller. The driving device is configured to: drive a carrier with a motion parameter and encapsulate the carrier with a wire. The path sensor is configured to obtain an actual path information of the wire encapsulating the carrier. The controller is configured to: obtain an actual path of the wire encapsulating the carrier according to the actual path information; obtain an actual path difference between a target path and the actual path; determine whether the actual path difference is greater than a predetermined error; and, when the actual path difference is greater than the predetermined error, control the driving device to change the motion parameter to cause the actual path of the wire encapsulating the carrier to approach the target path.

Abstract: A method for controlling polishing and grinding is provided, including: generating an initial polishing and grinding trajectory for robot movements based on a three-dimensional contour of a work piece; adjusting the initial polishing and grinding trajectory based on a first optimized adjustment value and generating an optimized polishing and grinding trajectory; and evaluating the polishing and grinding quality of the work piece and using the polishing and grinding quality to generate a second optimized adjustment value.

Abstract: A posture positioning system for machine and the method thereof are provided. The system mainly consists of at least a depth camera mount on a robot to scan points of cloud of the machine, and a processing unit to apply an algorithm with the points of cloud and a contour vector file of the machine to obtain a transfer relationship. The processing unit further obtains a spatial relationship by a matrix calculation with the transfer relationship and a position relationship which exists between the robot and the depth camera. A route generating module of the processing unit generates, if needed, a moving route for the robot according to the spatial relationship.

Abstract: A posture positioning system for machine and the method thereof are provided. The system mainly consists of at least a depth camera mount on a robot to scan points of cloud of the machine, and a processing unit to apply an algorithm with the points of cloud and a contour vector file of the machine to obtain a transfer relationship. The processing unit further obtains a spatial relationship by a matrix calculation with the transfer relationship and a position relationship which exists between the robot and the depth camera. A route generating module of the processing unit generates, if needed, a moving route for the robot according to the spatial relationship.

Abstract: A disc discriminating device disposed in a disc changer is provided. The disc changer includes at least a tray having a recess. The disc discriminating device includes a sensing circuit and a conductor. The sensing circuit has a first contact and a second contact. The sensing circuit accordingly outputs a signal when the first and second contacts are electrically connected. The conductor has a first end electrically connected to the first contact, a protrusion penetrating an aperture disposed on a sidewall of the recess and protruding to the recess, and a second end interspaced by an interval with the second contact. The protrusion outside the recess is squeezed by a disc when loading into the recess, so that the second end of the conductor is electrically connected to the second contact. The sensing circuit outputs a signal according to the above conduction.