Abstract: A light compensation scheme, an optical machine device, a display system and a method for light compensation are disclosed herein. The light compensation scheme includes a detector for inspecting a data related to a luminous flux of each of different color beams, and a controller for selectively adjusting anytime a luminosity of at least one of a plurality of pointolites and/or the transmittances of at least one part of liquid crystals disposed within a liquid crystal display panel, based on the inspected data.

Abstract: A light compensation scheme, an optical machine device, a display system and a method for light compensation are disclosed herein. The light compensation scheme includes a detector for inspecting a data related to a luminous flux of each of different color beams, and a controller for selectively adjusting anytime a luminosity of at least one of a plurality of pointolites and/or the transmittances of at least one part of liquid crystals disposed within a liquid crystal display panel, based on the inspected data.

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Abstract: A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Abstract: A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.

Abstract: A wire-bonding apparatus is used for wire-bonding at least a first chip and a second chip on a substrate at the same time. The wire-bonding apparatus includes at least a first capillary, a second capillary, a driving unit, a processing unit and a database. The driving unit is used for driving the first capillary and the second capillary. The processing unit is used for outputting a command to the driving unit to control the first capillary and the second capillary. The database is used for storing an operating parameter data. The processing unit controls the first capillary and the second capillary according to the operating parameter data.