Abstract: A semiconductor device includes a stacked gate structure, a plurality of stacks and a first conductive layer. The stacks are disposed aside the stacked gate structure and arranged along both a first direction and a second direction perpendicular to the first direction, wherein the stacks are extended continuously along the first direction and segmented in the second direction. The first conductive layer is disposed between segmented portions of the stacks along the second direction, wherein top surfaces of the segmented portions of the stacks are higher than a top surface of the first conductive layer.

Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.

Abstract: A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.

Abstract: A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.

Abstract: Methods of forming line-end extensions and devices having line-end extensions are provided. In some embodiments, a method includes forming a patterned photoresist on a first region of a hard mask layer. A line-end extension region is formed in the hard mask layer. The line-end extension region extends laterally outward from an end of the first region of the hard mask layer. The line-end extension region may be formed by changing a physical property of the hard mask layer at the line-end extension region.

Abstract: An integrated circuit structure includes a first metal feature formed into a first dielectric layer, a second metal feature formed into a second dielectric layer, the second dielectric layer being disposed on said first dielectric layer, and a via connecting the first metal feature to the second metal feature, wherein a top portion of the via is offset from a bottom portion of the via.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.

Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.

Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.

Abstract: A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.

Abstract: A sensing method of a touch sensing antenna of a touch device and a touch sensing antenna structure of a touch device, which provide a wire-free electromagnetic touch antenna circuit having a tandem line and a plurality of branch lines on a touchpad. The tandem line is disposed on the touchpad, the branch lines are respectively connected to the tandem line, and each of the branch lines is connected to a controller. The controller is set to make two of the branch lines with a regular interval to form a loop, then, all combinations of two of the branch lines that can form the loop are formed once within a cycle time, and complete one scan of the touchpad; then the touchpad is repeatedly scanned repeatedly through the mentioned cycle time so that the touch pen can be interpreted at any time and at any point of the touchpad.

Abstract: The present invention provides a touch panel with multipoint array sensing antenna, comprising: a panel, including a layout area; multiple sensing antenna sets, distributed in a rectangular array in aforesaid layout area, wherein each sensing antenna set comprises at least one receiving antenna unit and at least one transmitting antenna unit, which are assembled in a range of area, and the receiving antenna unit is capable of receiving an antenna signal from the transmitting antenna unit; and a touch device, made of a material weakening or amplifying the antenna signal; when the touch device moves to a range where anyone of multiple sensing antenna sets is capable of receiving or transmitting the antenna signal, the antenna signal received by the receiving antenna unit changes, and the touch device corresponded to a position of the panel is able to be judged by an antenna signal change in the position.

Abstract: A sensing method of a touch sensing antenna of a touch device and a touch sensing antenna structure of a touch device, which provide a wire-free electromagnetic touch antenna circuit having a tandem line and a plurality of branch lines on a touchpad. The tandem line is disposed on the touchpad, the branch lines are respectively connected to the tandem line, and each of the branch lines is connected to a controller. The controller is set to make two of the branch lines with a regular interval to form a loop, then, all combinations of two of the branch lines that can form the loop are formed once within a cycle time, and complete one scan of the touchpad; then the touchpad is repeatedly scanned repeatedly through the mentioned cycle time so that the touch pen can be interpreted at any time and at any point of the touchpad.

Abstract: A pressure sensor package includes a substrate providing a connection port, a support member mounted on the substrate by compression molding and having a gap cut through opposing top and bottom walls thereof to expose the connection port, a sensor chip mounted on the support member and electrically connected to the connection port, an encapsulating cover covered on the support member and defining therein an accommodation chamber that accommodates the sensor chip and a through hole that is disposed in communication with the accommodation chamber for the passing of an external signal therethrough to the sensor chip. Thus, the support member steadily carries the sensor chip and isolates stress arising from the external environment, thereby reducing stress interference with the sensor chip and enhancing the overall performance of the pressure sensor package.

Abstract: A pressure sensor package includes a substrate providing a connection port, a support member mounted on the substrate by compression molding and having a gap cut through opposing top and bottom walls thereof to expose the connection port, a sensor chip mounted on the support member and electrically connected to the connection port, an encapsulating cover covered on the support member and defining therein an accommodation chamber that accommodates the sensor chip and a through hole that is disposed in communication with the accommodation chamber for the passing of an external signal therethrough to the sensor chip. Thus, the support member steadily carries the sensor chip and isolates stress arising from the external environment, thereby reducing stress interference with the sensor chip and enhancing the overall performance of the pressure sensor package.

Abstract: A tablet of a battery-free wireless pointing device has a battery-free wireless pointing device and a tablet. The wireless pointing device includes a power supply circuit and a sensing circuit. The tablet includes a signal processing unit, a first antenna loop, and a second antenna loop. The sensing circuit receives electric energy generated by the power supply and generates a sensing signal. The second antenna loop receives the sensing signal. The signal processing circuit generates a frequency signal and determines a current coordinate position of the pointing device according to the sensing signal.

Abstract: A heat pipe includes a tubular member, a capillary wick, and a liquid. The tubular member has a plurality of capillary ditches formed on an internal sidewall thereof. The capillary wick is disposed on the internal sidewall of the tubular member and located on openings of the capillary ditches for covering and sealing the ditches. The liquid is contained inside the tubular member. The capillary wick and ditches provide the liquid with larger cross-sectional area for the capillary action to enhance guidance of the liquid and to further enhance the thermally conductive efficiency.

Abstract: A front side bus module is disclosed. The front side bus module includes a high density interconnection substrate and a plurality of high speed devices, wherein the high speed devices are disposed on the high density interconnection substrate and electrically connected therethrough.

Abstract: A front side bus module is disclosed. The front side bus module includes a high density interconnection substrate and a plurality of high speed devices, wherein the high speed devices are disposed on the high density interconnection substrate and electrically connected therethrough.

Abstract: A data communication network is provided having a first communication device that includes a plurality of ports, and a control coupled to the ports and having a plurality of outputs extending from the control, with each of the outputs indicative of the status of one of the ports. The network further includes a power shut-off and recovery circuit coupled to the first communication device, and having a first signal detection circuit coupled to the ports for detecting activity on each port and for generating a first signal indicative of the activity, and a second signal detection circuit coupled to the outputs for detecting activity on each port and for generating a second signal indicative of the activity. The power shut-off and recovery circuit further includes a power control circuit that is coupled to the first and second signal detection circuits for receiving the first and second signals, respectively, and for selectively asserting an ENABLE signal based on either the first signal or the second signal.