Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An atomic layer deposition system is provided, including: a main body, a platform, a gas distribution showerhead assembly and a first ring member. The main body defines a reaction chamber, and the platform is located in the reaction chamber. The gas distribution showerhead assembly is disposed on the main body and includes at least one gas inlet channel and at least one gas diffusion plate. Each of the at least one gas diffusion plate includes a plurality of through holes. The first ring member defines a radial direction and is disposed between the platform and the at least one gas diffusion plate. A region of the at least one gas diffusion plate distributed with the plurality of through holes defines an outermost distribution profile. An inner circumferential wall of the first ring member and the outermost distribution profile keep a distance in the radial direction.

Abstract: The disclosure provides an electronic device with a vibration function and a vibration driving method. The electronic device includes a processor and an audio player. The processor outputs an audio signal according to an application program, and executes an audio analysis module to analyze the audio signal. The audio player is coupled to the processor, and receives the audio signal. When the audio analysis module determines that the audio signal has a loudness with an audio frequency lower than a default frequency threshold according to an audio frequency distribution of the audio signal, the audio analysis module outputs a vibration drive signal according to the loudness of the audio signal.

Abstract: Motor control architecture including a travel, a hoist, and a controller is disclosed. The travel disposed on a main rail having an auxiliary-encoder includes a master-driver and a slave-driver for driving two motors. Each motor has a main-encoder. The hoist drives a rope and calculates a rope length continuously. The controller calculates an anti-sway position command based on the rope-length and a position command. The two drivers perform a full closed-loop computation based on a feedback of one main-encoder, a feedback of the auxiliary-encoder, and the anti-sway position command. Wherein, the master-driver controls one motor based on a speed command generated by the full closed-loop computation and the slave-driver follows the speed command and a torque command of the master-driver to drive another motor; or the two drivers compensate the torque command based on an error value between the feedback of one main-encoder and the feedback of the auxiliary-encoder.

Abstract: One or more techniques or systems for mitigating pattern collapse are provided herein. For example, a semiconductor structure for mitigating pattern collapse is formed. In some embodiments, the semiconductor structure includes an extreme low-k (ELK) dielectric region associated with a via or a metal line. For example, a first metal line portion and a second metal line portion are associated with a first lateral location and a second lateral location, respectively. In some embodiments, the first portion is formed based on a first stage of patterning and the second portion is formed based on a second stage of patterning. In this manner, pattern collapse associated with the semiconductor structure is mitigated, for example.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: An image sensing device and a control device of an illumination device thereof are provided. The control device includes a control circuit, an operation circuit, and multiple driving signal generators. The control circuit generates multiple control signals. The operation circuit performs a logical operation on the control signals and an image capturing signal to generate multiple operation results. The driving signal generator respectively provides multiple driving signals to the illumination device according to the operation results, and the driving signals respectively have multiple different output powers.

Abstract: A device includes a substrate, a chalcogenide channel layer, a chalcogenide barrier layer, source/drain contacts, and a gate electrode. The chalcogenide channel layer is over the substrate. The chalcogenide barrier layer is over the chalcogenide channel layer. A dopant concentration of the chalcogenide barrier layer is greater than a dopant concentration of the chalcogenide channel layer. The source/drain contacts are over the chalcogenide channel layer. The gate electrode is over the substrate.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: A wire connection terminal structure includes a case main body. Wire plug-in ports are connected with an electro-conductive module. Arcuate slide guide slots are disposed on the electro-conductive module. Rotary buttons are pivotally disposed in the case main body. Each rotary button has a movable section. A pin is disposed on the movable section. The pin is extended into the slide guide slot. At least one abutment leaf spring is pivotally disposed between the rotary button and the electro-conductive module. When a conductive wire passes through the wire plug-in port into the lateral side of the electro-conductive module, the rotary button can be driven to make the movable section gradually displace from a section of the abutment leaf spring near the pivotally rotational center to an outer lateral side. The abutment leaf spring is pushed to engage with the conductive wire.

Abstract: A rail holding structure of rail terminal includes a case body and a grounding member received in the case body. Two lateral sides of the grounding member are connected in the case body for holding a preset grounding rail. The case body is formed with two lower sections respectively corresponding to two sides of the grounding member. A foot section extends from at least one of the two lower sections. A first connection side and a second connection side are disposed on two lateral sides of the foot section. The first and second connection sides are connected with an outer sidewall of the lower section to form a socket with an open top side. A tool can be extended into the socket to pull and extend the foot section. Via the lower section, the grounding member is driven to detach from the grounding rail or hold the grounding rail.

