Abstract: The present invention discloses a thin film transistor (TFT) structure having big channel-width. The TFT structure comprises a gate, a source and a drain. The source and the drain are respectively be a spiral, and are symmetrical and corresponding to each other to form as a double spiral arrangement. By the source and the drain forming as a symmetrical and corresponding double spiral, the TFT of the present invention can increase the channel-width between the source and the drain, so as to increase width/length rate, so that the charge ability of the TFT can be increased.

Abstract: The present invention provides a photoresist coating device and the coating method thereof. Wherein, the photoresist coating device comprises a nozzle, the nozzle comprising a first nozzle split and a second nozzle split provided oppositely and a top plate used to fix the first nozzle split and the second nozzle split, a slit being formed between the first nozzle split and the second nozzle split, the middle of the operation face of the first nozzle split being provided with a first photoresist injection pipe, the first photoresist injection pipe being through the first nozzle split and connected with the slit, the top of the operation face of the first nozzle split being further provided with two second photoresist injection pipes which are on both sides of the first photoresist injection pipe, the second photoresist injection pipes being through the first nozzle split and connected with the slit.

Abstract: The present invention provides a method for purging bubbles in the pipeline of a substrate coater, which at least comprises: activating an injection pump for a first time, the injection pump injecting a photoresist into the pipeline of the substrate coater from a storage container; driving the photoresist to flow in the pipeline of the substrate coater and proceeding a purging bubbles process once; closing the injection pump for a second time after finishing the purging bubbles process; and activating the injection pump again and repeating the purging bubbles process until all small bubbles in the pipeline of the substrate coater being purged after the small bubbles in the pipeline of the substrate coater accumulate in the second time. The present invention correspondingly discloses a device for purging bubbles in the pipeline of substrate coater and a substrate coater. According to the embodiment of the present invention, it can improve the purging bubbles efficiency in the pipeline and save the photoresist.

Abstract: The present invention discloses a film-thickness measuring device and a calibration method thereof. The film-thickness measuring device has at least two fixing bases disposed in different calibration positions, a carrier machine table for carrying substrates and a measuring head. The measuring head receives a label of the present substrate being carried from the carrier machine table; obtains parameters of the calibration position that the label corresponds to from a saved corresponding relationship, and moves to a top of the calibration position that the obtained parameters correspond to, and then measures film-thickness of the calibration plate on the fixing base which is disposed in the calibration position to achieve calibration. The present invention automatically switches to corresponding calibration positions according to different substrates for calibrating, so as to prevent inconvenience caused by manual changing the calibration plates.