Abstract: A processor assembly including: an exposure station operable to expose a sample on a slide; a print station operable to apply a reagent to the exposed sample through a thermal inkjet process; and a robotic transfer mechanism to transfer the slide from the exposure station to the print station. Also, a reagent cartridge including: a body defining a container having a volume therein; a nonmetallic bag in the container operable to contain a reagent; and a printhead at a base of the body, the printhead coupled to an outlet of the bag. Further, a method including exposing a sample on a slide in a processor assembly; robotically transferring the slide to a printing station of the processor assembly; and applying a reagent to the exposed sample at the printing station by a thermal inkjet printing process.

Abstract: An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided.

Abstract: A thermal bubble inkjet printhead including a substrate, a plurality of control elements, a plurality of heaters, an ink barrier and a nozzle plate is provided. The control elements are disposed on the substrate. The heaters are electrically connected to the control elements. The material of the heaters is a transparent conductive material. The ink barrier is disposed on the heater and has a plurality of ink chambers. Each of the ink chambers overlaps one of the heaters. The nozzle plate is disposed on the ink barrier and has a plurality of nozzles. Each nozzle overlaps one of the ink chambers.

Abstract: An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided.

Abstract: A solenoid valve booster includes a control circuit connected between an input of a solenoid valve and AC power. The control circuit is consisted of a positive half wave turn-on voltage control circuit, a negative half wave turn-off delay control circuit, a logic NOR gate circuit, a phase control circuit, a rectifying and filtering circuit, and a start delay circuit. It can reinforce opening force of the solenoid valve, and lessening power consumed by the solenoid valve. Further, an isolate start circuit and an input control may be additionally connected with the booster described above for taking place of a conventional SSR (solid state relay).