Patents by Inventor Chikara Inagaki

Chikara Inagaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each
    Patent number: 8759989
    Abstract: Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy compound of a particular structure, (C) a photopolymerizable compound, and (D) a photoinitiator, wherein (A) the alkali-soluble polyimide has a glass transition temperature of 160° C. or higher. The photosensitive adhesive composition has the ability to form patterns with an alkaline developer, excellent thermocompressibility at a low temperature to an irregular substrate after exposure, and a high adhesive strength even at a high temperature.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: June 24, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Kazuyuki Matsumura, Kanako Sugimoto, Hiroyuki Niwa, Chikara Inagaki
  • PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM, AND SEMICONDUCTOR DEVICE USING EACH
    Publication number: 20130105998
    Abstract: Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy compound of a particular structure, (C) a photopolymerizable compound, and (D) a photoinitiator, wherein (A) the alkali-soluble polyimide has a glass transition temperature of 160° C. or higher. The photosensitive adhesive composition has the ability to form patterns with an alkaline developer, excellent thermocompressibility at a low temperature to an irregular substrate after exposure, and a high adhesive strength even at a high temperature.
    Type: Application
    Filed: June 10, 2011
    Publication date: May 2, 2013
    Applicant: Toray Industries, Inc.
    Inventors: Kazuyuki Matsumura, Kanako Sugimoto, Hiroyuki Niwa, Chikara Inagaki