Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.

Abstract: The present invention relates to a polymerizable water-soluble or alcohol-soluble ultraviolet absorber, which is represented by the following formula (I): wherein R1 is H or C1˜5 alkyl; R2 is H, Cl, Br or I; R3 is H or methyl; and m each is an integer in the range from 3 to 12. The above-mentioned compounds are suitable for copolymerizing with one or more monomers to form copolymers so that the UV-light resistance of the copolymer can be efficiently promoted. For example, the polymer made by copolymerizing the above-mentioned compound with acrylate monomers can be applied to the production of optical medical materials, especially contact lenses or intraocular lenses.

Abstract: A machining fluid is provided. A machining fluid for one of an electrical discharge machining process and an electrical discharge machining-polishing process, comprising a polymolecular powder, a hard particle and a carrier liquid, wherein a concentration of the polymolecular powder is lower than 500 g/L.

Abstract: The present invention relates to a polymerizable water-soluble or alcohol-soluble ultraviolet absorber, which is represented by the following formula (I): wherein R1 is H or C1˜5 alkyl; R2 is H, Cl, Br or I; R3 is H or methyl; and m each is an integer in the range from 3 to 12. The above-mentioned compounds are suitable for copolymerizing with one or more monomers to form copolymers so that the UV-light resistance of the copolymer can be efficiently promoted. For example, the polymer made by copolymerizing the above-mentioned compound with acrylate monomers can be applied to the production of optical medical materials, especially contact lenses or intraocular lenses.

Abstract: An electronic book device including a housing, for positioning an electronic book therein, at least one transmitting module, positioned inside the housing, for selecting an icon on the electronic book and accordingly transmitting a wireless signal, an antenna module, positioned inside the housing, for receiving the wireless signal transmitted from the transmitting module, a pointing module, positioned inside the housing and coupled to the antenna module, for receiving the wireless signal and converting it into at least one coordinate value, and a control module, coupled to the pointing apparatus, for receiving the coordinate value and converting it into sound signal and then outputting.

Abstract: A nitrogen-filling system is provided. A nitrogen-filling system includes a carrier including a main body for carrying at least one wafer box having at least a wafer, and a closing cover mounted on the carrier main body so as to formed a closed space around the wafer box, and a transporting vehicle for carrying the carrier and a nitrogen-filling apparatus set there on for filling the closed space with nitrogen so as to enhance a stability of the wafer in the carrier.

Abstract: An information-transforming workstation for processing an object having a first identification information is provided. The information-transforming workstation includes a platform having an area for carrying the object thereon, a reading device for reading the first identification information and outputting a first signal, an image device for extracting respective images of the information-transforming workstation and the object, a signal-converting device for receiving the first signal and providing a second signal, and a printing device for receiving the second signal and printing a second identification information.

Abstract: A positioning device is provided. The positioning device for positioning a carrier in a vehicle includes a first positioning structure and a second positioning structure. The first positioning structure is disposed on the carrier, and the carrier carries at least one wafer box. The second positioning structure is disposed on the vehicle and has at least one connecting horizontal shaft for connecting the first positioning structure on the vehicle so as to secure the carrier in the vehicle.

Abstract: A nitrogen-filling system is provided. A nitrogen-filling system includes a carrier including a main body for carrying at least one wafer box having at least a wafer, and a closing cover mounted on the carrier main body so as to formed a closed space around the wafer box, and a transporting vehicle for carrying the carrier and a nitrogen-filling apparatus set there on for filling the closed space with nitrogen so as to enhance a stability of the wafer in the carrier.

Abstract: A carrier for wafer boxes is provided. The carrier includes a carrier main body, a cover device and a shock absorbing device. The carrier main body carries at least one wafer box, and the shock absorbing device is disposed on the carrier main body and includes an oblique shock absorber so as to protect the carrier from a shock.