Abstract: Some embodiments relate to a semiconductor structure. The semiconductor structure includes a first substrate including a first plurality of conductive pads that are laterally spaced apart from one another on the first substrate. A first plurality of conductive bumps are disposed on the first plurality of conductive pads, respectively. A multi-tiered solder-resist structure is disposed on the first substrate and arranged between the first plurality of conductive pads. The multi-tiered solder-resist structure has different widths at a different heights over the first substrate and contacts sidewalls of the first plurality of conductive bumps to separate the first plurality of conductive bumps from one another.

Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A coffee percolator is provided having a funnel-shaped main body made of a thin stainless steel sheet and an inner layer component, wherein the sidewall of the main body is formed with a plurality of holes by means of etching technology; the inner layer component is fixed on the inner side of the sidewall of the main body. The inner layer component is provided with second holes with smaller diameter than that of the first holes provided on the sidewall of the main body. Through the double-layer wall structure made up of the inner layer component and main body side wall for the liquid to pass through and the fine second holes provided on the inner layer component, coffee grounds and foreign bodies can be completely prevented from passing through the sidewall when preparing and filtering coffee, so that the coffee prepared by the user has better purity and taste.

Abstract: An automatic printing apparatus is used to print indentifying words on a packing case that is carried on a conveyer belt unit and includes a sensor, a lower support unit, a lengthwise-position adjustment device, an upper support unit, a height adjustment device, a feeding hydraulic cylinder, a printer support unit, a contact switch, a printing hydraulic cylinder and a printer member. The printer member is carried on the printer support unit. The printer support unit is carried on the upper support unit. The upper support unit is carried on the lower support unit. The lengthwise-position adjustment device can be actuated to adjust the position of the lower support unit along the length of the conveyer belt unit. The height adjustment device can be actuated to adjust the vertical position of the upper support unit relative to the lower support unit.

Abstract: This invention relates to an electric climbing training device for use as an indoor exercise device. The electric climbing training device includes a portable support body, which has a front inclined climbing portion, and an endless transmission member operated by a driving unit and carrying a plurality of foot boards to move along an endless rail formed in the portable support body. A handle is provided in the front climbing portion. An electric control unit is mounted to the support body to control movement of the foot boards.

Abstract: A combined cover and strainer assembly for a coffee/tea pot includes a substantially dome-shaped hollow outer cover, a connecting rod slidably passing through the outer cover, a handle connected to one end of the connecting rod, a substantially dome-shaped perforated casing having an open end and an apex with an opening for receiving the second end of the connecting rod, and a perforated strainer disposed at the open end of the perforated casing. The perforated casing has an outwardly and radially extending flange with a hook section formed at the open end of the same. The second end of the connecting rod is fixed to the perforated casing. The strainer is rotatably hinged to the perforated casing and has a side releasably engaged with the hook section when the strainer covers the open end of the perforated casing to prevent the untimely separation of the strainer from the perforated casing. The handle has a flat top surface so that the combined assembly can be placed on top of a table during replenishment.