Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.

Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: A method of forming a mask for optically transferring a lithographic pattern having a plurality of isolated elements onto a semiconductor substrate, wherein spacing between these isolated elements is controlled according to a given pitch, the method comprising: disposing a plurality of assist features around each of the plurality of isolated elements, each assist feature near to a corner of one isolated element, each assist feature having a width, a length, a first separation parameter defining a distance between individual assist features, and a second separation parameter defining a distance between each of the plurality of assist features and each corresponding adjacent isolated element in the plurality of isolated elements; determining optimized values of the width, the length, the first separation parameter, and the second separation parameter; and setting an assist feature rule according to the given pitch and the optimized values.

Abstract: A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.

Abstract: An oriented assist feature is described that permits transferring of a lithographic pattern corresponding to an integrated circuit from a mask onto a semiconductor substrate. The oriented assist feature does not exhibit a forbidden pitch phenomenon, thereby providing a wide photo process window for a hole pattern.

Abstract: An oriented assist feature is described that permits transferring of a lithographic pattern corresponding to an integrated circuit from a mask onto a semiconductor substrate. The oriented assist feature does not exhibit a forbidden pitch phenomenon, thereby providing a wide photo process window for a hole pattern.

Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.

Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Abstract: A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.

Abstract: A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

Abstract: A manually operated switch for a faucet has a body, an inner pipe, a switching valve assembly. The body is hollow. The inner pipe is located inside of the body and has a flowing way. The flowing way is formed through the inner pipe. The switching valve assembly is slidably mounted inside of the flowing way of the inner pipe and extends out the body. When the switching valve assembly closes the flowing way of the inner pipe, the water pressure will keep the switching valve assembly closed. After the water pressure applied to the switching valve assembly is released or dismissed, the switching valve assembly returns back to an original position so that the flowing way is opened. The opening and closing flowing way can manually control the way of water flowing so that a user may not be scared or burned by the water.

Abstract: A liquid crystal display module includes a substrate, one or more first leads, one or more shorting bars. one or more second leads and one or more cutting traces. The first leads and the shorting bars are disposed over the substrate. The shorting bars are adjacent to the first leads and electrically connected to the first leads via one or more connecting lines. The second leads are mounted with the first leads respectively and are electrically connected to the corresponding first leads. The cutting traces are used for electrically disconnecting the first leads from the shorting bars. A laser beam is used to cut off the connecting lines along the cutting trace after the liquid crystal display module has been tested, so that the short bar is electrically disconnected from the first leads, and a disconnecting point is formed on the intersection of the each cutting trace and connecting line.

Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Abstract: A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

Abstract: A bump layout on the active region of a driver IC for increasing overall bump count. The layout fits IC packages that have a narrow and long body profile. Bumps are positioned close to the long side and central regions of the active region so that low marking pressure on the shorter sides of the package during chip-glass bondage is avoided. Dummy bumps may also be positioned close to the shorter sides of the package so that pressure distribution is optimized during chip-glass bondage.

Abstract: A substrate is provided, and a surface treating process is performed on the surface of the substrate. Then, a plurality of photo resist patterns are formed on the substrate, and a flow process is performed so that each photo resist pattern has a microlens surface. Finally, a metal layer is formed on the photo resist patterns so that the bottom surface of the metal layer has a plurality of patterns complementary to the photo resist patterns.

Abstract: First, a substrate is provided, and a half-tone mask is employed to perform an exposing and developing process for forming a plurality of photoresist patterns having different thickness. Then, a flow process is performed to heat the photoresist patterns so that each photoresist pattern has a microlens surface. Following that, a metal plate is formed on the substrate for obtaining a plurality of patterns, which are opposite to the plurality of photoresist patterns, on the bottom surface. Finally, the metal plate is removed from the substrate, and combined with an insert mold.

Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.