Patents by Inventor Chih-Yi Chang

Chih-Yi Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7273538
    Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductive composite material having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductive composite material is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal layer to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: September 25, 2007
    Assignee: Protectronics Technology Corporation
    Inventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
  • Publication number: 20070002171
    Abstract: Successive video signals of a first frame and a second frame are received. A signal difference between the video signals is determined and filtered to obtain a luminance difference. A signal sum of the video signals is determined and filtered to obtain a luminance sum. The luminance sum is subtracted from the signal sum to obtain a chrominance difference.
    Type: Application
    Filed: June 30, 2005
    Publication date: January 4, 2007
    Applicants: National Sun Yat-Sen University, Himax Technologies, Inc.
    Inventors: Chua-Chin Wang, Chih-Yi Chang, Fung-Jane Chang
  • Patent number: 6873244
    Abstract: The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: March 29, 2005
    Assignee: Protectronics Technology Corporation
    Inventors: Chien-Shan Huang, Ren-Haur Hwang, Chih-Yi Chang
  • Publication number: 20040069645
    Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductive composite material having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductive composite material is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal layer to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.
    Type: Application
    Filed: September 25, 2003
    Publication date: April 15, 2004
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
  • Patent number: 6686827
    Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: February 3, 2004
    Assignee: Protectronics Technology Corporation
    Inventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
  • Publication number: 20030227368
    Abstract: The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.
    Type: Application
    Filed: May 19, 2003
    Publication date: December 11, 2003
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Chien-Shan Huang, Ren-Haur Hwang, Chih-Yi Chang
  • Publication number: 20030227731
    Abstract: The invention discloses a surface mountable laminated circuit protection device by using a conductive composite material with PTC characteristics. The design of the invention enables the combinational arrangements of a top electrode, a bottom electrode and an insulating material between electrodes without using a conductive mechanism between the top electrode and the bottom electrodes to make a surface mountable polymeric circuit protection device, and can use the current double-layer metal-foil clad substrate as a processing substrate, make the processing of the protection device easier, and have better structural strength and dimension stability.
    Type: Application
    Filed: May 5, 2003
    Publication date: December 11, 2003
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Chien-Shan Huang, Rei-Yian Chen, Chih-Yi Chang
  • Publication number: 20020140540
    Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other.
    Type: Application
    Filed: March 13, 2002
    Publication date: October 3, 2002
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
  • Publication number: 20020058208
    Abstract: The present invention discloses a polymeric circuit protection device and a method of making the same, wherein a highly conductive composite material and a conductive composite material of positive temperature coefficient thermal sensitive resistance are alternately stacked to form a plaque-shaped composite material, then two metal foils are laminated on top surface and bottom surface of the plaque-shaped composite material as electrodes to thereby form a sandwich-like laminated material. Moreover, a cross-linking process is made to cross-link the resin inside the composite material layer. Electrode trenches are etched, and an insulating layer is formed by using green paint in the electrode trenches to isolate different electrodes on the same surface of the device.
    Type: Application
    Filed: October 1, 2001
    Publication date: May 16, 2002
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Chen-Ron Lin, Rei-Yian Chen, Ren-Haur Hwang, Chih-Yi Chang