Abstract: A three-dimensional measuring device includes a ball-shaped structure, an X-axis measuring module, a Y-axis measuring module and a Z-axis measuring module. The ball-shaped structure is moved and/or rotated in response to a movement of a movable object. The X-axis measuring module includes a first measuring structure and a first position sensor. The first measuring structure is movable along an X-axis direction and contacted with the ball-shaped structure. The Y-axis measuring module includes a second measuring structure and a second position sensor. The second measuring structure is movable along a Y-axis direction and contacted with the ball-shaped structure. The Z-axis measuring module includes a third measuring structure and a third position sensor. The third measuring structure is movable along a Z-axis direction and contacted with the ball-shaped structure.

Abstract: A setting method of in-memory computing simulator includes: performing a plurality of test combinations by an in-memory computing device and recording a plurality of first estimation indices corresponding to the plurality of test combinations respectively, wherein each of the plurality of test combinations includes one of a plurality of neural network models and one of a plurality of datasets, executing a simulator according to the plurality of test combinations by a processing device and recording a plurality of second estimation indices corresponding to the plurality of test combinations respectively, wherein the simulator has a plurality of adjustable settings; calculating a correlation sum according to the plurality of first estimation indices and the plurality of second estimation indices by the processing device, and performing an optimal algorithm to search an optimal parameter in the setting space constructed by the plurality of settings so that the correlation sum is maximal.

Abstract: A liquid crystal display includes a pixel array formed by a plurality of scanning lines and a plurality of data lines. Two of the scanning lines which are adjacent to each other and two of the data lines which are adjacent to each other form a pixel unit. The pixel unit includes a capacitor and a transistor. The transistor includes a control terminal, a first terminal, and a second terminal. When one of the scanning lines transmits a scanning signal to the control terminal of the transistor and turns on the transistor, one of the data lines charges the capacitor by transferring a data signal to the capacitor through the transistor, and the pixel unit still has a charging percentage greater than or equal to a charging percentage threshold when an ambient temperature is below a temperature threshold.

Abstract: A method of manufacturing a light emitting diode (LED) substrate includes following steps: providing a nano-patterned substrate, which has a plurality of convex portions and a plurality of first concave portions that are spaced apart from each other, wherein each first concave portion has a depth (d1); forming a plurality of protection structures to cover each convex portion, and exposing a bottom surface of each first concave portion; performing an anisotropic etching processing to etch the bottom surface of each first concave portion which is not covered by the protection structure so as to form a plurality of second concave portions having a depth (d2), and d2 is greater than d1.

Abstract: A method of manufacturing a light emitting diode (LED) substrate includes following steps: providing a nano-patterned substrate, which has a plurality of convex portions and a plurality of first concave portions that are spaced apart from each other, wherein each first concave portion has a depth (d1); forming a plurality of protection structures to cover each convex portion, and exposing a bottom surface of each first concave portion; performing an anisotropic etching processing to etch the bottom surface of each first concave portion which is not covered by the protection structure so as to form a plurality of second concave portions having a depth (d2), and d2 is greater than d1.

Abstract: An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the LED chips and the electrical contacts; and a phosphor covering the LED chips, the electrical contacts and the bonding wires. The LED chips are disposed at different heights so as to allow the portions of the phosphor on the LED chips to have different thicknesses and thus generate light with different color temperatures.

Abstract: An LED package structure and a method of fabricating the same. The LED package structure includes: a package unit including a submount with a cavity, and a light emitting chip disposed in the cavity; a first light-pervious element disposed in the cavity; a multi-layered dam structure concentrically disposed on the first light-pervious element or around a rim of the cavity; a first light-pervious packaging material filled in the dam structure; and a second light-pervious element that combines with the dam structure. Accordingly, the multi-layered dam structure provides an advantage of eliminating gaps and overcomes the problem resulting from the uneven thickness of the first light-pervious packaging material used in the prior technique, thereby ensuring high illumination efficiency and enhanced airtightness.

Abstract: An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the LED chips and the electrical contacts; and a phosphor covering the LED chips, the electrical contacts and the bonding wires. The LED chips are disposed at different heights so as to allow the portions of the phosphor on the LED chips to have different thicknesses and thus generate light with different color temperatures.

Abstract: A light-permeating cover board structure includes a first light-permeating board having a light-permeating substrate and a frame formed on the light-permeating substrate, wherein a first recess portion is defined by the frame and the light-permeating substrate; a first fluorescent material filled in the first recess portion; and a second light-permeating board disposed on the first light-permeating board and covering the first fluorescent material in the first recess portion. Therefore, the first light-permeating board and the second light-permeating board prevent the first fluorescent material from contacting moisture.

Abstract: A module and method for automatically detecting and switching between FXO and FXS interfaces via a single RJ11 is disclosed. The module comprises a RJ11 jack, a USB controller, a modem element, a SLIC module and a DAA module, wherein the USB controller is electrically coupled with a computer for automatically detecting whether a PSTN phone line or a traditional telephone is plugged into the RJ11 jack. According to the detection, the telephone can be connected to the Internet for making and answering a VoIP call via the computer; the computer can be connected to the Internet for making and answering a VoIP call via the modem element; or the computer can make/answer a call to/from the PSTN.

Abstract: The present invention is to provide a digital cordless phone having remote control functionality. When a telephone connection is established upon transmitting and receiving wireless telephony signals by a wireless transceiver module, an MCU receives control signals from a remote terminal via the telephone connection to control the remote control module, by which the wireless transmission module is initiated to send out the corresponding wireless control signals; when an internet connection is established upon transmitting and receiving wireless internet signals by the wireless transceiver module, the MCU can download a control code set for an electronic device from a website via the internet connection, and the control code set is stored in a memory.

Abstract: A 3-in-1 automatic call forward system integrates the domestic phone, the mobile phone and the internet phone for switching the communication method automatically and choosing an appropriate method to transmit or receive a phone call. The users also can choose the same telecom service provider to perform communication with each other for reducing the telephone fees.

Abstract: An Internet telephony call box device implemented with a single SLIC module, which includes a first line connector, a second line connector, a switch module, a SLIC module and an LI module. A control module controls the switch module to switch a connection of the first line connector, the second line connector, the SLIC module and the LI module to thereby enable a conventional phone to make/answer a regular or VoIP call. The LI module includes a protection and rectification unit, a line status monitor unit, a ring detection unit and an off-hook emulation unit, which cooperate with the SLIC module to achieve the functions of the prior SLIC and DAA modules.