Abstract: A fog discrimination method is disclosed, including a capturing step, a calculation step, and a determining step. The capturing step includes capturing a sub-image of an image. The sub-image includes a light shield body image and a light shield stripe image. The calculation step includes calculating a maximum average grayscale value and a minimum average grayscale value of the sub-image; and calculating a fog function. The fog function is a function of the maximum average grayscale value and the minimum average grayscale value. The determining step includes determining whether the fog function is greater than or less than a threshold; and determining as being fogged when the fog function is less than the threshold.

Abstract: A wireless communication device and a moving method thereof are provided. The moving method is adapted for the wireless communication device moving in a zone. While moving in the zone, a wireless signal status of a signal source device is measured. The zone is divided into multiple sub-blocks, and a spatial weight parameter corresponding to each of the sub-blocks is determined according to the wireless signal state of the signal source device. In response to a user equipment being connected to the wireless communication device, a preferred sub-block is selected from the sub-blocks according to user context information of the user equipment and the spatial weight parameter corresponding to each of the sub-blocks. The wireless communication device moves into the preferred sub-block to perform wireless communication with the signal source device and the user equipment within the preferred sub-block.

Abstract: An oral cavity scanning device is provided in the invention. The oral cavity scanning device includes an image capturing unit, an IMU circuit and a processing unit. The image capturing unit obtains a first image and a second image. The IMU circuit obtains IMU information corresponding to the first image and the second image. The processing unit obtains a distance value between the first image and the second image. The processing unit uses a contour algorithm to obtain a first contour and a second contour. The processing unit obtains first sampling points according to the first contour and second sampling points according to the second contour. The processing unit uses a feature algorithm to find relative feature points between the first sampling points and the second sampling points. The processing unit uses a depth information algorithm to obtain the depth information of each feature point.

Abstract: A method includes: obtaining impact values for characteristic conditions; selecting training data subsets respectively from training data sets according to the impact values; obtaining a candidate model and an evaluation value based on the training data subsets; supplementing the training data subsets according to the impact values; obtaining another candidate model and another evaluation value based on training data subsets thus supplemented; repeating the step of supplementing the training data subset, and the step of obtaining another candidate model and another evaluation value based on the training data subsets thus supplemented; and selecting one of the candidate models as a prediction model based on the evaluation values.

Abstract: Provided is a nanogel exhibiting anticoagulation and antioxidation activities, including a graphene-like nanosheet and a polysaccharide, which are complexed to form a cross-linked supramolecular structure. Also provided is a method of preparing the nanogel, including carbonizing the polysaccharide by dry heating. By the heating process, at least a portion of the polysaccharide is conversed into the graphene-like nanosheet, thereby forming a graphene-like nanosheet-embedded phenolic-polysaccharide nanogel that has exceptional polyphenolic structure and high binding affinity toward thrombin. Further provided is a method of preventing or treating a disease or a condition susceptible to amelioration by anticoagulants or antioxidants by using the nanogel.

Abstract: Provided is a nanogel exhibiting anticoagulation and antioxidation activities, including a graphene-like nanosheet and a polysaccharide, which are complexed to form a cross-linked supramolecular structure. Also provided is a method of preparing the nanogel, including carbonizing the polysaccharide by dry heating. By the heating process, at least a portion of the polysaccharide is conversed into the graphene-like nanosheet, thereby forming a graphene-like nanosheet-embedded phenolic-polysaccharide nanogel that has exceptional polyphenolic structure and high binding affinity toward thrombin. Further provided is a method of preventing or treating a disease or a condition susceptible to amelioration by anticoagulants or antioxidants by using the nanogel.

Abstract: A chip package includes a chip structure, a molding material, a conductive layer, a redistribution layer, and a passivation layer. The chip structure has a front surface, a rear surface, a sidewall, a sensing area, and a conductive pad. The molding material covers the rear surface and the sidewall. The conductive layer extends form the conductive pad to the molding material located on the sidewall. The redistribution layer extends form the molding material that is located on the rear surface to the molding material that is located on the sidewall. The redistribution layer is in electrical contact with an end of the conductive layer facing away from the conductive pad. The passivation layer is located on the molding material and the redistribution layer. The passivation layer has an opening, and a portion of the redistribution layer is located in the opening.

