Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.

Abstract: According to an exemplary embodiment, a method of forming a MIM capacitor is provided. The method includes the following operations: providing a first metal layer; providing a dielectric layer over the first metal layer; providing a second metal layer over the dielectric layer; etching the second metal layer to define the metal-insulator-metal capacitor; and oxidizing a sidewall of the second metal layer. According to an exemplary embodiment, a MIM capacitor is provided. The MIM capacitor includes a first metal layer; a dielectric layer over the first metal layer; a second metal layer over the dielectric layer; and an oxidized portion in proximity to the second metal layer and made of oxidized second metal layer.

Abstract: According to an exemplary embodiment, a method of forming a MIM capacitor is provided. The method includes the following operations: providing a first metal layer; providing a dielectric layer over the first metal layer; providing a second metal layer over the dielectric layer; etching the second metal layer to define the metal-insulator-metal capacitor; and oxidizing a sidewall of the second metal layer. According to an exemplary embodiment, a MIM capacitor is provided. The MIM capacitor includes a first metal layer; a dielectric layer over the first metal layer; a second metal layer over the dielectric layer; and an oxidized portion in proximity to the second metal layer and made of oxidized second metal layer.

Abstract: A system for localizing an acoustic source is provided. This system includes a microphone apparatus, an audio processing apparatus, a photographing apparatus, and a decision apparatus. The microphone apparatus receives an acoustic signal and generates at least one received audio signal. The audio processing apparatus generates first location information based on the at least one received audio signal. The decision apparatus generates depth information based on at least one image captured by the photographing apparatus. According to the first location information, the at least one captured image, and the depth information, the decision apparatus determines a location corresponding to the source of the acoustic signal.

Abstract: A system for localizing an acoustic source is provided. This system includes a microphone apparatus, an audio processing apparatus, a photographing apparatus, and a decision apparatus. The microphone apparatus receives an acoustic signal and generates at least one received audio signal. The audio processing apparatus generates first location information based on the at least one received audio signal. The decision apparatus generates depth information based on at least one image captured by the photographing apparatus. According to the first location information, the at least one captured image, and the depth information, the decision apparatus determines a location corresponding to the source of the acoustic signal.

Abstract: A HDD tray structure is disclosed. The HDD tray structure includes a tray housing, a flexible printed circuit board (FPC) installed on the tray housing, and at least one indicator, wherein one end of the FPC has a metal pad electrically connected to a connector of a printed circuit board, and the other end of the FPC is in electrical contact with the indicator, so as to control the on/off state of the indicator.

Abstract: An automatic retractable device of a flexible printed circuit board is described. The automatic retractable device of the flexible printed circuit board comprises a bracket, two elastic components and two rollers. By combining the elastic components, the rollers and the flexible printed circuit board, the flexible printed circuit board can revert to an original position after the flexible printed circuit board is used.

Abstract: A removable hard disk module is described. The removable hard disk module has a module sidewall, a first slide rail, and a second slide rail. The first slide rail and the second slide rail are fixed on the module sidewall and the second slide rail is disposed above the first slide rail. The first slide rail is made of a linear material such as a piano wire or the like. The second slide rail is directly formed on the module sidewall or made of the linear material. The removable hard disk module further includes a handle with a withdrawal post to push a support stud on a module fixing device for withdrawing the removable hard disk module from the module fixing device when the handle is opened.

Abstract: A slidable motherboard tray structure is disclosed for holding and moving a motherboard. The slidable motherboard tray structure is featured in using leverage principle to design handle elements pivotally connected to a motherboard tray housing, so that pushing force is generated between the respective handle elements and supporting elements, thereby enabling the motherboard located in the motherboard tray housing to slide to a predetermined position, thus achieving the purposed of automatically positioning and saving force.

Abstract: A HDD tray structure is disclosed. The HDD tray structure includes a tray housing, a flexible printed circuit board (FPC) installed on the tray housing, and at least one indicators, wherein one end of the FPC has a metal pad electrically connected to a connector of a printed circuit board, and the other end of the FPC is in electrical contact with the indicator, so as to control the on/off state of the indicator.

Abstract: An automatic retractable device of a flexible printed circuit board is described. The automatic retractable device of the flexible printed circuit board comprises a bracket, two elastic components and two rollers. By combining the elastic components, the rollers and the flexible printed circuit board, the flexible printed circuit board can revert to an original position after the flexible printed circuit board is used.

Abstract: A removable hard disk module is described. The removable hard disk module has a module sidewall, a first slide rail, and a second slide rail. The first slide rail and the second slide rail are fixed on the module sidewall and the second slide rail is disposed above the first slide rail. The first slide rail is made of a linear material such as a piano wire or the like. The second slide rail is directly formed on the module sidewall or made of the linear material. The removable hard disk module further includes a handle with a withdrawal post to push a support stud on a module fixing device for withdrawing the removable hard disk module from the module fixing device when the handle is opened.