Abstract: Method and apparatus for constrained de-blocking filter are disclosed. One method receives input data related to a current block in a current picture at a video encoder side or a video bitstream corresponding to compressed data including the current block in the current picture at a video decoder side, and determines a first boundary associated with the current block, wherein the first boundary corresponds to one vertical boundary or one horizontal boundary of the current block. The method then applies de-blocking process to a reconstructed current block corresponding to the current block to result in a filtered-reconstructed current block, using a plurality of first reference samples at a same side of the first boundary, and replaces a first set of the first reference samples by one or more padding values. The method then generates a filtered decoded picture including the filtered-reconstructed current block.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: A method and apparatus of Inter prediction for video coding using Multi-hypothesis (MH) are disclosed. If an MH mode is used for the current block: at least one MH candidate is derived using reduced reference data by adjusting at least one coding-control setting; an Inter candidate list is generated, where the Inter candidate list comprises said at least one MH candidate; and current motion information associated with the current block is encoded using the Inter candidate list at the video encoder side or the current motion information associated with the current block is decoded at the video decoder side using the Merge candidate list. The coding control setting may correspond to prediction direction setting, filter tap setting, block size of reference block to be fetched, reference picture setting or motion limitation setting.

Abstract: An optoelectronic device includes an off-cut III-V semiconductor substrate, a set of epitaxial layers formed on the off-cut III-V semiconductor substrate, and a horizontal cavity surface-emitting laser (HCSEL) having a laser resonant cavity formed in the set of epitaxial layers. The same or another optoelectronic device includes a semiconductor substrate; a laser, epitaxially grown on the semiconductor substrate and having a laser resonant cavity; a semiconductor device, epitaxially grown on the semiconductor substrate and separated from the laser by a single trench having a first vertical wall abutting the laser and a second vertical wall abutting the semiconductor device; and at least one coating on at least one of the first vertical wall or the second vertical wall. The laser resonant cavity of the laser has a horizontal portion parallel to the semiconductor substrate, and each of the first vertical wall and the second vertical wall is oriented perpendicular to the semiconductor substrate.

Abstract: A base is configured for a bracket. The base includes a hollow body, a plurality of supporting branches, and an illuminating module. The hollow body is connected to the bracket and has a bottom part and a first sidewall. The bottom part has an open hole. The first sidewall has a transparent structure. The plurality of supporting branches is disposed around the hollow body to lift the hollow body. The illuminating module is disposed in the hollow body and includes a sleeve and a base plate. The sleeve has a second sidewall, a first end, and a second end opposite to the first end. The second sidewall has an opening. The position of the opening is corresponding to the transparent structure. The base plate is disposed on the first end. The base plate is provided with a light source. The light source projects light beams toward the second end.

Abstract: An electronic device may include a proximity sensor for detecting whether an external object is in the vicinity of the device. The proximity sensor may be implemented as an optical sensor module having a substrate, a light emitter die mounted on the substrate, a light detector die mounted on the substrate, and a package enclosure housing the light emitter and detector dies within the module. A infrared bandpass filter layer may be formed directly on the light detector die. The light detector die may have sidewalls at least partially covered by an opaque coating. The light detector die may include a highly doped backside reflection absorption layer interposed between an intrinsic absorption layer and an n-type layer within the light detector die. Opaque adhesive material may be used to mount the light detector die onto the surface of the substrate.

Abstract: An optoelectronic device includes an off-cut III-V semiconductor substrate, a set of epitaxial layers formed on the off-cut III-V semiconductor substrate, and a horizontal cavity surface-emitting laser (HCSEL) having a laser resonant cavity formed in the set of epitaxial layers. The same or another optoelectronic device includes a semiconductor substrate; a laser, epitaxially grown on the semiconductor substrate and having a laser resonant cavity; a semiconductor device, epitaxially grown on the semiconductor substrate and separated from the laser by a single trench having a first vertical wall abutting the laser and a second vertical wall abutting the semiconductor device; and at least one coating on at least one of the first vertical wall or the second vertical wall. The laser resonant cavity of the laser has a horizontal portion parallel to the semiconductor substrate, and each of the first vertical wall and the second vertical wall is oriented perpendicular to the semiconductor substrate.

