Patents by Inventor Chih-peng Chen

Chih-peng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10780504
    Abstract: A powder recycling system includes a supply tank, a continuous loss-in-weight module, a pneumatic module, a transfer channel, a recycle module, and a refilling tank. The supply tank accommodates recycling powder. The continuous loss-in-weight module includes a storage tank receiving the recycling powder from the supply tank and a rotary output pipe connected to the storage tank to output the recycling powder. The continuous loss-in-weight module controls the mass flow rate of the output of the recycling powder according to the weight change of the storage tank. The pneumatic module enables the recycling powder to float and move in the transfer channel. The recycle module is connected to the transfer channel to receive the recycling powder, sieves the recycling powder, provides virgin powder, and mixes the virgin powder with the recycling powder. The refilling tank is connected to the recycle module to receive the recycling powder and the virgin powder.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: September 22, 2020
    Assignee: NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yi-Lun Xiao, Li-Tsung Sheng, Shu-San Hsiau, Kuo-Kuang Jen, Chih-Peng Chen, Po-Shen Lin, Chung-Chun Huang
  • Patent number: 10704726
    Abstract: The curved flow channel with built-in lattice structure provided by the present application is configured with the lattice structure disposed at the outer inside wall of the curved section away from a center of curvature of the curved section. Through geometry and distribution design of the lattice structure, flow rate and flow direction of fluid impacting the lattice structure can be altered, which achieves the purpose of flow rate redistribution in the curved flow channel and produces a downstream flow field with uniform distribution.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: July 7, 2020
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Po-Shen Lin, Chih-Peng Chen, Kuo-Kuang Jen, Yu-Ching Tseng
  • Publication number: 20190186669
    Abstract: The curved flow channel with built-in lattice structure provided by the present application is configured with the lattice structure disposed at the outer inside wall of the curved section away from a center of curvature of the curved section. Through geometry and distribution design of the lattice structure, flow rate and flow direction of fluid impacting the lattice structure can be altered, which achieves the purpose of flow rate redistribution in the curved flow channel and produces a downstream flow field with uniform distribution.
    Type: Application
    Filed: October 24, 2018
    Publication date: June 20, 2019
    Inventors: Po-Shen Lin, Chih-Peng Chen, Kuo-Kuang Jen, Yu-Ching Tseng
  • Publication number: 20190160751
    Abstract: The present application provides not only a heating device for additive manufacturing but also a heating module and a manufacturing apparatus utilizing the heating device. The heating device utilizes a rotational reflective cover to modulate a heating direction of a heating source, which expands an area correspondingly irradiated by the heating source and enhances uniformity of heating. Besides, the heating modules can be coupled and controlled by a controlling subsystem so as to respectively irradiate different areas with ranges at least partially intersecting each other, which also improves heating uniformity for heating a large area.
    Type: Application
    Filed: October 24, 2018
    Publication date: May 30, 2019
    Inventors: Chung-Chun Huang, Chih-Peng Chen, Po-Shen Lin
  • Publication number: 20190151954
    Abstract: A powder recycling system includes a supply tank, a continuous loss-in-weight module, a pneumatic module, a transfer channel, a recycle module, and a refilling tank. The supply tank accommodates recycling powder. The continuous loss-in-weight module includes a storage tank receiving the recycling powder from the supply tank and a rotary output pipe connected to the storage tank to output the recycling powder. The continuous loss-in-weight module controls the mass flow rate of the output of the recycling powder according to the weight change of the storage tank. The pneumatic module enables the recycling powder to float and move in the transfer channel. The recycle module is connected to the transfer channel to receive the recycling powder, sieves the recycling powder, provides virgin powder, and mixes the virgin powder with the recycling powder. The refilling tank is connected to the recycle module to receive the recycling powder and the virgin powder.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 23, 2019
    Inventors: Yi-Lun Xiao, Li-Tsung Sheng, Shu-San Hsiau, Kuo-Kuang Jen, Chih-Peng Chen, Po-Shen Lin, Chung-Chun Huang
  • Publication number: 20190143597
    Abstract: The present application discloses an additive manufacturing chamber, an additive manufacturing module and an additive manufacturing apparatus therewith. Powder discharging openings are formed at a lower portion of the additive manufacturing chamber, and the powders in the additive manufacturing chamber are discharged down via gravitation. The present application further includes a vibrational unit for vibrating the powders so as to accelerate downward powder discharging via vibration of the vibrational unit. The additive manufacturing apparatus can include a main system and a cleaning transportation system separated from the main system. The present application solves the conventional problems of excessive consumed energy, large required installation and operational space, inconvenience of powder removing and swirled raised powder haze in the environment.