Abstract: A chip package includes a sensing chip, a computing chip, and a protective layer annularly surrounding the sensing chip and the computing chip. The sensing chip has a first conductive pad, a sensing element, a first surface and a second surface opposite to each other. And the sensing element is disposed on the first surface. The computing chip has a second conductive pad and a computing element. The protective layer is formed by lamination and at least exposes the sensing element. The chip package further includes a conductive layer underneath the second surface of the sensing chip and extending to be in contact with the first conductive pad and the second conductive pad.

Abstract: A chip package includes a chip structure, a molding material, a conductive layer, a redistribution layer, and a passivation layer. The chip structure has a front surface, a rear surface, a sidewall, a sensing area, and a conductive pad. The molding material covers the rear surface and the sidewall. The conductive layer extends form the conductive pad to the molding material located on the sidewall. The redistribution layer extends form the molding material that is located on the rear surface to the molding material that is located on the sidewall. The redistribution layer is in electrical contact with an end of the conductive layer facing away from the conductive pad. The passivation layer is located on the molding material and the redistribution layer. The passivation layer has an opening, and a portion of the redistribution layer is located in the opening.

Abstract: A chip package includes a sensing chip, a computing chip, and a protective layer annularly surrounding the sensing chip and the computing chip. The sensing chip has a first conductive pad, a sensing element, a first surface and a second surface opposite to each other. And the sensing element is disposed on the first surface. The computing chip has a second conductive pad and a computing element. The protective layer is formed by lamination and at least exposes the sensing element. The chip package further includes a conductive layer underneath the second surface of the sensing chip and extending to be in contact with the first conductive pad and the second conductive pad.

Abstract: A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.

Abstract: A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material having a resistivity smaller than 102 ?m. The conducting glue is applied on the connection zone of the substrate and sandwiched between the cap and the substrate for electrically connecting the cap with the substrate.

Abstract: A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.

Abstract: A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material having a resistivity smaller than 102 ?m. The conducting glue is applied on the connection zone of the substrate and sandwiched between the cap and the substrate for electrically connecting the cap with the substrate.

Abstract: A cap package includes a substrate on which a chip is mounted. A cap is made of silicon doped with non-metal dopant. The cap is capped on the substrate to define with the substrate an accommodation chamber that receives the chip inside. The chip is electrically connected with a conducting portion of the substrate which is grounded.

Abstract: A cap package for MEMS includes a substrate, a cap made of a carbon added plastic material and capped on the substrate to define with the substrate an accommodation chamber, and a chip mounted on the substrate and located inside the accommodation chamber. The substrate has a conducting portion electrically connected with the cap and grounded.

Abstract: A MEMS module package includes a housing with an accommodation chamber and an opening in communication with the accommodation chamber. The housing has a substrate and an electrically insulative cap capped on the substrate and defining with the substrate the accommodation chamber therebetween. A micro electro-mechanical chip is installed on the substrate and located inside the accommodation chamber. The micro electro-mechanical chip has an action zone corresponding to the opening of the housing. A first conducting layer and a second conducting layer are respectively disposed on an inner surface and an outer surface of the electrically insulative cap.

Abstract: A kind of microphone package structure is disclosed. It comprises at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bounding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.

Abstract: An acoustic head structure for a microphone is disclosed. It comprises a substrate, a sound-processing unit and an upper cap. The upper cap has a plurality of acoustic holes that are through-holes arranged about the upper lid. The position and shape of the acoustic holes can prevent foreign matter like dust from falling into the acoustic head structure.

Abstract: A method for minimizing signal delays caused by mismatch in length of the inner leads of a package lead frame. This is accomplished by the provision of a unique conductive trace pattern formed preferably on the top surface or else on a lower surface of an electrically-insulated, heat-conducting printed circuit board. The conductive trace pattern includes a plurality of U-shaped metallized traces. Each of the plurality of U-shaped traces have a varying length so that certain ones adjacent the inner leads at the center of the package lead frame are longer than certain ones adjacent the inner leads at the corners of the package lead frame. The conductive trace pattern and the outer leads of the package lead frame also serve to transfer heat away from a molded-plastic body encapsulating an integrated-circuit die and the package lead frame and distribute the same on the printed circuit board.