Abstract: An electronic device and a display thereof are provided. The electronic device includes a display and a supporting device. The display includes a display panel, a back cover, and a connecting member. The back cover is disposed on the display panel, and includes an inner surface, an outer surface opposite to the inner surface, and a mounting hole penetrating the inner surface and the outer surface. The inner surface faces the display panel. The mounting hole is disposed on a central region of the back cover. The connecting member is disposed on the inner surface at a position corresponding to the mounting hole, and includes a screw hole. The supporting device includes a detachable fixer connected to the screw hole. Thus, it is convenient for a user to connect the display to different supporting devices.

Abstract: A screen fixing apparatus is provided, for fixing a screen on a support base. The screen fixing apparatus includes a plurality of fixing holes, a plurality of screw hole structures, a plurality of position limiting structures, and a buckling structure. The fixing holes is provided on a back plate of the screen. The screw hole structures is respectively disposed in the fixing holes. The position limiting structures is disposed on the support base, and correspond to the fixing holes. The buckling structure includes a plurality of fasteners, where the fasteners movably extend into the fixing holes, to buckle the position limiting structures to the corresponding fixing holes.

Abstract: An electronic device and a display thereof are provided. The electronic device includes a display and a supporting device. The display includes a display panel, a back cover, and a connecting member. The back cover is disposed on the display panel, and includes an inner surface, an outer surface opposite to the inner surface, and a mounting hole penetrating the inner surface and the outer surface. The inner surface faces the display panel. The mounting hole is disposed on a central region of the back cover. The connecting member is disposed on the inner surface at a position corresponding to the mounting hole, and includes a screw hole. The supporting device includes a detachable fixer connected to the screw hole. Thus, it is convenient for a user to connect the display to different supporting devices.

Abstract: A display device comprises a display unit and a display supporting unit. The display supporting unit includes a base including a body and at least three stands. The bottom of the body includes a center hole. The stands are connected to the body. A support arm, an end of the support arm is sleeved on the base. A light emitting unit is disposed at the support arm adjacent to the base. A light cover is disposed at the support arm between the light emitting unit and the center hole of the body.

Abstract: A display device comprises a display unit and a display supporting unit. The display supporting unit includes a base including a body and at least three stands. The bottom of the body includes a center hole. The stands are connected to the body. A support arm, an end of the support arm is sleeved on the base. A light emitting unit is disposed at the support arm adjacent to the base. A light cover is disposed at the support arm between the light emitting unit and the center hole of the body.

Abstract: A surface-mountable light emitting diode (LED) assembly and a method for making the surface-mountable LED assembly is disclosed. In one embodiment, the surface-mountable LED assembly includes an LED comprising a first layer having a first conductivity type, a second layer having a second conductivity type, and a light emitting layer between the first layer and the second layer. A transparent substrate is bonded to the LED via a transparent bonding layer disposed between the transparent substrate and the LED. In one embodiment, the transparent substrate comprises an amorphous solid, such as glass.

Abstract: The present specification discloses a novel light emitting diode package having a package substrate with a light emitting layer bonded to the package substrate. Unlike conventional LED packages (such as those shown in FIGS. 1 and 2), the chip handling substrate typically located between the package substrate and the light emitting layer is not present. In addition, the LED package of the present specification may comprise an insulating layer formed on the package substrate and the light emitting layer. The LED package of the present specification may further comprise an interconnect metal formed on the insulating layer and the light emitting layer, wherein the interconnect metal electrically connects the light emitting layer to the package substrate.

Abstract: A vertical light emitting diode (LED) assembly with current spreading material over one or more sidewalls of the LED is disclosed. In one embodiment, the vertical LED assembly includes an LED comprising a light emitting layer disposed between a first layer having a first conductivity type and a second layer have a second conductivity type. The vertical LED assembly further includes a substrate bonded to the LED and a first electrode disposed between the substrate and the LED and electrically coupled to the first layer of the LED. A second electrode is formed on a surface of the second layer of the LED opposite the first layer, and electrically coupled to the second layer. In one embodiment, the second electrode extends over one or more sidewalls of the LED. In one embodiment, the second electrode extends laterally beyond one or more sidewalls of the LED.

Abstract: A light source and method for making the same are disclosed. The light source includes a conducting substrate, and a light emitting structure that is divided into segments. The light emitting structure includes a first layer of semiconductor material of a first conductivity type deposited on the substrate, an active layer overlying the first layer, and a second layer of semiconductor material of an opposite conductivity type from the first conductivity type overlying the active layer. A barrier divides the light emitting structure into first and second segments that are electrically isolated from one another. A serial connection electrode connects the first layer in the first segment to the second layer in the second segment. A power contact is electrically connected to the second layer in the first segment, and a second power contact electrically connected to the first layer in the second segment.