Patents by Inventor Chih-Lung Wu
Chih-Lung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162064Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.Type: ApplicationFiled: January 23, 2024Publication date: May 16, 2024Inventors: Chih-Hung HUANG, Cheng-Lung WU, Zheng-Lin HE, Yang-Ann CHU, Jiun-Rong PAI, Hsuan LEE
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Publication number: 20240162071Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.Type: ApplicationFiled: January 19, 2024Publication date: May 16, 2024Inventors: Chih-Hung HUANG, Cheng-Lung WU, Yi-Fam SHIU, Yu-Chen CHEN, Yang-Ann CHU, Jiun-Rong PAI
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Patent number: 11975958Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.Type: GrantFiled: October 27, 2022Date of Patent: May 7, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cheng-Han Tsai, Wei-Lung Pan, Chih-Ta Wu, I-hsin Lin
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Patent number: 11967272Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.Type: GrantFiled: December 9, 2022Date of Patent: April 23, 2024Assignees: AUO Corporation, National Cheng-Kung UniversityInventors: Chih-Lung Lin, Yi-Chen Huang, Chih-I Liu, Po-Cheng Lai, Ming-Yang Deng, Chia-En Wu, Ming-Hung Chuang, Chia-Tien Peng
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Patent number: 11954841Abstract: An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device may binarize the image of the portion of the wafer to create a binarized image of the portion of the wafer. The image analysis device may determine a bump pattern, associated with the plurality of wafer bumps, based on the binarized image of the portion of the wafer. The image analysis device may perform a defect analysis of the determined bump pattern. The defect analysis may be associated with detecting regions of the portion of the wafer in which one or more wafer bumps have abnormal bump heights.Type: GrantFiled: June 3, 2022Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Lieh Chen, Cheng-Kang Hu, Cheng-Lung Wu, Jiun-Rong Pai
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Publication number: 20240068124Abstract: An apparatus for producing silicon carbide crystal is provided and includes a composite structure formed by a plurality of graphite layers and silicon carbide seed crystals, wherein a density or thickness of each layer of graphite is gradually adjusted to reduce a difference of a thermal expansion coefficient and Young's modulus between the graphite layers and silicon carbide. The composite structure can be stabilized on a top portion or an upper cover of a crucible made of graphite, thereby preventing the silicon carbide crystal from falling off.Type: ApplicationFiled: August 23, 2023Publication date: February 29, 2024Inventors: CHIH-LUNG LIN, PO-FEI YANG, CHIE-SHENG LIU, CHUNG-HAO LIN, HSIN-CHEN YEH, HAO-WEN WU
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Publication number: 20240067512Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.Type: ApplicationFiled: October 27, 2022Publication date: February 29, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cheng-Han TSAI, Wei-Lung PAN, Chih-Ta WU, I-hsin LIN
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Patent number: 11915954Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.Type: GrantFiled: January 30, 2023Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hung Huang, Cheng-Lung Wu, Zheng-Lin He, Yang-Ann Chu, Jiun-Rong Pai, Hsuan Lee
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Patent number: 11915957Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.Type: GrantFiled: January 7, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
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Publication number: 20240041975Abstract: Compositions for peptide therapeutics of cancer are provided. Methods of using such compositions containing the same are also described, and a step of allowing the peptide therapeutics to coexist with a cancer cell to destroy the cancer cell.Type: ApplicationFiled: May 16, 2023Publication date: February 8, 2024Inventors: Jya-Wei CHENG, Chih-Lung WU, Jing-wen Ding
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Publication number: 20230338463Abstract: The present invention provides a pharmaceutical composition and method for having cytotoxic activity to interact with cancer cells and destroy the cancer cells.Type: ApplicationFiled: June 16, 2023Publication date: October 26, 2023Inventors: JYA-WEI CHENG, CHIH-LUNG WU, YU-HUAN CHEAH, Chun-Yu LIU
