Patents by Inventor Chih-Yeh Lin

Chih-Yeh Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240179311
    Abstract: A method and apparatus for block partition are disclosed. If a cross-colour component prediction mode is allowed, the luma block and the chroma block are partitioned into one or more luma leaf blocks and chroma leaf blocks. If a cross-colour component prediction mode is allowed, whether to enable an LM (Linear Model) mode for a target chroma leaf block is determined based on a first split type applied to an ancestor chroma node of the target chroma leaf block and a second split type applied to a corresponding ancestor luma node. According to another method, after the luma block and the chroma block are partitioned using different partition tress, determine whether one or more exception conditions to allow an LM for a target chroma leaf block are satisfied when the chroma partition tree uses a different split type, a different partition direction, or both from the luma partition tree.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Inventors: Chia-Ming TSAI, Tzu-Der CHUANG, Chih-Wei HSU, Ching-Yeh CHEN, Zhi-Yi LIN
  • Patent number: 11985324
    Abstract: Exemplary video processing methods and apparatuses for encoding or decoding a current block by inter prediction are disclosed. Input data of a current block is received and partitioned into sub-partitions and motion refinement is independently performed on each sub-partition. A reference block for each sub-partition is obtained from one or more reference pictures according to an initial motion vector (MV). A refined MV for each sub-partition is derived by searching around the initial MV with N-pixel refinement. One or more boundary pixels of the reference block for a sub-partition is padded for motion compensation of the sub-partition. A final predictor for the current block is generated by performing motion compensation for each sub-partition according to its refined MV. The current block is then encoded or decoded according to the final predictor.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: May 14, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Yu-Cheng Lin, Chun-Chia Chen, Chih-Wei Hsu, Ching-Yeh Chen, Tzu-Der Chuang, Yu-Wen Huang
  • Patent number: 11930174
    Abstract: A method and apparatus for block partition are disclosed. If a cross-colour component prediction mode is allowed, the luma block and the chroma block are partitioned into one or more luma leaf blocks and chroma leaf blocks. If a cross-colour component prediction mode is allowed, whether to enable an LM (Linear Model) mode for a target chroma leaf block is determined based on a first split type applied to an ancestor chroma node of the target chroma leaf block and a second split type applied to a corresponding ancestor luma node. According to another method, after the luma block and the chroma block are partitioned using different partition tress, determine whether one or more exception conditions to allow an LM for a target chroma leaf block are satisfied when the chroma partition tree uses a different split type, a different partition direction, or both from the luma partition tree.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: March 12, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chia-Ming Tsai, Tzu-Der Chuang, Chih-Wei Hsu, Ching-Yeh Chen, Zhi-Yi Lin
  • Patent number: 11920190
    Abstract: Methods of amplifying and determining a target nucleotide sequence are provided. The method of amplifying the target nucleotide sequence includes the following steps. A first adaptor and a second adaptor are linked to two ends of a double-stranded nucleic acid molecule with a target nucleotide sequence respectively to form a nucleic acid template, in which the first adaptor includes a Y-form adaptor or a hairpin adaptor and the second adaptor is a hairpin adaptor. Then, a PCR amplification cycle is performed on the nucleic acid template to obtain a PCR amplicon of the target nucleotide sequence.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: March 5, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Pei-Shin Jiang, Jenn-Yeh Fann, Hung-Chi Chien, Yu-Yu Lin, Chih-Lung Lin
  • Publication number: 20210381777
    Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets and a metal mesh. According to the method, the two titanium metal sheets and the metal mesh are subjected to a surface treatment, so that surface of any one of the titanium metal sheets and the metal mesh is modified to form a hydrophilic layer. With these arrangements, the titanium metal material can be freely plastically deformed and possess a capillary force, and the titanium metal sheet can therefore be used in place of the conventional copper sheet to serve as a material for making heat dissipation devices. The heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 9, 2021
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Patent number: 11065671
    Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: July 20, 2021
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Patent number: 11033989
    Abstract: A jig structure for manufacturing heat dissipation unit includes a main body, which internally defines a chamber and has a top forming an upper side thereof. The top defines at least one opening, on which at least one silicon dioxide layer is provided. The chamber is in a vacuum-tight state or maintains a positive pressure inert gas atmosphere therein. The jig structure for manufacturing heat dissipation unit can be used with a laser machining tool to provide a better environment and increased flexibility for laser machining or laser welding in manufacturing a heat dissipation unit.
