Patents by Inventor Chih-Wei Wei

Chih-Wei Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for flipping semiconductor device
    Patent number: 10651069
    Abstract: An apparatus for transferring a semiconductor device comprises platform comprising a carrier; a positioning unit above the platform and comprising an opening; and an elevating unit connecting the platform and the positioning unit; and a heater.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: May 12, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chih-Wei Wei, Chia-Liang Hsu
  • APPARATUS FOR FLIPPING SEMICONDUCTOR DEVICE
    Publication number: 20170330781
    Abstract: An apparatus for transferring a semiconductor device comprises platform comprising a carrier; a positioning unit above the platform and comprising an opening; and an elevating unit connecting the platform and the positioning unit; and a heater.
    Type: Application
    Filed: August 1, 2017
    Publication date: November 16, 2017
    Inventors: Chih-Wei WEI, Chia-Liang HSU
  • Apparatus for flipping semiconductor device for transferring the semiconductor device between substrates
    Patent number: 9754808
    Abstract: A method for automatically transferring multiple semiconductor devices from a first substrate to a second substrate comprises steps of providing a first substrate on which the semiconductor device is formed, providing a second substrate directly under the first substrate, automatically moving the first substrate toward the second substrate such that the semiconductor devices are close to the second substrate; connecting the semiconductor devices to the second substrate by exerting force to the second substrate, and taking out the semiconductor devices simultaneously from the first substrate.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: September 5, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Chih-Wei Wei, Chia-Liang Hsu
  • Light emitting device having a light extraction layer
    Patent number: 9478698
    Abstract: A light-emitting device is disclosed and comprises: a transparent substrate; a semiconductor light-emitting stack on the transparent substrate, wherein the semiconductor light-emitting stack comprises a first semiconductor layer close to the transparent substrate, a second semiconductor layer away from the transparent substrate, and a light-emitting layer capable of emitting a light disposed between the first semiconductor layer and the second semiconductor layer; and a bonding layer between the transparent substrate and the semiconductor light-emitting stack, wherein the bonding layer has a gradually changed refractive index, and each of critical angles at the bonding layer and the transparent substrate for the light emitted from the light-emitting layer towards the transparent substrate is larger than 35 degrees.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: October 25, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Tsung-Hsien Yang, Tzu-Chieh Hsu, Yi-Ming Chen, Yi-Tang Lai, Jhih-Jheng Yang, Chih-Wei Wei, Ching-Sheng Chen, Shih-I Chen, Chia-Liang Hsu, Ye-Ming Hsu
  • APPARATUS FOR FLIPPING SEMICONDUCTOR DEVICE
    Publication number: 20160086836
    Abstract: A method for automatically transferring multiple semiconductor devices from a first substrate to a second substrate comprises steps of providing a first substrate on which the semiconductor device is formed, providing a second substrate directly under the first substrate, automatically moving the first substrate toward the second substrate such that the semiconductor devices are close to the second substrate; connecting the semiconductor devices to the second substrate by exerting force to the second substrate, and taking out the semiconductor devices simultaneously from the first substrate.
    Type: Application
    Filed: December 7, 2015
    Publication date: March 24, 2016
    Inventors: Chih-Wei WEI, Chia-Liang HSU
  • Apparatus for flipping semiconductor device
    Patent number: 9209058
    Abstract: An apparatus for flipping a semiconductor device comprises a platform comprising a carrier and a roller system, a positioning unit above the platform and comprising a circular opening, and an elevating unit connecting the platform and the positioning unit.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: December 8, 2015
    Assignee: EPISTAR CORPORATION
    Inventors: Chih-Wei Wei, Chia-Liang Hsu
  • LIGHT-EMITTING DEVICE
    Publication number: 20140225138
    Abstract: A light-emitting device is disclosed and comprises: a transparent substrate; a semiconductor light-emitting stack on the transparent substrate, wherein the semiconductor light-emitting stack comprises a first semiconductor layer close to the transparent substrate, a second semiconductor layer away from the transparent substrate, and a light-emitting layer capable of emitting a light disposed between the first semiconductor layer and the second semiconductor layer; and a bonding layer between the transparent substrate and the semiconductor light-emitting stack, wherein the bonding layer has a gradually changed refractive index, and each of critical angles at the bonding layer and the transparent substrate for the light emitted from the light-emitting layer towards the transparent substrate is larger than 35 degrees.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 14, 2014
    Applicant: Epistar Corporation
    Inventors: Tsung-Hsien YANG, Tzu-Chieh HSU, Yi-Ming CHEN, Yi-Tang LAI, Jhih-Jheng YANG, Chih-Wei WEI, Ching-Sheng CHEN, Shih-I CHEN, Chia-Liang HSU, Ye-Ming HSU
  • APPARATUS FOR FLIPPING SEMICONDUCTOR DEVICE
    Publication number: 20140193232
    Abstract: An apparatus for flipping a semiconductor device comprises a platform comprising a carrier and a roller system, a positioning unit above the platform and comprising a circular opening, and an elevating unit connecting the platform and the positioning unit.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 10, 2014
    Applicant: Epistar Corporation
    Inventors: Chih-Wei WEI, Chia-Liang HSU
  • Rail assembly
    Patent number: 8118378
    Abstract: A rail assembly includes an outer rail, a middle rail, an inner rail, and a retrieving unit. The outer rail has an outer rail space for accommodating the middle rail, the inner rail, and the retrieving unit. The middle rail slides in the outer rail space and has a middle rail space for accommodating the inner rail. The inner rail is accommodated in the middle rail and slides in the middle rail space. The retrieving unit is assembled on one end of the outer rail space.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: February 21, 2012
    Assignee: Li-Mei LIN
    Inventors: Chih-Wei Wei, Jui-Lien Yang
  • RAIL ASSEMBLY
    Publication number: 20110033140
    Abstract: A rail assembly includes an outer rail, a middle rail, an inner rail, and a retrieving unit. The outer rail has an outer rail space for accommodating the middle rail, the inner rail, and the retrieving unit. The middle rail slides in the outer rail space and has a middle rail space for accommodating the inner rail. The inner rail is accommodated in the middle rail and slides in the middle rail space. The retrieving unit is assembled on one end of the outer rail space.
    Type: Application
    Filed: October 15, 2010
    Publication date: February 10, 2011
    Inventors: Jui-Lien Yang, Chih-Wei WEI