Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

Abstract: The present invention discloses an RF element group testing system and method. The method comprises steps: adding an identification feature to a first RF signal, which is output by one of the plurality of tested RF elements, to generate an identification RF signal; synthesizing the identification RF signal and a second RF signal, which is output by each of the rest of the tested RF elements, to generate a corresponding synthesis signal; resolving the synthesis signal into the identification RF signal and the corresponding second RF signal according to the identification feature; restoring the identification RF signal into the first RF signal; and calculating at least one signal-feature parameter of the first RF signal and the second RF signal.

Abstract: A communication device for detecting an object includes a power module, an antenna array, a first sensor pad, a second sensor pad, and a control unit. The antenna array is excited by the power module, and is configured to provide a first beam group and a second beam group. The first sensor pad is disposed adjacent to the first side of the antenna array. A first capacitance is formed between the first sensor pad and the object. The second sensor pad is disposed adjacent to the second side of the antenna array. A second capacitance is formed between the second sensor pad and the object. The control unit controls the power module according to the first capacitance and the second capacitance, so as to selectively apply at least one power backoff operation to the first beam group and/or the second beam group.

Abstract: A system for testing antenna-in-package (AiP) modules and a method for using the same is disclosed. Firstly, AiP modules respectively receive RF signals from a testing transmitting antenna. Then, at least one of the power and the phase of each of the RF signals is adjusted to generate modulated RF amplified signals as recognition tags with difference. The RF amplified signals are received from each control integrated circuit (IC) and the power of the modulated RF amplified signals is summed to generate a net mixed test signal. Finally, the test signal is received and RF properties corresponding to at least one of the power and the phase of each of the RF amplified signals as recognition tags are obtained. The method can simultaneously test a plurality of AiP modules to shorten the test time.

Abstract: A device for testing a group of radio-frequency (RF) chip modules and a method for using the same is disclosed. The device includes a signal analyzer, a power divider, control ICs, a signal controller, and a power combiner. The power divider receives an RF signal and transmits RF input signals to the RF chip modules and the control ICs in response to the RF signal. The signal controller controls each control IC to adjust at least one of the power and the phase of the corresponding RF input signal, thereby generating an RF output signal. The power combiner receives the RF output signal from each control IC to generate a test signal. The signal analyzer receives the test signal and obtains RF properties corresponding to at least one of the power and the phase of each RF output signal.

Abstract: An antenna measurement system is configured to measure a radiation field pattern of an AUT fixed on a reference surface. The antenna measurement system includes an articulated robot, a measurement component, and a processor. The articulated robot is seated on a periphery of the reference surface, with a movable end capable of scanning a short-distance area defined by the reference surface. The measurement component is arranged on the movable end of the articulated robot, and a front surface of the measurement component is a specific geometric surface, which is used to face the antenna for radiation measurement. The processor is coupled to the movable end to control the movable end to drive the measurement component to move relative to the antenna along a predefined scanning path, and keep the specific geometric surface facing the antenna during the movement along the scanning path.

Abstract: An information handling system include a serial peripheral interface (SPI) flash memory device with a BIOS firmware of a platform, and a processor that may build a hand-off block for platform specific override data for the platform, and patch the BIOS base firmware image with the platform specific override data to modify the BIOS base firmware image according to the platform. The processor may also update the BIOS firmware in the SPI flash memory device with the BIOS base firmware image.

Abstract: An antenna measurement system includes an array of antennas, an array of reflectors, and a measurement surface. The array of antennas includes a plurality of antenna elements arranged in a straight line; any two adjacent antenna elements in the above antenna elements are separated by a predetermined distance, and each of the antenna elements in the above antenna elements has a radiator and a feed point. The array of reflectors includes at least one reflector and is arranged in a width direction or a height direction, and the array of reflectors is configured to generate a reflection signal according to a signal sent by the array of antennas. An antenna to be measured is configured to perform a measurement operation on the reflection signal on the measurement surface.

Abstract: Provided are a power supply conversion circuit and a power supply conversion method. The power supply conversion circuit includes a first direct-current conversion circuit connected to an electric load, a secondary transformer coil connected to the first direct-current conversion circuit, and a primary transformer coil coupled to the secondary transformer coil. The primary transformer coil is configured to generate, based on an initial voltage inputted to the primary transformer coil, an electromagnetic field and couple the electromagnetic field to the secondary transformer coil. The secondary transformer coil is configured to generate an induced current by virtue of the electromagnetic field, generate a secondary output voltage based on the induced current, and transmit the secondary output voltage to the first direct-current conversion circuit.

Abstract: A power supply conversion circuit and a charging device are provided. The power supply conversion circuit includes: a first voltage conversion circuit that converts a voltage when the voltage exceeds a preset voltage range and outputs the converted voltage; a post-stage voltage conversion circuit that receives the converted voltage and converts the converted voltage into a target voltage for outputting; and a signal feedback circuit that feeds back a signal to the first voltage conversion circuit according to the target voltage, so that the first voltage conversion circuit is synchronized with the post-stage voltage conversion circuit.