    Type: Grant
    Filed: July 22, 2018
    Date of Patent: June 15, 2021
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Chih-Yeh Lin
  • Patent number: 11033949
    Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: June 15, 2021
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Patent number: 11029097
    Abstract: A heat dissipation component is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. Such that, the connection and sealing of the welded first and second metal plate bodies can be enhanced.
    Type: Grant
    Filed: July 22, 2018
    Date of Patent: June 8, 2021
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Chih-Yeh Lin
  • Patent number: 10890382
    Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: January 12, 2021
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Publication number: 20200023475
    Abstract: A jig structure for manufacturing heat dissipation unit includes a main body, which internally defines a chamber and has a top forming an upper side thereof. The top defines at least one opening, on which at least one silicon dioxide layer is provided. The chamber is in a vacuum-tight state or maintains a positive pressure inert gas atmosphere therein. The jig structure for manufacturing heat dissipation unit can be used with a laser machining tool to provide a better environment and increased flexibility for laser machining or laser welding in manufacturing a heat dissipation unit.
    Type: Application
    Filed: July 22, 2018
    Publication date: January 23, 2020
    Inventor: Chih-Yeh Lin
  • Publication number: 20200025461
    Abstract: A heat dissipation unit manufacturing method is disclosed. The heat dissipation unit has a main body formed of a first and a second metal plate member, which together define a sealed chamber between them. The chamber has a wick structure and a working fluid provided therein, and a lip portion formed along an outer peripheral edge thereof. The lip portion includes a sinter-welded section perpendicularly connects the first metal plate member to the second metal plate member. In the heat dissipation unit manufacturing method, the first and the second metal plate member are joined along their peripheral edges by lap joint laser welding, in which a laser beam directly perpendicularly passes through the first metal plate member into one third to two thirds of a thickness of the second metal plate member, so that the two metal plate members are more firmly joined to create upgraded vacuum-tightness between them.
    Type: Application
    Filed: July 22, 2018
    Publication date: January 23, 2020
    Inventor: Chih-Yeh Lin
  • Publication number: 20200025457
    Abstract: A heat dissipation component is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. Such that, the connection and sealing of the welded first and second metal plate bodies can be enhanced.
    Type: Application
    Filed: July 22, 2018
    Publication date: January 23, 2020
    Inventor: Chih-Yeh Lin
  • Publication number: 20200023422
    Abstract: A heat dissipation component manufacturing method is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. The heat dissipation component manufacturing method employs fillet welding to directly perpendicularly weld and connect the first and second metal plate bodies so as to enhance the connection and sealing of the welded first and second metal plate bodies.
    Type: Application
    Filed: July 22, 2018
    Publication date: January 23, 2020
    Inventor: Chih-Yeh Lin
  • Publication number: 20180372431
    Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: June 22, 2017
    Publication date: December 27, 2018
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Publication number: 20180369896
    Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: October 25, 2017
    Publication date: December 27, 2018
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Publication number: 20180369971
    Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: June 22, 2017
    Publication date: December 27, 2018
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Publication number: 20180372418
    Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: October 25, 2017
    Publication date: December 27, 2018
    Inventors: Kuei-Feng CHIANG, Chih-Yeh LIN
  • Publication number: 20180361505
    Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.
    Type: Application
    Filed: June 19, 2017
    Publication date: December 20, 2018
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Publication number: 20180361460
    Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.
    Type: Application
    Filed: October 25, 2017
    Publication date: December 20, 2018
    Inventors: Kuei-Feng CHIANG, Chih-Yeh LIN