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Publication number: 20230340019Abstract: The present invention provides a pharmaceutical composition and method for having cytotoxic activity to interact with cancer cells and destroy the cancer cells.Type: ApplicationFiled: April 22, 2022Publication date: October 26, 2023Inventors: Jya-Wei CHENG, Chih-Lung WU, Yu-Huan CHEAH
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Publication number: 20200039699Abstract: A container has a box and multiple magnetic units. The box has a body and a cap. The body has a body chamber defined in a top surface of the body and a lower peripheral wall formed around the body chamber. The cap is mounted detachably on the top surface of the body and has a cap chamber defined in a bottom surface of the cap facing the body and an upper peripheral wall formed around the cap chamber. The magnetic units are mounted in the box. Each magnetic unit has a lower magnetic element embedded in the lower peripheral wall of the body and an upper magnetic element embedded in the upper peripheral wall of the cap.Type: ApplicationFiled: August 6, 2018Publication date: February 6, 2020Inventor: CHIH-LUNG WU
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Publication number: 20110216555Abstract: A light emitting diode (LED) device applied to a backlight module includes a substrate, a plurality of sub-substrates, a plurality of light emitting chips, and a plurality of package lenses. The sub-substrates are installed on the substrate, and the light emitting chips are installed on the sub-substrates respectively. The package lenses are installed on the light emitting chips respectively, and each package lens is in a solid semi-elliptical shape and includes a long axis and a short axis perpendicular to the long axis.Type: ApplicationFiled: March 5, 2010Publication date: September 8, 2011Inventors: Chih-Hung WEI, Ming-Chang Wu, Chih-Lung Wu, Mei-Jung Chien
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Patent number: 7812624Abstract: A testing method for a LED module and its associated elements includes the steps of: providing a LED module on which a plurality of light-emitting diodes is arranged; providing an integration detector, and mounting it above the LED module; providing an electrically conducting means having a plurality of conductive terminals and an electronic signal connector electrically connected to the conductive terminals; electrically connecting the light-emitting diodes with the conductive terminals; using the electronic signal connector to change the ON/OFF states of the electrical signals of the light-emitting diodes and the conductive terminals; and detecting the photo-electrical properties of each light-emitting diode via the integration detector.Type: GrantFiled: May 26, 2009Date of Patent: October 12, 2010Assignee: High Power Lighting Corp.Inventors: Chih-Hung Wei, Ming-Chang Wu, Chih-Yang Hsu, Chih-Lung Wu, Ding-Yuan Jheng
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Publication number: 20100252852Abstract: An LED includes a cooling block, an LED chip, two insulating layers, two electrically conductive layers and two gold wires. According to the invention, two open trenches are arranged by opening on the cooling block; the LED chip is fixed on a surface of the cooling block; the insulating layers are plated on inner walls of the trenches; the electrically conductive layers are plated on the insulating layers and are insulated from the cooling block; the gold wires are electrically conducted to the electrically conductive layers and the LED chip; since the insulating layers are only plated on parts, where the cooling block contacts the electrically conductive layers, the other parts of the cooling block are exposed, such that the cooling area is increased and the cooling performance is promoted; in addition, the invention is further to provide a cooling block assembly constituted by these cooling blocks.Type: ApplicationFiled: April 6, 2009Publication date: October 7, 2010Inventors: Chih-Hung WEI, Chih-Yang HSU, Ming-Chang Wu, Ming-Yu HSU, Ming-Te KU, Chih-Lung WU
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Publication number: 20090021492Abstract: A light emitting touch pad includes a transparent touch sensor and a light emitting display apparatus. The transparent touch sensor is configured for sensing the position where an object touches the light emitting touch pad. The light emitting display apparatus is disposed at a side of the transparent touch sensor and configured for providing a surface light source emitting light toward the transparent touch sensor.Type: ApplicationFiled: December 30, 2007Publication date: January 22, 2009Inventors: Chih-Lung Wu, Yi-Hsiang Ho