Abstract: Provided by the present disclosure are a power supply circuit and a charging device. The power supply circuit comprises a pulse transformer circuit and a first power supply conversion circuit. The pulse transformer circuit comprises a pulse transformer and a switch control circuit; a primary winding of the pulse transformer is connected to a power supply and is connected to the switch control circuit, and the switch control circuit is used to modulate the voltage on the primary winding into a pulse voltage; and the input terminal of the first power supply conversion circuit is connected to a secondary winding of the pulse transformer, and is used to transform the voltage on the secondary winding of the pulse transformer into a first preset voltage range when the voltage outputted by the secondary winding exceeds the first preset voltage range, and then output the voltage.

Abstract: A power supply device includes a transformer, a first rectifier, a first voltage conversion module, a second voltage conversion module, and a control unit. The first rectifier, connected to a primary winding of the transformer, converts a received alternating-current voltage to a first direct-current voltage. The first voltage conversion module is connected to the first secondary winding of the transformer. The second voltage conversion module is connected to the second secondary winding of the transformer. The control unit, connected to the first voltage conversion module and second voltage conversion module, controls the first voltage conversion module or second voltage conversion module to adjust an output voltage or an output current of the power supply device.

Abstract: A power supply device includes a transformer, a first rectifier, a voltage conversion module, and a control unit. The first rectifier is connected to a primary winding of the transformer, converts a received alternating-current voltage to a first direct-current voltage. The transformer is configured to convert the first direct-current voltage to a second direct-current voltage. The voltage conversion module is connected to the secondary winding of the transformer and configured to convert the second direct-current voltage to output a third direct-current voltage. The control unit, connected to the voltage conversion module, controls the voltage conversion module to adjust an output voltage or an output current of the power supply device.

Abstract: A power supply circuit includes a rectifier circuit, configured to convert an alternating current inputted to the rectifier circuit into a direct current; a primary power supply conversion circuit having an input end connected with an output end of the rectifier circuit, configured to convert an input voltage of the primary power supply conversion circuit which is out of a preset voltage range into an output voltage of the primary power supply conversion circuit within the preset voltage range; and a secondary power supply conversion circuit having an input end connected with an output end of the primary power supply conversion circuit, configured to convert a direct current voltage outputted by the primary power supply conversion circuit into a target direct current voltage. A lower limit of the preset voltage range is greater than a minimum working voltage of the secondary power supply conversion circuit.

Abstract: Disclosed in the embodiments of the present application is a power conversion circuit, comprising a direct current conversion circuit, a pulse width control circuit, and a transformer. The transformer comprises a primary transformer coil and a secondary transformer coil. The direct current conversion circuit is connected to the primary transformer coil, and is used for adjusting an initial voltage inputted to the direct current conversion circuit to a target voltage. The pulse width control circuit is connected to the primary transformer coil, and is used for generating a pulse square wave on the basis of the target voltage. The primary transformer coil is coupled with the secondary transformer coil. The primary transformer coil is used for generating an electromagnetic filed according to the pulse square wave, and coupling the electromagnetic field to the secondary transformer coil so that the secondary transformer coil generates an output voltage.

Abstract: An antenna measurement system is configured to measure a radiation field pattern of an AUT fixed on a reference surface. The antenna measurement system includes an articulated robot, a measurement component, and a processor. The articulated robot is seated on a periphery of the reference surface, with a movable end capable of scanning a short-distance area defined by the reference surface. The measurement component is arranged on the movable end of the articulated robot, and a front surface of the measurement component is a specific geometric surface, which is used to face the antenna for radiation measurement. The processor is coupled to the movable end to control the movable end to drive the measurement component to move relative to the antenna along a predefined scanning path, and keep the specific geometric surface facing the antenna during the movement along the scanning path.

Abstract: An antenna measurement system includes an array of antennas, an array of reflection discs, and a measurement surface. The array of antennas includes a plurality of antenna elements arranged in a straight line; any two adjacent antenna elements in the above antenna elements are separated by a predetermined distance, and each of the antenna elements in the above antenna elements has a radiator and a feed point. The array of reflection discs includes at least one reflection disc and is arranged in a width direction or a height direction, and the array of reflection discs is configured to generate a reflection signal according to a signal sent by the array of antennas. An antenna to be measured is configured to perform a measurement operation on the reflection signal on the measurement surface.

Abstract: An information handling system include a serial peripheral interface (SPI) flash memory device with a BIOS firmware of a platform, and a processor that may build a hand-off block for platform specific override data for the platform, and patch the BIOS base firmware image with the platform specific override data to modify the BIOS base firmware image according to the platform. The processor may also update the BIOS firmware in the SPI flash memory device with the BIOS base firmware image.