Abstract: A package substrate includes a core board having a through hole; a circuit layer formed on the core board; a metallic ring disposed on the core board surrounding a contour of the through hole, the metallic ring having opening portions positioned opposite to each other, making the metallic ring having a disconnected manner; and an embedded component installed in the through hole. When the embedded component is deviated in the through hole to allow the electrodes to be in contact with the metallic ring, the electrodes are prevented from coming into contact with the same section of the metallic ring to thereby avoid short circuit.

Abstract: A packaging structure is provided which includes: a substrate, at least an electronic module, and an adhesive material. The substrate has two opposing surfaces, at least an opening penetrating the two surfaces, and two metallic frames formed on two opening ends of the at least an opening. The electronic module is disposed in the opening and has electronic elements and an encapsulant encapsulating the electronic elements. Each of the electronic elements has two opposing active surfaces exposed from the encapsulant and electrode pads formed on the two opposing active surfaces. The electrode pads are exposed from the opening. The adhesive material is filled into the opening and a gap between the electronic module and the opening, so as to secure in position the electronic modules in the opening. Compared with the prior art, the embedded electronic elements of the packaging structure according to the present invention is prevented from short circuit, and thus has increased yield rate.

Abstract: A package substrate includes a core board having a through hole; a circuit layer formed on the core board; a metallic ring disposed on the core board surrounding a contour of the through hole, the metallic ring having opening portions positioned opposite to each other, making the metallic ring having a disconnected manner; and an embedded component installed in the through hole. When the embedded component is deviated in the through hole to allow the electrodes to be in contact with the metallic ring, the electrodes are prevented from coming into contact with the same section of the metallic ring to thereby avoid short circuit.