Patents by Inventor Chih-Ting Chen
Chih-Ting Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984323Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.Type: GrantFiled: July 12, 2021Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
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Publication number: 20240153842Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.Type: ApplicationFiled: January 4, 2024Publication date: May 9, 2024Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
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Publication number: 20240154008Abstract: Provided is a semiconductor device including a substrate, a channel layer, a gate structure, a first doped region, a second doped region, a third doped region and a channel cap layer. The channel layer is located on the substrate. The channel layer has a trench. The gate structure is disposed in the trench. The first doped region and the second doped region are located in the channel layer on two sides of the gate structure. The third doped region is located in the substrate below the channel layer. The channel cap layer is located between the gate structure and the first doped region, between the gate structure and the second doped region, and between the gate structure and the channel layer. An energy band gap of the channel cap layer is larger than an energy band gap of the channel layer.Type: ApplicationFiled: January 9, 2023Publication date: May 9, 2024Applicant: Industrial Technology Research InstituteInventors: Chih-Hung Yen, Yu-Ting Chen, Hua-Mao Chen
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Publication number: 20240128127Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.Type: ApplicationFiled: December 28, 2023Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chih-Kai Hsu, Ssu-l Fu, Chun-ya Chiu, Chi-Ting Wu, Chin-HUNG Chen, Yu-Hsiang Lin
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Patent number: 11942750Abstract: A laser inspection system is provided. A laser source emits a laser with a first spectrum and the laser is transmitted by a first optical fiber. A gain optical fiber doped with special ions is connected to the first optical fiber, and a light detector is provided around the gain optical fiber. When the laser with the first spectrum passes through the gain optical fiber, the gain optical fiber absorbs part of the energy level of the laser with the first spectrum, so that the laser with the first spectrum is converted to generate light with a second spectrum based on the frequency conversion phenomenon. The light detector detects the intensity of the light with the second spectrum, so that the power of the laser source can be obtained.Type: GrantFiled: November 23, 2020Date of Patent: March 26, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yi-Chi Lee, Hsin-Chia Su, Shih-Ting Lin, Yu-Cheng Song, Fu-Shun Ho, Chih-Chun Chen
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Patent number: 11934171Abstract: The present disclosure discloses a servo motor and an encoder calibration method. The encoder calibration method includes: calculating a gain error, an offset error and a phase error, by an error calculation block, according to a first signal and a second signal output by an encoder; calculating at least one gain calibration parameter, at least one offset calibration parameter and at least one phase calibration parameter, by the error calibration block, according to the gain error, the offset error and the phase error; and calibrating sequentially, by the encoder, the gain, the offset and the phase of the first signal and the second signal according to the at least one gain calibration parameter, the at least one offset calibration parameter and the at least one phase calibration parameter, wherein performing at least one gain calibration and offset calibration after the phase calibration is completed.Type: GrantFiled: April 4, 2022Date of Patent: March 19, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Kai Chiu, Bo-Ting Yeh, Tsan-Huang Chen
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Publication number: 20240069299Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
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Patent number: 11916077Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.Type: GrantFiled: May 24, 2021Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
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Patent number: 11915977Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.Type: GrantFiled: April 12, 2021Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
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Patent number: 11846988Abstract: A head-mounted display device includes a front-end assembly, a plurality of support arms, a plurality of counterweight parts and a plurality of brackets. The plurality of support arms are respectively connected to the front-end assembly. The plurality of counterweight parts are respectively slidably arranged to the plurality of support arms and away from the front assembly. The plurality of brackets are respectively connected to the plurality of counterweight parts and used for contacting the head of the user. The brackets are separated from each other. Each of the brackets has an upper part and a lower part. The upper parts of the brackets are adapted to support the upper part of the back of the user's head. The lower parts of the brackets are adapted to support the lower part of the back of the user's head.Type: GrantFiled: February 22, 2022Date of Patent: December 19, 2023Assignee: HTC CorporationInventors: Yen Chun Chen, Meng Yu Jian, Chih-Ting Chen
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Publication number: 20230079999Abstract: A head-mounted display device includes a front-end assembly, a plurality of support arms, a plurality of counterweight parts and a plurality of brackets. The plurality of support arms are respectively connected to the front-end assembly. The plurality of counterweight parts are respectively slidably arranged to the plurality of support arms and away from the front assembly. The plurality of brackets are respectively connected to the plurality of counterweight parts and used for contacting the head of the user. The brackets are separated from each other. Each of the brackets has an upper part and a lower part. The upper parts of the brackets are adapted to support the upper part of the back of the user's head. The lower parts of the brackets are adapted to support the lower part of the back of the user's head.Type: ApplicationFiled: February 22, 2022Publication date: March 16, 2023Applicant: HTC CorporationInventors: Yen Chun Chen, Meng Yu Jian, Chih-Ting Chen
