Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.

Abstract: A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

Abstract: A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 ?m or below; and a method of producing the same.

Abstract: A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: Disclosed is a composite material for electrical/electronic component, having a resin coating film formed on at least a part of a metal base, and the residual solvent quantity in the resin coating film being controlled to be 1-30% by mass. The resin coating film is preferably composed of a polyimide or a polyamide-imide.

Abstract: A material for an electrical/electronic part, which has a resin coating directly formed on at least a part of a metal substrate or at least a part of a metal layer provided on the metal substrate, with the resin coating being formed with a resin composition containing at least one selected from the group consisting of a polyamideimide resin and a polyimide resin, each having a structure represented by formula (I) or (II) in the molecular structure: in which R1, R2, R3, and R4 each represent one selected from a hydrogen atom, an alkyl group, a hydroxyl group, a halogen atom, and an alkoxy group.

Abstract: An copper alloy strip material for electrical/electronic components according to the present invention is characterized in that such the copper alloy strip material for electrical/electronic components includes: Ni as between 1.5 mass % and 4.0 mass %; Si as between 0.3 mass % and 1.5 mass %; and the balance being Cu and unavoidable impurities, wherein a mean roughness Ra of a surface roughness is not larger than 0.3 ?m regarding the strip in a direction as right angle to a direction of a rolling therefor, a maximum height Ry thereof is not higher than 3.0 ?m regarding the same therein, and there is positioned a peak position regarding a frequency curve, that represents a concave component of the surface roughness and/or a convex component thereof, at the plus side (the side for the convex component) comparing to an average value of the curve for meaning the surface roughness.

Abstract: The invention provides a composite material for an electric and electronic component, formed by punching, followed by bending. The composite material includes a metallic base material, an insulating film having a substantially single-layer structure provided on at least a part of the metallic base material, and a metal layer provided between the metallic base material and the insulating film so that a peeling width of the insulating film at the end of the material after punching is less than 10 ?m. After bending, the adhesion of the insulating film on the inner side of the bent material is retained. The invention also provides the electric and electronic component using the composite material, and a method for manufacturing the composite material for the electric and electronic component.

Abstract: A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 ?m or below; and a method of producing the same.