Patents by Inventor Chin-Cheng Nee

Chin-Cheng Nee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4869971
    Abstract: A process for electrodepositing a multilayer deposit on an electrically-conductive substrate from a single electrodeposition bath yields a deposit which includes a sequence of essentially repeating groups of layers. Each group of layers comprises a layer of a first electrodeposited material and a layer of a second electrodeposited layer. The process includes the steps of immersing the substrate in an electrodeposition bath and repeatedly passing a charge burst of a first electric current and a second electric current through the electrodeposition bath to the substrate. The first electric current is a pulsed current with a first pulsed-on/off waveform and a first peak current density which is effective to electrodeposit the first electrodeposited material. The second electric current has a second waveform and a second current density which is effective to electrodeposit the second electrodeposited material.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: September 26, 1989
    Inventors: Chin-Cheng Nee, Rolf Weil