Abstract: A conductive component structure of rail-type terminal device includes a conductive component disposed in an insulation case body. The conductive component has a first section and a second section connected with the base section. The first section and the second section are respectively formed with a bow portion, a first portion and a second portion. A load arm and an elastic unit assembled with the load arm are disposed on the first section and/or the second section. The elastic unit includes a first elastic section and a second elastic section. The load arm passes through the first elastic section and at least a part of the second elastic section. When the load arm is displaced or moved, the first elastic section and the second elastic section respectively provide tension (or pushback force) and pulling force effect so as to improve the shortcoming of the conventional terminal device.

Abstract: A switch device structure includes an assembly of a main body and an operation body. An electrical connection module and an elastic unit are mounted on the main body. The contact arm of the electrical connection module has a first member and/or a second member with variable arrangement position. According to the position or motion of the operation body, the elastic unit provides an elastic force to push the contact arm of the electrical connection module into a contacting circuit closed state or make the elastic unit separate from the contact arm to form a circuit open state. The arrangement form of the first member and/or the second member of the contact arm of the electrical connection module is variable in accordance with the specification of the switch to achieve NO mode and NC mode.

Abstract: A detachable pushbutton structure includes a case seat which is formed with an internal receiving space for receiving a base seat and a linking member. The base seat has multiple contact legs. The linking member is drivable to control the respective contact legs to form different conducting states. A support seat connected with the linking member and has an internal penetrating hole. A light-emitting member is received in the penetrating hole and connected with the base seat. A connected section is disposed on an outer side of the support seat. A cap assembly can be tightly capped on the penetrating hole of the support seat. A pushbutton is capped on the cap assembly and has a connection section detachably connected with the connected section. A protective ring securely connected between an inner circumference of the receiving space and an outer circumference of the support seat.

Abstract: A conductor assembly structure for a rail-type terminal device includes a conductor assembly and an insulating housing. The conductor assembly structure can reduce manufacturing waste and has a larger contact surface and a better electric conduction effect. The conductor assembly has a base portion that can be pivotally connected with a conductive connector, and a first area and a second area connected to the base portion. The first area and the second area are respectively formed with a bowed portion and a first section and a second section connected to the bowed portion to be snapped onto a grounding mounting rail. At least one of the first area and the second area is provided with a load arm and an elastic member connected to the load arm for increasing the elastic fixing effect (force) of the first section and/or the second section on the grounding mounting rail.

Abstract: A switch seat body structure includes a main body for assembling with a switch component. The main body is composed of a metal head section in the form of a thin sheet structure and a nonmetal belly section. The main body is defined with an axis. The metal head section has a first wall normal to or inclined from the axis and a second wall connected with the first wall and parallel to or inclined from the axis. The first and second walls together define a space. The nonmetal belly section fills the space to connect with entire sections of the first and second walls as an integrated body. The switch seat body assembling structure improves the problems that the processing and manufacturing processes are time-consuming and troublesome and the material cost is higher.

Abstract: The middle section and the tail section are mounted in a wire inlet of a terminal device. The aid sleeve is formed with an internal guide hole. A wire collection section is disposed on one side of the head section distal from the middle section. A recessed guide channel is disposed on one side of the wire collection section proximal to the guide hole. The recessed guide channel includes two lateral outer arched channels with larger curvature radius. The two lateral outer arched channels gradually extend toward a middle bottom face to form an inner arched channel with smaller curvature radius. The recessed guide channel can gradually bind the forked conductor end section of a multi-strand conductive wire, whereby the wire can be quickly plugged into the guide hole.

Abstract: A switch seat body assembling structure includes a main body for assembling with a switch component. The main body is composed of a metal head section in the form of a thin sheet structure and a nonmetal belly section. The main body is defined with an eccentric axis and has a shaft hole positioned on the eccentric axis. The metal head section has a first wall normal to or inclined from the eccentric axis and a second wall connected with the first wall and parallel to or inclined from the eccentric axis. The first and second walls together define a space. The nonmetal belly section fills the space to connect with entire sections of the first and second walls as an integrated body. The switch seat body assembling structure improves the problems that the processing and manufacturing processes are time-consuming and troublesome and the material cost is higher.