Patents by Inventor Chih-Hung Kuo
Chih-Hung Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11991837Abstract: A circuit board includes a substrate, a build-up circuit structure, a graphene oxide layer, a graphene layer, and an insulating material layer. The build-up circuit structure is disposed on the substrate, including at least one inner circuit, at least one dielectric layer, an outer circuit, and multiple conductive vias. The dielectric layer is disposed on the inner circuit. The outer circuit is disposed on the dielectric layer. The conductive vias penetrate the dielectric layer and electrically connect the inner circuit and the outer circuit. The graphene oxide layer and the graphene layer are disposed on the build-up circuit structure at an interval. The graphene oxide layer and the graphene layer are respectively disposed in correspondence to the dielectric layer and the outer circuit. The insulating material layer is disposed on the graphene oxide layer and the graphene layer. The insulating material layer has an opening, which exposes the graphene layer.Type: GrantFiled: March 1, 2022Date of Patent: May 21, 2024Assignee: Unimicron Technology Corp.Inventors: Ke-Chien Li, Chun-Hung Kuo, Chih-Chun Liang
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Publication number: 20240163947Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.Type: ApplicationFiled: November 8, 2023Publication date: May 16, 2024Inventors: Cheng-Ying WU, Wei-Wen LIN, Shu-Min CHENG, Hui-Ping TSENG, Chi-Han HUANG, Chih-Chun KUO, Yang-Hung PENG, Hao-Hua KANG
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Publication number: 20240163932Abstract: A multi-link operation (MLO) transmission method is provided. The MLO transmission method may be applied to an apparatus. The MLO transmission method may include the following steps. A plurality of station (STA) modules of the apparatus may each perform a respective backoff procedure. Each STA module may correspond to a different link. An MLO control circuit of the apparatus or a first STA module of the plurality of STA modules may determine whether to perform a synchronous transmission (TX) for a first STA module and at least one of other STA modules in response to a first backoff counter of the first STA module reaching 0.Type: ApplicationFiled: November 9, 2023Publication date: May 16, 2024Inventors: Hao-Hua KANG, Chih-Chun KUO, Cheng-Ying WU, Yang-Hung PENG
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Patent number: 11984323Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.Type: GrantFiled: July 12, 2021Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
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Patent number: 11978511Abstract: A phase-change memory (PCM) cell is provided to include a first electrode, a second electrode, and a phase-change feature disposed between the first electrode and the second electrode. The phase-change feature is configured to change its data state based on a write operation performed on the PCM cell. The write operation includes a reset stage and a set stage. In the reset stage, a plurality of reset current pulses are applied to the PCM cell, and the reset current pulses have increasing current amplitudes. In the set stage, a plurality of set current pulses are applied to the PCM cell, and the set current pulses exhibit an increasing trend in current amplitude. The current amplitudes of the set current pulses are smaller than those of the reset current pulses.Type: GrantFiled: January 21, 2022Date of Patent: May 7, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yung-Huei Lee, Chun-Wei Chang, Jian-Hong Lin, Wen-Hsien Kuo, Pei-Chun Liao, Chih-Hung Nien
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Patent number: 11929273Abstract: A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.Type: GrantFiled: July 27, 2020Date of Patent: March 12, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Tsung-Sheng Kuo, Chih-Hung Huang, Guan-Wei Huang, Ping-Yung Yen, Hsuan Lee, Jiun-Rong Pai
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Publication number: 20240079263Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.Type: ApplicationFiled: February 22, 2023Publication date: March 7, 2024Inventors: Kai-Hung HSIAO, Chi-Chung JEN, Yu-Chun SHEN, Yuan-Cheng KUO, Chih-Hsiung HUANG, Wen-Chih CHIANG
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Publication number: 20240074826Abstract: A surgical robot including at least one contact module, a control connection module, at least one first robotic arm, and at least one grip control device. A first transmission member of the control connection module drives the control module through a first transmission connecting member. A first shaft member of the first robotic arm is connected with the first transmission member while the grip control device is connected with the first robotic arm by a transmission interface. A force sensing member of the first robotic arm detects a first reaction force from the contact module so that the first robotic arm sends a feedback control signal to the grip control device to control a grip driving member to generate a force feedback for allowing a grip portion to move. Thereby, users can feel movement of the grip portion caused by the force feedback to avoid accidental iatrogenic injuries.Type: ApplicationFiled: September 14, 2022Publication date: March 7, 2024Inventors: PO-YUN LIU, CHUN-HUNG KUO, CHIH-CHENG CHIEN, YEN-CHIEH WANG
