Patents by Inventor Chih Sheng Hou

Chih Sheng Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8322224
    Abstract: A pressure guiding bump is configured on the center of a pressure gauge to obtain a single “conductivity--pressure” curve feature which is independent from any position wherever a pressure is applied on the guiding bump. When a pressure is applied, the guiding bump guides the pressure against a fixed deformable area to be deformed, whatever the pressure is, the deformed area is nearly a same area. The pressure gauge is extraordinarily adequate to be designed in a weighing machine with parallel connection in between them.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: December 4, 2012
    Assignees: Universal Cement Corporation, Industrial Technology Research Institute
    Inventors: Chih-Sheng Hou, Chia-Hung Chou
  • Publication number: 20120297885
    Abstract: A preloaded pressure sensor module (PPSM) is disclosed, where the PPSM outputs a linear Conductivity Response versus Pressure Force input. The PPSM has a convex or concave profile which is prepared by pressing a flat pressure sensor device onto to a convex or concave base respectively so that the pressure sensitive layer inside the sensor module is bent and displays a preloaded effect.
    Type: Application
    Filed: May 23, 2011
    Publication date: November 29, 2012
    Applicant: UNIVERSAL CEMENT CORPORATION
    Inventors: Chih-Sheng HOU, Yann-Cherng CHERN
  • Patent number: 8210994
    Abstract: A pressure sensor is provided, wherein a ballast resistive layer is integrated in the pressure sensor so that the resistive output curve for the pressure sensor has saturation characteristics. The pressure sensor shall be prevented from breaking down by a large current that may be caused, when an overload pressure is applied on the pressure sensor, if no ballast resistive layer is added.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: July 3, 2012
    Assignee: Universal Cement Corporation
    Inventors: Chia-Chieh Chang, Chih Sheng Hou, Chia-Hung Chou
  • Publication number: 20120162087
    Abstract: A cover glass pressure-sensitive button for a mobile device is disclosed, a piece of pressure sensor is configured under peripheral of a cover glass for a display of a mobile device. The cover glass can be pressed like a button, and a signal is output from the pressure sensor to trigger a predetermined function for the mobile device when a pressure is applied on the cover glass. In another embodiment, a space is reserved either under the touch panel or under the LCD module. With this configuration, the pressure sensitivity of the cover glass increases because the pressure applied on the cover glass can be fully transferred onto the pressure sensor.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 28, 2012
    Applicant: UNIVERSAL CEMENT CORPORATION
    Inventor: Chih Sheng HOU
  • Publication number: 20120050335
    Abstract: A zooming pressure sensor is used to control the zooming of information in a zooming frame on a displayed for a cell phone, portable media device, or an electronic reader. A zooming pressure sensor converts finger pressure into corresponding physical parameter such as conductance, resistance, or charge, which is further processed by a circuit for control parameter of a zooming frame. The magnitude of output parameters is designed in positive relation to zoom-in, and in negative relation to zoom-out.
    Type: Application
    Filed: August 25, 2010
    Publication date: March 1, 2012
    Applicant: UNIVERSAL CEMENT CORPORATION
    Inventor: Chih-Sheng HOU
  • Publication number: 20110314923
    Abstract: A pressure guiding bump is configured on the center of a pressure gauge to obtain a single “conductivity-pressure” curve feature which is independent from any position wherever a pressure is applied on the guiding bump. When a pressure is applied, the guiding bump guides the pressure against a fixed deformable area to be deformed, whatever the pressure is, the deformed area is nearly a same area. The pressure gauge is extraordinarily adequate to be designed in a weighing machine with parallel connection in between them.
    Type: Application
    Filed: June 24, 2010
    Publication date: December 29, 2011
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, UNIVERSAL CEMENT CORPORATION
    Inventors: Chih-Sheng HOU, Chia-Hung CHOU
  • Publication number: 20110053737
    Abstract: A pressure sensor is provided, wherein a ballast resistive layer is integrated in the pressure sensor so that the resistive output curve for the pressure sensor has saturation characteristics. The pressure sensor shall be prevented from breaking down by a large current that may be caused, when an overload pressure is applied on the pressure sensor, if no ballast resistive layer is added.
    Type: Application
    Filed: December 31, 2009
    Publication date: March 3, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: CHIA-CHIEH CHANG, CHIH-SHENG HOU, CHIA-HUNG CHOU
  • Publication number: 20110048139
    Abstract: A micro-deformable piezoresistive material is provided, including a hard plastic body, a micro-deformable rough texture surface, and a plurality of conductive particles. The micro-deformable rough texture surface is formed on a side of the hard plastic body, wherein the maximum deformation of the rough texture surface is far less than the thickness of the hard plastic body. Additionally, the conductive particles are evenly dispersed in the plastic body.
    Type: Application
    Filed: December 31, 2009
    Publication date: March 3, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Ling Chen, Chih Sheng Hou, Chia-Hung Chou
  • Publication number: 20090303400
    Abstract: A functional device array with self-aligned electrode structures and fabrication methods thereof are presented. The functional device array includes a transparent substrate. A patterned lower electrode array is disposed on the transparent substrate. A spacer structure is disposed overlying the transparent substrate and located between the patterned lower electrodes self-aligned therewith. A functional structure layer is disposed in an array of pixel regions defined by the spacer structure. A patterned upper substrate is disposed on the functional structure layer corresponding to each of the pixel regions, and a passivation layer is disposed on the patterned upper electrode covering the functional device array.
    Type: Application
    Filed: November 20, 2008
    Publication date: December 10, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih Sheng Hou, Wei-Hsin Hou