Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.

Abstract: A staining kit is provided, including a first pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, CD8, CD45, and CTLA4; a second pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, dendritic cell, and CD45; a third pattern including antibodies against T cell, B cell, NK cell, monocyte, CD8, CD45, CD45RA, CD62L, CD197, CX3CR1 and TCR??; and a fourth pattern including antibodies against B cell, CD23, CD38, CD40, CD45 and IgM, wherein the antibodies of each pattern are labeled with fluorescent dyes. A method of identifying characterized immune cell subsets of a disease and a method of predicting the likelihood of NPC in a subject in the need thereof using the staining kit are also provided.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An exemplary centrifugal fan includes a housing and an impeller received in the housing. The housing defines an air inlet and an air outlet thereof. Airflow driven by the impeller flows out of the housing via the air outlet. The housing further defines an opening adjacent to one end of the air outlet. The ambient air out of the centrifugal fan enters the housing via the opening, and flows out of the housing via the air outlet.

Abstract: An exemplary heat dissipating fan includes a frame and an impeller rotatably received in the frame. The frame includes a base and a top cover disposed on the base, the base includes a bottom plate a peripheral sidewall. The sidewall extends between the bottom plate and the top cover, and the base and the top cover cooperatively defines a receiving space. The impeller is rotatably received in the receiving space. The top cover, the bottom cover and the sidewall cooperatively define an air inlet therebetween. The top cover, the bottom plate and the sidewall cooperatively define an outlet therebetween. The air outlet is generally adjacent to and substantially perpendicular to the air inlet.

Abstract: An exemplary heat dissipation fan includes a housing and an impeller. The housing includes a casing. The casing includes a bottom wall and a side wall extending upwardly from the bottom wall. The impeller is received in the housing. The impeller includes a hub and a plurality of blades extending radially and outwardly from the hub. Each blade has a distal end facing the side wall of the casing. The inner side of the side wall depressed towards an outer side of the casing.

Abstract: An exemplary centrifugal fan includes a housing and an impeller received in the housing. The housing defines an air inlet and an air outlet thereof. Airflow driven by the impeller flows out of the housing via the air outlet. The housing further defines an opening adjacent to one end of the air outlet. The ambient air out of the centrifugal fan enters the housing via the opening, and flows out of the housing via the air outlet.

Abstract: A method of manufacturing a bearing includes, firstly, injecting a mixture of metal powder into a mold to form a semi-finished product. Then the semi-finished product is sintered. After that, the sintered semi-finished product is fine machined, and then washed, to form the bearing.

Abstract: An exemplary heat dissipation device includes a base, spaced fins, a bracket, a shaft and a first impeller. The base directly contacts a heat-generating source. The fins are mounted on the base to dissipate heat transferred from the base by nature convection and thermal radiation. The bracket is mounted on the fins and includes a rotor. The shaft is engaged with the rotor and is located above of the fins. The first impeller is located at above of the bracket and engaged with a top end of the shaft. Heat generated by the heat-generating source is absorbed by the base and then is transferred to the fins for dissipation. Air around the fins and the base is heated and moves upwards to drive the first impeller to rotate.

Abstract: An exemplary heat dissipating fan includes a frame and an impeller rotatablely received in the frame. The frame includes a base and a top cover disposed on the base, the base includes a bottom plate a peripheral sidewall. The sidewall extends between the bottom plate and the top cover, and the base and the top cover cooperatively defines a receiving space. The impeller is rotatably received in the receiving space. The top cover, the bottom cover and the sidewall cooperatively defines an air inlet therebetween. The top cover, the bottom plate and the sidewall cooperatively defines an outlet therebetween. The air outlet is generally adjacent to and substantially perpendicular to the air inlet.

Abstract: An exemplary heat dissipation fan includes a housing and an impeller. The housing includes a casing. The casing includes a bottom wall and a side wall extending upwardly from the bottom wall. The impeller is received in the housing. The impeller includes a hub and a plurality of blades extending radially and outwardly from the hub. Each blade has a distal end facing the side wall of the casing. The inner side of the side wall depressed towards an outer side of the casing.

Abstract: An exemplary centrifugal blower is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The centrifugal blower includes a housing defining a receiving space therein, and an impeller rotatably received in the housing. The impeller includes a hub, a supporting member fixed on the hub, and a plurality of blades extending outwardly from the supporting member. The blades are made of metal.

Abstract: An exemplary can heating and cooling device includes a container made of thermally conductive material, a heat spreader with a heat spreading portion and a heat exchanging portion, and a heat exchanger with a thermoelectric cooling chip and a heat sink. The container includes an outer side wall with a planar thermal contacting section of the container. The heat spreading portion of the heat spreader contacts the outer side wall of the container. The heat exchanging portion of the heat spreader contacts the planar thermal contacting section of the container. The thermoelectric cooling chip includes a first surface thermally connected with the heat exchanging portion of the heat spreader, and a second surface thermally connected with the heat sink.