Patents by Inventor Chin-Cheng Lee

Chin-Cheng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152671
    Abstract: A violation checking method includes generating a violation log report for a design, classifying violation logs in the violation log report into high-risk logs and low-risk logs by a machine learning model, reviewing the high-risk logs, and modifying the design if at least one bug is identified in the high-risk logs.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chi-Ming Lee, Chung-An Wang, Cheok Yan Goh, Chia-Cheng Tsai, Chien-Hsin Yeh, Chia-Shun Yeh, Chin-Tang Lai
  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240094626
    Abstract: A pellicle for an extreme ultraviolet (EUV) photomask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, and each of the plurality of nanotubes is covered by a coating layer containing Si and one or more metal elements.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 21, 2024
    Inventors: Pei-Cheng HSU, Wei-Hao LEE, Huan-Ling LEE, Hsin-Chang LEE, Chin-Hsiang LIN
  • Publication number: 20240084447
    Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20240081157
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11920238
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20240074328
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 9975236
    Abstract: A trigger assembly used in a pneumatic tool that includes a valve unit removably blocking a flow channel, includes a driving member, a trigger member and a positioning unit. The driving member is movable for actuating the valve unit to gradually unblock the flow channel. The trigger member is pressable to move relative to a tool body of the pneumatic tool and the driving member to drive movement of the driving member. The positioning unit includes first and second positioning structures inter-engaged for providing an indication when the trigger member is pressed to move the driving member to a certain position.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: May 22, 2018
    Assignee: Basso Industry Corp.
    Inventors: Chiang Hua, Chin-Cheng Lee
  • Publication number: 20150190917
    Abstract: A trigger assembly used in a pneumatic tool that includes a valve unit blocking removably a flow channel, includes a driving member, a trigger member and a positioning unit. The driving member is movable for actuating the valve unit to gradually unblock the flow channel. The trigger member is pressable to move relative to a tool body of the pneumatic tool and the driving member to drive movement of the driving member. The positioning unit includes first and second positioning structures interengaged for providing an indication when the trigger member is pressed to move the driving member to a certain position.
    Type: Application
    Filed: January 7, 2015
    Publication date: July 9, 2015
    Inventors: Chiang Hua, Chin-Cheng Lee
  • Patent number: 8191244
    Abstract: A fabricating method of a circuit board including the following steps. First, a liquid material is adhered between a first substrate and a second substrate by using an atmospheric pressure difference. Then, a plurality of conductive columns are formed in the first substrate and the second substrate. Next, a patterning process is performed, so as to form two circuit layers. Next, two lamination structures are formed respectively on the circuit layers. Then, the first substrate and the second substrate are separated. Finally, another patterning process is performed, so as to finish the fabrication of the circuit board.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: June 5, 2012
    Assignee: Unimicron Technology Corp.
    Inventors: Shang-Lin Sung, Shih-Chiehmr Chang, Chao-Sheng Chiu, Chin-Cheng Lee
  • Publication number: 20120006478
    Abstract: A fabricating method of a circuit board including the following steps. First, a liquid material is adhered between a first substrate and a second substrate by using an atmospheric pressure difference. Then, a plurality of conductive columns are formed in the first substrate and the second substrate. Next, a patterning process is performed, so as to form two circuit layers. Next, two lamination structures are formed respectively on the circuit layers. Then, the first substrate and the second substrate are separated. Finally, another patterning process is performed, so as to finish the fabrication of the circuit board.
    Type: Application
    Filed: September 9, 2010
    Publication date: January 12, 2012
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventors: SHANG-LIN SUNG, SHIH-CHIEHMR CHANG, CHAO-SHENG CHIU, CHIN-CHENG LEE
  • Patent number: 7748955
    Abstract: A vibration-isolating fixing mechanism for a fan frame. The mechanism, configured to couple the fan frame to first fastening portions of a casing, includes: coupling portions protrudingly disposed on two installation surfaces of the fan frame; positioning brackets each having second fastening portions and through-holes; resilient elements each circumferentially disposed between each coupling portion and each through-hole and extending to two through-hole-corresponding sides of each positioning bracket; and coupling elements coupled to the coupling portions respectively, positioned on one side of each resilient element facing away from the fan frame, and configured to position the positioning brackets and the fan frame relative to one another. Axial vibration isolation is achieved by insertion of the coupling portions into the through-holes circumferentially disposed with the resilient elements and by resilient contact between each resilient element and each coupling element.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: July 6, 2010
    Assignee: Inventec Corporation
    Inventor: Chin-Cheng Lee
  • Patent number: 7713654
    Abstract: A fixing structure of battery module for fixing a battery module in an electronic device is proposed. The fixing structure includes a first lid and a second lid, which are formed on a surface of the electronic device, wherein the first lid is formed with a first fastening part, and the second lid is formed with a second fastening part for being engaged with the first fastening part; a mounting cavity formed in the electronic device at a position corresponding to the second lid; a first locking part formed on the second lid; and a second locking part formed on the battery module, for being coupled to the first locking part so as to fasten the battery module to the second lid. When the first and second lids are coupled together by the first and second fastening parts, the battery module fastened to the second lid is received in the mounting cavity and fixed in the electronic device.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: May 11, 2010
    Assignee: Inventec Corporation
    Inventors: Cheng-Chung Hsu, Chin-Cheng Lee
  • Publication number: 20080232062
    Abstract: A vibration-isolating fixing mechanism for a fan frame. The mechanism, configured to couple the fan frame to first fastening portions of a casing, includes: coupling portions protrudingly disposed on two installation surfaces of the fan frame; positioning brackets each having second fastening portions and through-holes; resilient elements each circumferentially disposed between each coupling portion and each through-hole and extending to two through-hole-corresponding sides of each positioning bracket; and coupling elements coupled to the coupling portions respectively, positioned on one side of each resilient element facing away from the fan frame, and configured to position the positioning brackets and the fan frame relative to one another. Axial vibration isolation is achieved by insertion of the coupling portions into the through-holes circumferentially disposed with the resilient elements and by resilient contact between each resilient element and each coupling element.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 25, 2008
    Applicant: Inventec Corporation
    Inventor: Chin-Cheng Lee
  • Publication number: 20070128506
    Abstract: A fixing structure of battery module for fixing a battery module in an electronic device is proposed. The fixing structure includes a first lid and a second lid, which are formed on a surface of the electronic device, wherein the first lid is formed with a first fastening part, and the second lid is formed with a second fastening part for being engaged with the first fastening part; a mounting cavity formed in the electronic device at a position corresponding to the second lid; a first locking part formed on the second lid; and a second locking part formed on the battery module, for being coupled to the first locking part so as to fasten the battery module to the second lid. When the first and second lids are coupled together by the first and second fastening parts, the battery module fastened to the second lid is received in the mounting cavity and fixed in the electronic device.
    Type: Application
    Filed: March 30, 2006
    Publication date: June 7, 2007
    Applicant: Inventec Corporation
    Inventors: Cheng-Chung Hsu, Chin-Cheng Lee