Patents by Inventor Chin-Chih Tsai

Chin-Chih Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996630
    Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, and a nonconductive support element. The first radiation element is coupled to a first grounding point on the ground element. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the second radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The second radiation element is at least partially surrounded by the first radiation element. The third radiation element is at least partially surrounded by the second radiation element.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: May 28, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yu-Chen Zhao, Chung-Ting Hung, Chin-Lung Tsai, Ying-Cong Deng, Kuan-Hsien Lee, Yi-Chih Lo, Kai-Hsiang Chang, Chun-I Cheng, Yan-Cheng Huang
  • Patent number: 11996375
    Abstract: An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The active connectors and the dummy connectors are disposed over the interconnection structure. The active connectors are electrically connected to the interconnection structure, and the dummy connectors are electrically insulated from the interconnection structure.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chao Mao, Chin-Chuan Chang, Szu-Wei Lu, Kun-Tong Tsai, Hung-Chih Chen
  • Patent number: 10096445
    Abstract: An ion source apparatus has a body, a heat dissipating base, at least two supporting shafts, a guiding block, and a shunt. The body has a holding chamber formed inside the body. The heat dissipating base is located in the holding chamber of the body. The at least two supporting shafts are mounted through the heat dissipating base. The guiding block is mounted on the at least two supporting shafts, and is a hollow circular block. The shunt is located at a center of a top surface of the heat dissipating base, and is located below the mounting hole of the guiding block.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: October 9, 2018
    Assignee: BOHHEN OPTRONICS CO., LTD.
    Inventors: Shih-Tse Wang, Chin-Chih Tsai, Tsai-Cheng Wang