Patents by Inventor Chih Jung Huang

Chih Jung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240192739
    Abstract: A mounting system for an electronic device is disclosed. The mounting system includes a mounting plate; a plurality of fasteners for coupling the mounting plate with the electronic device; a single main gear mounted on the mounting plate; a plurality of secondary gears coupled, respectively, to the plurality of fasteners; and a plurality of intermediate gears mounted on the mounting plate and rotationally coupled between the single main gear and the plurality of secondary gears. Rotation of each of the plurality of secondary gears causes a fastening movement of a respective one of the plurality of fasteners. Simultaneous rotation of the plurality of intermediate gears causes the plurality of secondary gears to rotate simultaneously in response to a single rotational force being received by the main gear. The simultaneous rotation of the plurality of intermediate gears causes a simultaneous fastening movement of the plurality of secondary gears.
    Type: Application
    Filed: March 3, 2023
    Publication date: June 13, 2024
    Inventors: Chao-Jung CHEN, Chih-Wei LIN, Yu-Nien HUANG, Ming-Lun LIU
  • Patent number: 12010811
    Abstract: A cable clip assembly for a computing device includes a primary clip with a primary surface between first and second primary ends. The first side extends in a first transverse direction from the first primary end, and the second side extends in the first transverse direction from the second primary end. Cable-receiving holes are arranged longitudinally between the first and second sides. A secondary clip has a secondary surface and is attached to the primary clip via the first and second sides. The secondary clip is movable relative to the primary clip between a cable installation position and a secured cable position, and is removably attached at one or more of the first and second sides. A compressible interface is attached to the primary surface, includes a flexible material that compresses when subjected to an installation force, and creates an airflow barrier in an installed position within the computing device.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: June 11, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Chih-Hsiang Lee, Chih-Ming Chen, Cheng-Hsiang Huang
  • Patent number: 12002712
    Abstract: A method includes forming a first metallic feature, forming a dielectric layer over the first metallic feature, etching the dielectric layer to form an opening, with a top surface of the first metallic feature being exposed through the opening, and performing a first treatment on the top surface of the first metallic feature. The first treatment is performed through the opening, and the first treatment is performed using a first process gas. After the first treatment, a second treatment is performed through the opening, and the second treatment is performed using a second process gas different from the first process gas. A second metallic feature is deposited in the opening.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Hsien Huang, I-Li Chen, Pin-Wen Chen, Yuan-Chen Hsu, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 11973117
    Abstract: Methods of forming contacts for source/drain regions and a contact plug for a gate stack of a finFET device are disclosed herein. Methods include etching a contact opening through a dielectric layer to expose surfaces of a first source/drain contact and repairing silicon oxide structures along sidewall surfaces of the contact opening and along planar surfaces of the dielectric layer to prevent selective loss defects from occurring during a subsequent selective deposition of conductive fill materials and during subsequent etching of other contact openings. The methods further include performing a selective bottom-up deposition of conductive fill material to form a second source/drain contact. According to some of the methods, once the second source/drain contact has been formed, the contact plug may be formed over the gate stack.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Chang-Ting Chung, Wei-Cheng Lin, Wei-Jung Lin, Chih-Wei Chang
  • Patent number: 11935947
    Abstract: An enhancement mode high electron mobility transistor (HEMT) includes a group III-V semiconductor body, a group III-V barrier layer and a gate structure. The group III-V barrier layer is disposed on the group III-V semiconductor body, and the gate structure is a stacked structure disposed on the group III-V barrier layer. The gate structure includes a gate dielectric and a group III-V gate layer disposed on the gate dielectric, and the thickness of the gate dielectric is between 15 nm to 25 nm.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: March 19, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Tung Yeh, Chun-Ming Chang, Bo-Rong Chen, Shin-Chuan Huang, Wen-Jung Liao, Chun-Liang Hou
  • Publication number: 20240079758
    Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 7, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Chih-Wei Liao, Hau Yuen Tan, Shih-Keng Huang, Wen-Hgin Chuang, Lin-Hsu Chiang, Chang-Hua Wu, Han-Wei Wang, Chun-Jung Hu
  • Patent number: 10778193
    Abstract: The present disclosure provides a resampling apparatus and a resampling method. The resampling apparatus includes a control unit, a memory device, a resolution identifier, a phase rate generator, a coefficient generator, and a resample filter. The control unit controls reading and writing operations of the resampling apparatus according to a control signal. The memory device transmits the control signal to the control unit. The resolution identifier sets a resolution bandwidth identity according to an interpolation/decimation (I/D) value of the control signal. The phase rate generator generates a phase select signal and a counter enable signal according to the resolution bandwidth identity. The coefficient generator generates a coefficient select signal according to the resolution bandwidth identity. The resample filter generates a resampled output data according to the phase select signal, the coefficient select signal, and an input data.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: September 15, 2020
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventor: Chih-Jung Huang
  • Patent number: 8850569
    Abstract: A computing device capable of instant messaging (IM) contains IM anti-malware software for preventing the transmission of malware-created IMs and opening potentially harmful IMs that it receives. When transmitting an IM, the software checks to ensure that the message being sent was created by the user (a human being) and not by IM malware, such as an IM BOT. This is done by copying details of a message as it is being typed by a user into a database and searching for that data before an IM is transmitted from the device. The software also ensures that when it receives an IM from an outside source, that the message contains a special encrypted signal that was inserted into the message by the source when the source has determined that the message was created by a human being. If the special signal is not found, it is presumed that the message was created by malware and may be discarded.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: September 30, 2014
    Assignee: Trend Micro, Inc.
    Inventors: Chih-Jung Huang, Shun-Fa Yang, Cheng-Jyun Lai, Wei-Chin Chen, Kevin Chien-Yu Chen
  • Patent number: 7129845
    Abstract: An electrotherapeutic apparatus for programming and memorizing modulated medium frequency carrier waves is disclosed. The electrotherapeutic apparatus comprises: a central processing unit; a program-memorizing unit, a data-memorizing unit, a data input unit, an alarm/output unit, an editing and display unit, a signal transformation unit, a signal output driving unit, a signal output display unit, a signal output actuation unit, and an overvoltage protection unit. The electrotherapeutic apparatus is able to memorize groups of modulated waves for use in deep/shallow positions, physical causes, and physiotherapeutic procedures of various diseases. The formulas for deep/shallow positions, physical causes, and physiotherapeutic requirements of various diseases can be formed respectively. In the formation of physiotherapeutic procedures and formulas, data can be modified and stored in the data-memorizing unit according to various ill positions so as to provide with suitable and accurate therapeutic procedures.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: October 31, 2006
    Inventor: Chih Jung Huang