Abstract: The present invention provides a titanium copper alloy excellent in strength, electrical conductivity and bendability, characterized in that it consists essentially of 1.5 to 2.3% by mass of Ti, balance Cu and inevitable impurities; said alloy having a 0.2% yield strength of 750 MPa or greater; an electrical conductivity of 17% IACS or greater; and a relationship represented by the formula: MBR/t?0.04×YS?30, in which, YS is a 0.2% yield strength (MPa), and MBR/t is a ratio of a minimum bending radius (MBR; mm) for no cracking when said alloy is subjected to W bend test according to JIS H3130 standard along a transverse direction to a rolling direction, to a thickness (t; mm) of test piece.

Abstract: The present invention provides a titanium-copper alloy having high strength and excellent conductivity as a copper alloy comprising: three to four percent by mass of Ti, residual Cu, and inevitable impurities, wherein the area percentage (S(%)) of a Cu—Ti intermetallic compound phase observed in a section perpendicular to the rolling direction is represented by the following formula: S(%)?8.1×[Ti]?17.7 where [Ti] represents the Ti content in percent by mass. A method for producing the same is also provided.

Abstract: A titanium copper alloy having excellent strength and bendability comprising 1.0 to 4.5% by mass of Ti, the balance of copper and inevitable impurities, characterized in that; diameters of the intermetallic compound particles consisting of Cu and Ti precipitated in the alloy are 3 &mgr;m or less; the average number of the intermetallic compound particles having the diameters of 0.2 to 3 &mgr;m is 700 or less per a cross-sectional area of 1000 &mgr;m2 in a transverse direction to a rolling direction; the average grain size measured in the above cross-sectional area is 10 &mgr;m or less; and a tensile strength is 890 MPa or more.