Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a first portion and a matrix structure. The first portion is connected to a first optical member and corresponds to a first light. The matrix structure is disposed on the first portion and corresponds to a second light, wherein the first light is different from the second light. The matrix structure includes a regularly-arranged structure.

Abstract: An optical system is provided. The optical system includes a light source assembly, a sensing element, and a light guiding element. The light source assembly is used for generating first light and second light. The sensing element is used for sensing third light from the second light reflected by an eye. The light guiding element is used for transporting the first light, the second light, and the third light. Wavelengths of the first light and the second light are different.

Abstract: An optical system includes a sensing assembly and a processing circuit. The sensing assembly is configured to sense light and output a sensing signal accordingly. The processing circuit is configured to analyze the sensing signal. The processing circuit is configured to output a main judgment signal to an external circuit according to the sensing signal.

Abstract: An optical system used for displaying a target image is provided. The optical system includes a light source assembly used for generating an initial image, an optical path adjustment assembly used for transferring the initial image to the target image, a control element used for providing a first control signal to the light source assembly, and a sensing assembly used for providing a sensing signal to the control element. The control element provides the first control signal based on the sensing signal.

Abstract: An optical system is provided. The optical system includes a light source assembly, a light guiding element, and a first optical assembly. The light source assembly is used for generating first light and second light. The light guiding element is used for transporting the first light and the second light. The first optical assembly is disposed between the light guiding element and the light source assembly and used for transporting the first light and the second light. Wavelengths of the first light and the second light are different.

Abstract: An optical system is provided. The optical system includes a light source used for generating light, a fixed portion, an optical assembly having an equivalent focal length to the light and including a first optical element and a second optical element, and a driving assembly used for driving the second optical element to move relative to the first optical element. The driving assembly includes a first driving element used for driving the second optical element to move relative to the first optical element in a first axis, and a second driving element used for driving the second optical element to move relative to the first optical element in a second axis. The first axis and the second axis are different.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: The present disclosure provides an optical element driving mechanism, which includes a movable part, a fixed assembly, and a driving assembly. The movable part is configured to be connected to an optical element. The movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly. The movable part includes a connecting assembly configured to position the optical element.

Abstract: An optical element driving mechanism is provided in the present disclosure. The optical element driving mechanism includes a fixed portion and a movable portion. The movable portion moves relative to the fixed portion. The movable portion includes a first movable assembly and a second movable assembly. The first movable assembly is connected to a first optical element. The second movable assembly is connected to a second optical element. The first movable assembly and the second movable assembly are movable relative to each other.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: An optical system for receiving rays of light is provided in the present disclosure, including a first optical module. The first optical module includes a first optical element and a first optical path-adjusting element. The first optical element has a first optical axis. The rays of light pass through the first optical element in a first direction. The first optical path-adjusting element corresponds to the first optical element. The rays of light are redirected to a second direction by the first optical path-adjusting element. The first optical element and the first optical path-adjusting element are arranged along the first optical axis.

Abstract: An optical system is provided, including a light source, a fixed portion, an optical assembly, and a driving assembly. The light source is used for generating light. The optical assembly has an equivalent focal length to the light. The optical assembly includes a first optical element and a second optical element. The driving assembly is used for driving the second optical element to move relative to the first optical element. When the second optical element is at a first position, the equivalent focal length is a first focal length. When the second optical element is at a second position, the equivalent focal length is a second focal length. The first focal length and the second focal length are different.

Abstract: An optical system is provided. The optical system includes an immovable part, a second movable part, a second drive mechanism, and a second circuit mechanism. The second movable part is used for connecting to a second optical element. The second movable part is movable relative to the immovable part. The second drive mechanism is used for driving the second movable part to move relative to the immovable part. The second circuit mechanism is electrically connected to the second drive mechanism.

Abstract: An optical element driving mechanism is provided, including a movable portion, a fixed portion, a driving assembly, and an assisting assembly. The movable portion is used for connecting to an optical element having a main axis. The movable portion is movable relative to the fixed portion. The driving assembly is disposed on the movable portion or the fixed portion for driving the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion through the assisting assembly.

Abstract: An optical element driving mechanism is provided, including a movable part for connecting an optical element; a fixed part, wherein the movable part can move relative to the fixed part; a driving assembly for driving the movable part to move relative to the fixed part; and a supporting assembly, wherein the movable part can move relative to the fixed part in multiple dimensions via the supporting assembly.

Abstract: An optical system is provided. The optical system includes an image source assembly, a light-guiding element, and a first optical element. The image source assembly is used for providing light. The light-guiding element is used for transmitting the light. The first optical element is disposed between the image source assembly and the light-guiding element and used for adjusting a path of the light.

Abstract: A driving mechanism is provided, including a fixed part, a movable part connected to the fixed part, and a driving assembly configured to impel the movable part relative to the fixed part, so that the driving mechanism is switchable between an open state and a closed state. The fixed part has a plurality of holes. When the driving mechanism is in the open state, light propagates through the driving mechanism via the holes, and when the driving mechanism is in the closed state, the holes are blocked by the movable part.