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Publication number: 20220265471Abstract: The present invention concerns ophthalmic surgical instruments for use during ophthalmic surgery. In one form, the present invention relates to multi-purpose ophthalmic blade for making a primary incision for entry in into an anterior chamber of an eye and a side port incision. In another form, the present invention relates to an ophthalmic surgical instrument for delivery and/or removal of fluid into or from an eye. The instrument includes a hollow shaft connectable to a blade portion adapted for making a side port incision in an eye for delivery, or removal, of the fluid.Type: ApplicationFiled: August 21, 2020Publication date: August 25, 2022Inventor: Chih-Hung Kuo
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Patent number: 11074942Abstract: A storage system includes a chassis, a storage module, and a controller module. The storage module and the controller module are mounted to the chassis. The storage module includes a housing, a storage member, and an adapter plate. The storage member is fixed to the housing and is configured to store data. The adapter plate is fixed to the housing and is detachably connected to the storage member and the controller module.Type: GrantFiled: August 23, 2019Date of Patent: July 27, 2021Assignee: HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.Inventors: Jia-Feng Lin, Chieh-Hsiang Lin, Wen-Chen Wang, Chih-Hung Kuo
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Patent number: 10966345Abstract: A solid-state drive (SSD) heat dissipation device is disclosed. The SSD heat dissipation device comprises a solid-state drive substrate, a chip heat dissipation component, a memory heat dissipation component, and a spacer. A control IC and a flash memory are disposed on the solid-state drive substrate, the chip heat dissipation component is disposed on the control IC, and the memory heat dissipation component is disposed on the flash memory. The chip heat dissipation component and the memory heat dissipation component are disposed separately.Type: GrantFiled: January 10, 2020Date of Patent: March 30, 2021Assignee: Apacer Technology Inc.Inventors: Chien-Pang Chen, Min-Lung Lin, Chih-Hung Kuo, Sung-Yu Tsai
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Publication number: 20210043231Abstract: A storage system includes a chassis, a storage module, and a controller module. The storage module and the controller module are mounted to the chassis. The storage module includes a housing, a storage member, and an adapter plate. The storage member is fixed to the housing and is configured to store data. The adapter plate is fixed to the housing and is detachably connected to the storage member and the controller module.Type: ApplicationFiled: August 23, 2019Publication date: February 11, 2021Inventors: JIA-FENG LIN, CHIEH-HSIANG LIN, WEN-CHEN WANG, CHIH-HUNG KUO
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Publication number: 20200375064Abstract: A solid-state drive (SSD) heat dissipation device is disclosed. The SSD heat dissipation device comprises a solid-state drive substrate, a chip heat dissipation component, a memory heat dissipation component, and a spacer. A control IC and a flash memory are disposed on the solid-state drive substrate, the chip heat dissipation component is disposed on the control IC, and the memory heat dissipation component is disposed on the flash memory. The chip heat dissipation component and the memory heat dissipation component are disposed separately.Type: ApplicationFiled: January 10, 2020Publication date: November 26, 2020Applicant: APACER TECHNOLOGY INC.Inventors: Chien-Pang CHEN, Min-Lung LIN, Chih-Hung KUO, Sung-Yu TSAI
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Patent number: 9779052Abstract: A PCIe bridge transformation device and a method thereof are provided, which is adapted to a storage unit in a lock state. The transformation device includes a connecting unit, a PCIe interface and a bridge. The connecting unit is connected to the storage unit and the connecting unit receives an identification command from the storage unit. The PCIe interface is electrically connected to an electronic unit. The bridge is installed with a first firmware for identifying an identification command. When the identification command is an access validity command, the first firmware unlocks the lock state of the storage unit, wherein the storage unit includes a second firmware corresponding to the first firmware, and the second firmware produces the identification command.Type: GrantFiled: January 21, 2016Date of Patent: October 3, 2017Assignee: Apacer Technology Inc.Inventors: Liang-Cheng Li, Chih-Hung Kuo
