Patents by Inventor Chil-hoon Lee

Chil-hoon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor package
    Patent number: 9922846
    Abstract: A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip is mounted in the semiconductor chip mounting region. A dam surrounding the semiconductor chip is formed. The formation of the dam includes depositing a first solution having a temperature below a set first temperature. A region under the semiconductor chip and a region defined by the dam are filled with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: March 20, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seong-chan Han, Young-rock Lee, Chang-kun Kang, Chil-hoon Lee, Han-ju Kim
  • METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
    Publication number: 20170103906
    Abstract: A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip is mounted in the semiconductor chip mounting region. A dam surrounding the semiconductor chip is formed. The formation of the dam includes depositing a first solution having a temperature below a set first temperature. A region under the semiconductor chip and a region defined by the dam are filled with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature.
    Type: Application
    Filed: October 6, 2016
    Publication date: April 13, 2017
    Inventors: Seong-chan Han, Young-rock Lee, Chang-kun Kang, Chil-hoon Lee, Han-ju Kim