Abstract: An apparatus may include a heat pipe with a first portion residing in a first plane, a second portion residing in the first plane and a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane. The apparatus further includes a base plate including an opening and a clip plate having a first region, a second region and a third region positioned between the first and the second regions. The third portion of the heat pipe is positioned within the opening, and the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.

Abstract: An electrical connector includes: an insulating body defining a mating space; and a terminal module assembled to the insulating body and having a circuit board and plural mating terminals mounted on the circuit board, wherein: each of the mating terminals has a contact portion extending obliquely backward, a bending portion bent backward from a front end of the contact portion, a connecting portion extending rearward from a rear end of the bending portion, and a mounting portion vertically extending from a rear end of the connecting portion for mounting on the circuit board; and a front end of the circuit board extends forward into the mating space.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: The diaphragm valve uses a metal dish-type diaphragm set to control the inflow and outflow of fluid. The metal dish-type diaphragm set is above an air flow channel to control the stem above the metal dish-type diaphragm set, and the air will be blocked by pressing the metal dish-type diaphragm to make it fit the metal valve base in the air flow channel; this non-metal valve base is fixed in the air flow channel by a fixed shrunk ring with a taper cross section, and the in-between metal diaphragm in the metal dish-type diaphragm set is annular in the center to reduce the metallic friction between metal diaphragms, to increase application times and to lower the leakage rate of the diaphragm valve.

Abstract: An electropolishing device having: an electrode device, which includes a positive electrode guide, a negative electrode guide, a positive electrode plate, a negative electrode plate and a negative working electrode; a clamping apparatus, which includes at least an insulated screw, an upper insulated piece and a lower insulated piece; and an insulated structure, which includes an upper insulated cover and a lower insulated cover.

Abstract: The diaphragm valve uses a metal dish-type diaphragm set to control the inflow and outflow of fluid. The metal dish-type diaphragm set is above an air flow channel to control the stem above the metal dish-type diaphragm set, and the air will be blocked by pressing the metal dish-type diaphragm to make it fit the metal valve base in the air flow channel; this non-metal valve base is fixed in the air flow channel by a fixed shrunk ring with a taper cross section, and the in-between metal diaphragm in the metal dish-type diaphragm set is annular in the center to reduce the metallic friction between metal diaphragms, to increase application times and to lower the leakage rate of the diaphragm valve.

Abstract: The present invention is an electropolishing process and device for electropolishing an inner surface of a long tube, especially applied to a long tube of greater than two meters and a diameter range between 0.3 and 5 cm. Wherein, the present invention comprises at least one tube, and one complex electrode. An inner surface of the tube is for electropolishing process, and it is an anode as well. The electrode is a cathode and placed on a center of a partition. An end of electrode connects to a cable, the cable is driven by an axial mechanism to be moved the electrode toward the axial mechanism itself. Inside of the tube is full o electrolyte, which is an electrifying medium to connect both anode and cathode. Further, electrolyte cooperates with the electrode to perform the electropolishing process on the inner surface of tube.

Abstract: The present invention is an electropolishing process means for inner and outer surfaces of a metal, especially applied to a metal that inner and outer surfaces both needing high clean and passivation. The present invention comprises: an electrode device, which includes a positive electrode guide, a negative electrode guide, a positive electrode plate, a negative electrode plate and a negative working electrode; a clamping apparatus, which includes at least an insulated screw, an upper insulated piece and a lower insulated piece; an insulated structure, which includes an upper insulated cover and a lower insulated cover.

Abstract: The present invention is an electropolishing process means for an inner surface of a long tube, especially applied to a long tube of greater than two meters and a diameter range between 0.3 to 5 cm. Wherein, the present invention comprises at least one tube, one complex electrode; an inner surface of the tube is for electropolishing process, and it is an anode as well; the electrode is a cathode and placed on a center of a partition; an end of electrode connects to a cable, the cable is driven by an axial mechanism to be moved toward the axial mechanism itself; inside tube are full of electrolyte, which is an electrifying medium to connect both anode and cathode, further, electrolyte cooperates with electrode to move for electropolishing process the inner surface of tube.

Abstract: A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.