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Publication number: 20170139867Abstract: A PCIe bridge transformation device and a method thereof are provided, which is adapted to a storage unit in a lock state. The transformation device includes a connecting unit, a PCIe interface and a bridge. The connecting unit is connected to the storage unit and the connecting unit receives an identification command from the storage unit. The PCIe interface is electrically connected to an electronic unit. The bridge is installed with a first firmware for identifying an identification command. When the identification command is an access validity command, the first firmware unlocks the lock state of the storage unit, wherein the storage unit includes a second firmware corresponding to the first firmware, and the second firmware produces the identification command.Type: ApplicationFiled: January 21, 2016Publication date: May 18, 2017Inventors: LIANG-CHENG LI, CHIH-HUNG KUO
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Publication number: 20170126669Abstract: A hard drive management system and a method thereof with network authentication function are provided. The system includes a wireless router and a solid-state drive. The wireless router stores a key. The solid-state drive includes a storage module, a wireless network module and a control module. The storage stores the encrypted data. The wireless network module connects with the wireless router, and the wireless router receives the key. The control module electrically connects with the storage module and the wireless network module. The control module encrypts the source data to form the encrypted data according to the key of the wireless network module and stores the encrypted data in the storage module, or retrieves the encrypted data from the storage module and restores the encrypted data to form the source data according to the key.Type: ApplicationFiled: December 23, 2015Publication date: May 4, 2017Inventor: Chih Hung Kuo
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Patent number: 9448122Abstract: A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.Type: GrantFiled: October 4, 2013Date of Patent: September 20, 2016Assignee: National Cheng Kung UniversityInventors: Soon-Jyh Chang, Guan-Ying Huang, Kuen-Jong Lee, Wen-Yu Su, Chung-Ho Chen, Lih-Yih Chiou, Chih-Hung Kuo, Chien-Hung Tsai, Chia-Min Lin
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Patent number: 9053477Abstract: A mobile communication device is disclosed. The disclosed mobile communication device performs corresponding identity (ID) and data verification processing on a server through a smart chip and comprises a wireless communication unit, a smart chip, and a processing unit. The smart chip is configured to store ID verification information. The processing unit is electrically connected to the smart chip and the wireless communication unit. When the processing unit runs a transaction procedure, the processing unit accesses the ID verification information from the smart chip. The processing unit also drives the wireless communication unit to send the ID verification information to the server and requests the server to perform an ID verification procedure, so as to determine whether the transaction procedure is valid. Additionally, when the transaction procedure is invalid, the processing unit cancels the transaction procedure.Type: GrantFiled: February 14, 2014Date of Patent: June 9, 2015Assignee: ABANCAST LIMITEDInventors: Joshua Yu, Pao-Chieh An, Chih-Hung Kuo, Meng-Tsung Liu
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Publication number: 20140341258Abstract: A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.Type: ApplicationFiled: October 4, 2013Publication date: November 20, 2014Applicant: NATIONAL CHENG KUNG UNIVERSITYInventors: SOON-JYH CHANG, GUAN-YING HUANG, KUEN-JONG LEE, WEN-YU SU, CHUNG-HO CHEN, LIH-YIH CHIOU, CHIH-HUNG KUO, CHIEN-HUNG TSAI, CHIA-MIN LIN
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Publication number: 20140164236Abstract: A mobile communication device is disclosed. The disclosed mobile communication device performs corresponding identity (ID) and data verification processing on a server through a smart chip and comprises a wireless communication unit, a smart chip, and a processing unit. The smart chip is configured to store ID verification information. The processing unit is electrically connected to the smart chip and the wireless communication unit. When the processing unit runs a transaction procedure, the processing unit accesses the ID verification information from the smart chip. The processing unit also drives the wireless communication unit to send the ID verification information to the server and requests the server to perform an ID verification procedure, so as to determine whether the transaction procedure is valid. Additionally, when the transaction procedure is invalid, the processing unit cancels the transaction procedure.Type: ApplicationFiled: February 14, 2014Publication date: June 12, 2014Applicant: Abancast LimitedInventors: Joshua Yu, Pao-Chieh An, Chih-Hung Kuo, Meng-Tsung Liu