Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

Abstract: An electrical connector includes: an insulating body defining a mating space; and a terminal module assembled to the insulating body and having a circuit board and plural mating terminals mounted on the circuit board, wherein: each of the mating terminals has a contact portion extending obliquely backward, a bending portion bent backward from a front end of the contact portion, a connecting portion extending rearward from a rear end of the bending portion, and a mounting portion vertically extending from a rear end of the connecting portion for mounting on the circuit board; and a front end of the circuit board extends forward into the mating space.

Abstract: A bonding tool includes a bonding monitoring system. The bonding monitoring system may include one or more sensors that are configured to generate bonding wave propagation data associated with a bonding operation. As a bond between a top semiconductor substrate and a bottom semiconductor substrate propagates from respective centers to respective perimeters of the top semiconductor substrate and the bottom semiconductor substrate, the one or more sensors of the bonding monitoring system generates the bonding wave propagation data. A controller that communicates with the one or more sensors receives the bonding wave propagation data from the one or more sensors. The controller may monitor the bonding wave propagation based on the bonding wave propagation data and/or may determine various performance parameters of the bonding operation, such as a bonding wave propagation rate and/or a bonding wave propagation uniformity, among other examples.

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: The present invention provides a water-based heavy-duty anti-corrosion coating structure and manufacturing method thereof. The structure includes a base material and a water-based coating. The base material includes a surface. A water-based coating material is sprayed on the surface of the base material to form the water-based coating. The water-based coating material includes a water-based polymer resin, a film-forming auxiliary, an auxiliary, a water-based color paste, and a deionized water. Therein, by weight percentage, the coating material comprises 40% to 60% of water-based polymer resin, 10% to 20% of film-forming auxiliary, 1% to 2% of auxiliary, 5% to 16% of water-based color paste, and 20% to 40% of deionized water. Therefore, the volatile organic compounds (VOC) content of the coating material is effectively reduced, and an excellent anti-corrosion property is provided.

Abstract: An anti-sagging spray can with stirring bead includes a can body, a stirring bead, a spray head, and a paint material. The can body has a top end and a containing space. The stirring bead is disposed in the containing space. The spray head is disposed on the top end. The spray head has an inner tube connected with the containing space. The paint material is contained in the containing space. The paint material includes a water-based polymer resin, a film-forming auxiliary, an auxiliary, a water-based color paste, and a deionized water. Thus, the present invention maintains an optimal spray effect of the sprayed paint material.

Abstract: A lens mechanism and a device using the same are provided. The lens mechanism has an optical axis and comprises a zoom module, a focus module and a focusing lens group. The zoom module performs an optical compensation. The focus module comprises a rotatable arm. The focusing lens group is disposed on the rotatable arm, wherein when the lens mechanism is in a stand-by state, the focusing lens group is located at the optical axis; when the lens mechanism is in a close-end, the focusing lens group is away from the optical axis.

Abstract: A zoom lens barrel includes a fixed barrel, a guide barrel received in the fixed barrel, a cam barrel received in the fixed barrel and housing the guide barrel, a zoom barrel sandwiched between the guide barrel and the cam barrel, and a lens cover covering on the zoom barrel. The cam barrel includes a flange radially formed on an end close to the lens cover. The zoom barrel includes a ring portion protruding out from an end close to the fixed barrel. A step surface is formed between the outer side surface of the zoom barrel and that of the ring portion. When the zoom lens barrel is in an unfolded state, the step surface interferingly resists against a bottom surface of the flange, to limit an axial movement between the cam barrel and the zoom barrel.

Abstract: A zoom lens barrel includes a fixed barrel, a guide barrel received in the fixed barrel, a cam barrel received in the fixed barrel and housing the guide barrel, a zoom barrel sandwiched between the guide barrel and the cam barrel, and a lens cover covering on the zoom barrel. The cam barrel includes a flange radially formed on an end close to the lens cover. The zoom barrel includes a ring portion protruding out from an end close to the fixed barrel. A step surface is formed between the outer side surface of the zoom barrel and that of the ring portion. When the zoom lens barrel is in an unfolded state, the step surface interferingly resists against a bottom surface of the flange, to limit an axial movement between the cam barrel and the zoom barrel.