Abstract: A multiple station CD-ROM testing system includes a conveyance device, a first gripping device, a multiple station testing device having a number of testing stations arranged in a vertically stacked fashion, a second gripping device, a collection device, and a controlling device comprised of a single programmable logic control and a single personal computer. The conveyance device carries the CD-ROMs fed into the system forward. The first gripping device picks up the CD-ROMs on the conveyance device and positions the CD-ROMs into the testing stations of the multiple station testing device to have the CD-ROMs tested therein by means of the controlling device and removes the tested CD-ROMs out of the multiple station testing device and places them back to the conveyance device. The second gripping device picks up the tested CD-ROMs on the conveyance device and transfers the tested CD-ROMs to either a next process if the CD-ROMs pass the test or a flaw product collection device if the CD-ROMs fail the test.

Abstract: This invention discloses new compounds of the formula ##STR1## wherein X is selected from the group consisting of halogen and alkylsulfonyl; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; and R.sup.2 is selected from the group consisting of alkyl, alkenyl, haloalkyl, alkynyl, alkoxyalkyl, cycloalkyl and ##STR2## WHEREIN P IS AN INTEGER FROM 0 TO 2; Y is selected from the group consisting of alkyl, alkenyl, halogen, haloalkyl, alkoxy, alkylthio, nitro and cyano; and m is an integer from 0 to 3.

Abstract: This invention discloses new compounds of the formula ##STR1## wherein X is halogen; and R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and ##STR2## wherein R.sup.2 and R.sup.3 are each selected from the group consisting of hydrogen and alkyl.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN X is selected from the group consisting of halogen and alkylsulfonyl; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; m is an integer from 0 to 3; Y is selected from the group consisting of oxygen and sulfur; R.sup.2 is selected from the group consisting of alkyl and halogen; and n is an integer from 0 to 2.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN X is selected from the group consisting of alkyl, haloalkyl, alkoxy and halogen,; n is an integer from 0 to 2; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and ##STR2## wherein R.sup.3 and R.sup.4 are each selected from the group consisting of hydrogen and alkyl; p is an integer from 0 to 3; Y is oxygen or sulfur; R.sup.2 is selected from the group consisting of alkyl and halogen; and q is an integer from 0 to 2. Further disclosed is the herbicidal utility of the foregoing compounds.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN X is selected from the group consisting of halogen and alkylsulfonyl; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; m is an integer from 1 to 3; Y is selected from the group consisting of oxygen and sulfur; Z is selected from the group consisting of alkyl, alkenyl, halogen, haloalkyl, alkoxy, alkylthio, nitro and cyano; and n is an integer from 0 to 3.

Abstract: This invention discloses new compounds of the formula ##STR1## wherein X is selected from the group consisting of alkyl, halogen, haloalkyl and alkoxy; n is an integer from 0 to 2; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; and R.sup.2 is selected from the group consisting of alkyl, alkenyl, haloalkyl, alkynyl, alkoxyalkyl, cycloalkyl and ##STR2## WHEREIN P IS AN INTEGER FROM 0 TO 2; Y is selected from the group consisting of alkyl, alkenyl, halogen, haloalkyl, alkoxy, alkylthio, nitro and cyano; and m is an integer from 0 to 3.

Abstract: This invention discloses new compounds of the formula ##STR1## wherein X is selected from the group consisting of alkyl, halogen, haloalkyl and alkoxy; n is an integer from 0 to 2; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and ##STR2## wherein R.sup.4 and R.sup.5 are each selected from the group consisting of hydrogen and alkyl; and R.sup.2 and R.sup.3 are each selected from the group consisting of hydrogen, alkyl, alkenyl, haloalkyl, hydroxyalkyl, alkoxyalkyl, cycloalkyl and ##STR3## WHEREIN P IS THE INTEGER 0 OR 1; Y is selected from the group consisting of alkyl, alkoxy, alkylthio, halogen, haloalkyl, nitro and cyano; and m is an integer from 0 to 3.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN X is selected from the group consisting of halogen and alkylsulfonyl; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; Z is selected from the group consisting of alkyl and halogen; and n is an integer from 0 to 2.