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Patent number: 11539091Abstract: A battery module includes a housing, at least one cell stack inside the housing, a tightening assembly and a thermal conductive element. The tightening assembly includes first and second plugin members. The first plugin member has a first stopping portion and a first bolt portion connected with the first stopping portion, and the first bolt portion is tapered from the first stopping portion. The second plugin member has a second stopping portion and a second bolt portion connected with the second stopping portion, and the second bolt portion is tapered from the second stopping portion. The first and second plugin members are detachably inserted into the battery module from two opposing sides of the cell stack. The thermal conductive element tightens the cell stack to the housing.Type: GrantFiled: December 30, 2019Date of Patent: December 27, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chein-Chung Sun, Chih-Ting Chen
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Patent number: 11307671Abstract: A method for recognizing finger gesture, operating by receiving a signal of finger movement from a controller, wherein the controller includes a plurality of finger sensors, and the signal of finger movement is generated by at least one of the finger sensors sensing that at least one of fingers of a user touches or approaches the controller, defining a range of the controller that is touched by the fingers according to the signal of finger movement, and suspending operation of the finger sensors outside of the range, and determining a finger gesture constituted by the fingers according to the signal of finger movement to generate a signal of finger gesture corresponding to the finger gesture.Type: GrantFiled: January 21, 2021Date of Patent: April 19, 2022Assignee: HTC CORPORATIONInventors: Wan-Hsieh Liu, Chou-Wei Wu, Wei-Gang Tsai, Chih-Ting Chen
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Patent number: 11308546Abstract: Systems and methods described herein may process information to perform a checkout of a product, the product comprising an experience, a physical product, and/or a digital product. The product may be fulfilled and a charge associated with the product may be processed after the product has been fulfilled.Type: GrantFiled: November 26, 2019Date of Patent: April 19, 2022Assignee: Traina Interactive Corp.Inventors: Trevor Dow Traina, Joseph Peter Vierra, Jennifer Chih-Ting Chen, Mitchell Paul Galbraith
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Patent number: 11182848Abstract: The systems and methods described herein relate to processing of information, data and automated transaction information involving content and/or experiences. In some exemplary implementations, illustrative automated methods of computerized information processing may involve automated auction processing, sweepstakes processing, handling, fulfillment and/or particular checkout processing of product(s) and/or item(s), including product(s) and/or item(s) such as experiences, physical products, digital products, and/or other offerings by luminaries. According to certain implementations, various product types, flag and/or identifiers are utilized in automated transformations of various purchasable products among the various offerings.Type: GrantFiled: December 9, 2019Date of Patent: November 23, 2021Inventors: Trevor Dow Traina, Joseph Peter Vierra, Jennifer Chih-Ting Chen
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Patent number: 11158910Abstract: The disclosure provides a battery busbar including a conductive sheet, at least two bridge portions and at least two terminal contact portions. The conductive sheet has at least one cavity portion. Each of the at least two bridge portions has a first end and a second end which are opposite to each other, and the first ends of the bridge portions are respectively connected to different sides of the at least one cavity portion. The terminal contact portions are spaced apart from each other and are respectively connected to the second ends of the bridge portions. A width direction is defined to be substantially perpendicular to a line passing through the first end and the second end of one of the at least two bridge portions; along the width direction, a width of the bridge portion is smaller than a width of the terminal contact portion.Type: GrantFiled: October 17, 2018Date of Patent: October 26, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Ting Chen, Chein-Chung Sun
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Publication number: 20210319735Abstract: A driving method comprising: acquiring a first grayscale value of each of the plurality of pixels in a current display frame; acquiring an area identifier of each of the plurality of pixels and a light-intensity of a surrounding environment, the plurality of pixels comprising at least two kinds of area identifiers, each of the plurality of pixels having a light reflectivity, the area identifier of each of the plurality of pixels being set according to the light reflectivity; converting the first grayscale value of each of the plurality of pixels into a second grayscale value according to the area identifier and the light-intensity of the surrounding environment; and driving the display device to display images according to the second grayscale value of each of the plurality of pixels. The driver and the display device are also provided.Type: ApplicationFiled: September 30, 2020Publication date: October 14, 2021Inventors: CHIEN-SHIANG HONG, CHIH-TING CHEN, CHANG ZHU, BAO-WEI DUAN, HONG-YUN WEI, QING-SHAN YAN, GANG LIU
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Patent number: 11115620Abstract: Systems and methods are disclosed for processing transactions and associated dated. In one exemplary implementation, there is provided a method for processing information associated with transactions involving a product, wherein the product may comprise an experience, a physical product, and/or a digital product. Moreover, illustrative methods may include performing processing associated with a plurality of subroutines, such as a first subroutine for handling an experience, a second subroutine for handling a physical and/or a digital product, and/or one more additional subroutines associated with fulfillment.Type: GrantFiled: October 30, 2020Date of Patent: September 7, 2021Assignee: TRAINA INTERACTIVE CORP.Inventors: Trevor Dow Traina, Joseph Peter Vierra, Jennifer Chih-Ting Chen, Mitchell Paul Galbraith
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Publication number: 20210184188Abstract: A battery module includes a housing, at least one cell stack inside the housing, a tightening assembly and a thermal conductive element. The tightening assembly includes first and second plugin members. The first plugin member has a first stopping portion and a first bolt portion connected with the first stopping portion, and the first bolt portion is tapered from the first stopping portion. The second plugin member has a second stopping portion and a second bolt portion connected with the second stopping portion, and the second bolt portion is tapered from the second stopping portion. The first and second plugin members are detachably inserted into the battery module from two opposing sides of the cell stack. The thermal conductive element tightens the cell stack to the housing.Type: ApplicationFiled: December 30, 2019Publication date: June 17, 2021Inventors: CHEIN-CHUNG SUN, CHIH-TING CHEN