    Type: Application
    Filed: October 21, 2018
    Publication date: May 16, 2019
    Inventors: Chung-Chun Huang, Chih-Peng Chen, Po-Shen Lin, Yu-Ching Tseng
  • Patent number: 10215499
    Abstract: A heat dissipation device includes a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow C-shaped fitting portion, in which the heat pipe is fitted to tightly connect to the covering member. At least one first heat transfer portion is outwardly extended from a periphery of the C-shaped fitting portion of the covering member. The heat dissipation unit has a plurality of parallelly spaced heat radiation fins, each of which has a through hole formed thereon, and at least one first locating slot is outwardly extended from the through hole. When the C-shaped fitting portion and the first heat transfer portion are respectively extended through the through holes and the first locating slots, the covering member is connected to the heat dissipation unit. With the first heat transfer portion, the heat dissipation device can have enhanced heat transfer and dissipation effect.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: February 26, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Chih-Peng Chen, Huang-Pin Shen
  • Publication number: 20180260004
    Abstract: A computer casing includes a housing, a retaining structure, a lock plate, and an elastic element. The retaining structure is disposed in the housing. The lock plate is movably disposed on the retaining structure. The elastic element is disposed on the lock plate, and applies an elastic force to the retaining structure to retain the lock plate in a burglar-proof position or a storage position.
    Type: Application
    Filed: July 6, 2017
    Publication date: September 13, 2018
    Inventors: Chia Hua CHU, Chih Peng CHEN
  • Publication number: 20170042064
    Abstract: A thermal module includes a heat pipe and a heat dissipation unit. The heat pipe has a main body and at least one first heat conduction section integrally radially and axially extending from a circumference of the main body. The heat dissipation unit has multiple radiating fins. The radiating fins are arranged at intervals. Each radiating fin is formed with a perforation. At least one first locating slit outward extend from the perforation. The main body and the first heat conduction section are respectively correspondingly fitted through the perforations and the first locating slits to tightly connect the heat pipe with the heat dissipation unit. The first heat conduction section of the heat pipe provides much larger heat conduction area for the heat pipe so that the heat conduction effect of the heat dissipation unit is greatly enhanced and the heat dissipation performance and efficiency are enhanced.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 9, 2017
    Inventors: Chih-Peng Chen, Huang-Pin Shen
  • Publication number: 20170038153
    Abstract: A heat dissipation device includes a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow C-shaped fitting portion, in which the heat pipe is fitted to tightly connect to the covering member. At least one first heat transfer portion is outwardly extended from a periphery of the C-shaped fitting portion of the covering member. The heat dissipation unit has a plurality of parallelly spaced heat radiation fins, each of which has a through hole formed thereon, and at least one first locating slot is outwardly extended from the through hole. When the C-shaped fitting portion and the first heat transfer portion are respectively extended through the through holes and the first locating slots, the covering member is connected to the heat dissipation unit. With the first heat transfer portion, the heat dissipation device can have enhanced heat transfer and dissipation effect.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 9, 2017
    Inventors: Chih-Peng Chen, Huang-Pin Shen
  • Patent number: 9476655
    Abstract: A thermal module having an integral body including a base seat with a raised section and a heat dissipation unit with a recess such that the raised section of the base seat fits into the recess of the heat dissipation unit to connect the heat dissipation unit with the base seat. An inner end of the recess is formed with at least one lateral protrusion extended toward an opposite end of the recess and at least one end of the raised section is formed with a groove corresponding to the protrusion, the protrusion being inserted in and connected to the groove.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: October 25, 2016
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Chih-Peng Chen
  • Patent number: 9196994
    Abstract: A connecter mechanism includes a casing, a half socket and a door. The casing includes a first actuating portion, an opening and a pivot hole. The half socket is disposed inside the casing. The door is movably disposed on the casing to cover the half socket. The door includes a body, at least one pivot shaft, a cover and a second actuating portion. The pivot shaft is disposed on a side of the body. The cover is connected to an edge of the body for covering the opening. The second actuating portion is connected to the other edge of the body opposite to the cover. Position of the cover relative to the opening is adjusted via the second actuating portion and the first actuating portion.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: November 24, 2015
    Assignee: Wistron Corporation
    Inventors: Tien-Chung Tseng, Po-Lun Lin, Chih-Peng Chen, Chih-Sheng Chou, Chia-Jou Chen
  • Publication number: 20150159966
    Abstract: A manufacturing method of thermal module includes steps of: providing a base seat with a raised section and a heat dissipation unit with a recess; heating the heat dissipation unit and fitting the raised section of the base seat into the recess of the heat dissipation unit to connect the heat dissipation unit with the base seat; and tightly connecting the heat dissipation unit with the base seat to form an integrated body after the heat dissipation unit is cooled. According to the manufacturing method of thermal module, the manufacturing cost of the thermal module is lowered and the manufacturing process is greatly simplified.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 11, 2015
    Applicant: Asia Vital Components Co., Ltd.
