Abstract: A memory module includes a plurality of semiconductor memory devices and a circuit board. The circuit board is electrically connected to the plurality of semiconductor memory devices, and a signal line is disposed in the outermost layer of the circuit board. An electrical reference for the signal line is provided in a layer of the circuit board that is not adjacent to the outermost layer. Accordingly, an impedance of the signal line may be increased, and signal integrity of a signal transmitted through the signal line may be improved.

Abstract: A memory module includes a plurality of semiconductor memory devices and a circuit board. The circuit board is electrically connected to the plurality of semiconductor memory devices, and a signal line is disposed in the outermost layer of the circuit board. An electrical reference for the signal line is provided in a layer of the circuit board that is not adjacent to the outermost layer. Accordingly, an impedance of the signal line may be increased, and signal integrity of a signal transmitted through the signal line may be improved.

Abstract: A memory module includes a first memory group including a plurality of memory devices, a second memory group including a less number of memory devices with respect to the memory devices in the first memory group, a register configured to provide a command/address signal to the first memory group and a delayed command/address signal to the second memory group, a first signal line configured to transfer the command/address signal to the first memory group, and a second signal line configured to transfer the delayed command/address signal to the second memory group.

Abstract: The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sodes which same signal applying balls of the memory chips contact in the mirror form, wherein a via is formed at a location close to the same signal applying contact pad of one side among the same signal applying contact pads arranged on both sides in the mirror form, the via connecting the other side to the signal line of one side, and a signal transmitted from the other side is connected to a contact junction, the contact junction is connected to the same signal applying contact pad of the other side, the contact junction is connected to the via of the other side, and the via of one side is connected to the same signal applying contact pad of one side.

Abstract: A memory module includes a first memory group including a plurality of memory devices, a second memory group including a less number of memory devices with respect to the memory devices in the first memory group, a register configured to provide a command/address signal to the first memory group and a delayed command/address signal to the second memory group, a first signal line configured to transfer the command/address signal to the first memory group, and a second signal line configured to transfer the delayed command/address signal to the second memory group.

Abstract: In a memory module and a signal line arrangement method thereof, the memory module comprises: memory chips mounted on both sides of the module in a mirrored configuration; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sides in contact with same signal applying balls of the memory chips in the mirrored configuration, the PCB including a via at a location proximal to the same signal applying contact pad of one side of the PCB among the same signal applying contact pads arranged on both sides in the mirrored configuration, the via connecting an other side of the PCB to the one side of the PCB, and a contact junction connected to the same signal applying contact pad of the other side of the PCB, the contact junction being connected to the via of the other side of the PCB, and the via of the one side of the PCB being connected to the same signal applying contact pad of the one side of the PCB, the contact junction connected to a signal terminal from the other side of t

Abstract: The present invention discloses a memory module and a method of arranging a signal line of the same.

Abstract: The present invention discloses a memory module and a method of arranging a signal line of the same.

Abstract: A memory system includes a memory controller, a memory bus connected to the memory controller, and a plurality of memory modules connected along the memory bus, where each of the memory modules includes a plurality of memory devices. The system also includes a dummy stub or a dummy module connected to the memory bus between the memory controller and the memory module closest to the memory controller among the plurality of memory modules. The dummy stub or dummy module improves a signal integrity of at least the memory module closest to the memory controller.