    Inventor: Chih-Peng Chen
  • Patent number: 8770565
    Abstract: The present disclosure provides a jig for surface treatment, which is used for fixing a metal plate having a bearing for surface treatment. The jig for surface treatment according to the present disclosure passes a hanging rod through the metal plate. Thereby, the jig for surface treatment will not contact with a processed surface of the metal plate and hence making no apparent flaws on the processed surface and maintaining completeness processed surface. In addition, the jig for surface treatment can load a plurality of metal plates at a time, performing surface treatment on the plurality of metal plates simultaneously, and thus improving productivity and practicability.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: July 8, 2014
    Assignee: Wistron Corporation
    Inventors: Huai-Gang Liu, Chih-Peng Chen
  • Publication number: 20140182820
    Abstract: A vapor chamber structure includes a main body internally defining a sealed chamber and having a plurality of radiating fins externally provided thereon. The radiating fins are integrally formed on and outward extended from one side of the main body in a direction opposite to the chamber; and the chamber is internally provided with a wick structure and filled with a working fluid. By integrally forming the radiating fins and the chamber with one another, the vapor chamber structure can be manufactured with reduced labor cost and shortened manufacturing time.
    Type: Application
    Filed: January 1, 2013
    Publication date: July 3, 2014
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Chih-Peng Chen
  • Publication number: 20140182132
    Abstract: A vapor chamber structure includes an integrally formed main body defining a chamber and having radiating fins. The radiating fins are outward extended from one side of the main body in a direction opposite to the chamber; the chamber is internally provided with a wick structure and filled with a working fluid. A method of manufacturing a vapor chamber structure is also disclosed, which includes the steps of using an extrusion process to manufacture a main body having a plurality of radiating fins and a chamber; forming at least one wick structure on inner walls of the chamber after the main body has been manufactured; and sealing two ends of the main body, and evacuating the chamber before filling it with a working fluid. With the method, the vapor chamber structure can be manufactured with reduced material and labor costs and shortened manufacturing time.
    Type: Application
    Filed: January 1, 2013
    Publication date: July 3, 2014
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Chih-Peng Chen
  • Publication number: 20140165402
    Abstract: A vapor chamber and a method of manufacturing same are disclosed. The vapor chamber includes a main body internally defining a chamber. The chamber internally has a plurality of flow guides and contains a working fluid; and at least one flow passage is formed between any two adjacent flow guides, such that the flow guides and the flow passages together define a flow guiding zone in the main body. The flow guiding zone has two opposite ends respectively connecting with a first convection zone and a second convection zone, such that the flow passages and the first and second convection zones communicate with one another. With the main body and the internal flow passages for a vapor chamber being integrally formed by aluminum extrusion, the time, labor and material costs for the vapor chamber can be largely reduced.
    Type: Application
    Filed: February 21, 2014
    Publication date: June 19, 2014
    Applicant: Asia Vital Components Co., Ltd.
    Inventor: Chih-Peng Chen
  • Publication number: 20140134858
    Abstract: A connecter mechanism includes a casing, a half socket and a door. The casing includes a first actuating portion, an opening and a pivot hole. The half socket is disposed inside the casing. The door is movably disposed on the casing to cover the half socket. The door includes a body, at least one pivot shaft, a cover and a second actuating portion. The pivot shaft is disposed on a side of the body. The cover is connected to an edge of the body for covering the opening. The second actuating portion is connected to the other edge of the body opposite to the cover. Position of the cover relative to the opening is adjusted via the second actuating portion and the first actuating portion.
    Type: Application
    Filed: June 27, 2013
    Publication date: May 15, 2014
    Inventors: Tien-Chung Tseng, Po-Lun Lin, Chih-Peng Chen, Chih-Sheng Chou, Chia-Jou Chen
  • Patent number: 8723064
    Abstract: A button mechanism includes a casing. A lock hole and an engaging portion are formed and disposed on a bottom of the casing, and a plurality of open slots is formed on a lateral wall of the casing. The button mechanism further includes a plurality of buttons respectively disposed on the corresponding open slots, a fixing component, and a supporting component. An end of the supporting component is engaged with the engaging portion. The supporting component includes a first part whereon a piercing hole is formed. The fixing component pierces through the piercing hole and the lock hole to fix the first part on the bottom of the casing. The supporting component further includes a second part connected to the first part and contacting against the plurality of first buttons for constraining movements of the plurality of buttons relative to the casing.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: May 13, 2014
    Assignee: Wistron Corporation
    Inventors: Yen-Chang Cheng, Chih-Peng Chen
  • Publication number: 20130306277
    Abstract: A thermal module structure includes a main body and at least one heat pipe. The main body has a base section and an extension section. Multiple radiating fins extend from a circumference of the extension section. The heat pipe is assembled with the main body. The heat pipe has a heat absorption end and a heat dissipation end. The thermal module structure has lower thermal resistance so that the heat dissipation effect of the thermal module structure is greatly enhanced. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Chih-Peng Chen