Patents by Inventor Chin Chuan Lu

Chin Chuan Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996375
    Abstract: An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The active connectors and the dummy connectors are disposed over the interconnection structure. The active connectors are electrically connected to the interconnection structure, and the dummy connectors are electrically insulated from the interconnection structure.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chao Mao, Chin-Chuan Chang, Szu-Wei Lu, Kun-Tong Tsai, Hung-Chih Chen
  • Publication number: 20240128157
    Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.
    Type: Application
    Filed: July 25, 2022
    Publication date: April 18, 2024
    Inventors: Chin-Chuan Chang, Szu-Wei Lu, Chen-Hua Yu
  • Patent number: 11948930
    Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin-Chuan Chang, Szu-Wei Lu, Chen-Hua Yu
  • Publication number: 20240105629
    Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, a semiconductor bridge, an integrated passive device, a first redistribution layer, and connective terminals. The second semiconductor die is disposed beside the first semiconductor die. The semiconductor bridge electrically connects the first semiconductor die with the second semiconductor die. The integrated passive device is electrically connected to the first semiconductor die. The first redistribution layer is disposed over the semiconductor bridge. The connective terminals are disposed on the first redistribution layer, on an opposite side with respect to the semiconductor bridge. The first redistribution layer is interposed between the integrated passive device and the connective terminals.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu, Tsung-Fu Tsai
  • Publication number: 20240087964
    Abstract: An apparatus for detecting an endpoint of a grinding process includes a connecting device, a timer and a controller. The connecting device is connected to a sensor that periodically senses an interface of a reconstructed wafer comprising a plurality of dies of at least two types to generate a thickness signal comprising thicknesses from a surface of an insulating layer of the reconstructed wafer to the interface of the reconstructed wafer. The timer is configured to generate a clock signal having a plurality of pulses with a time interval. The controller is coupled to the sensor and the timer, and configured to filter the thickness signal according to the clock signal to output a thickness extremum among the thicknesses in the thickness signal within each time interval, wherein the thickness signal after the filtering is used to determine the endpoint of the grinding process being performed on the reconstructed wafer.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chao Mao, Chin-Chuan Chang, Szu-Wei Lu
  • Patent number: 11929261
    Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The substrate is singulated to form dies. The first side of the dies are attached to a carrier. The dies are thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the dies. A device die is bonded to the second connectors. The dies and device dies are singulated into multiple packages.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chin-Chuan Chang, Szu-Wei Lu, Chen-Hua Yu
  • Patent number: 10495252
    Abstract: A supporting frame for holding a display includes a fixed base, a gas spring, a cam, a cantilever arm and a connecting element. The gas spring extends along a first direction and is disposed on the fixed base. The cam is against a pressure bearing head of the gas spring. The cantilever arm has a first end connecting to the cam. The connecting element is pivotally connected to the cantilever arm so as to hold the display. When the cantilever arm rotates toward the fixed base to cause the cam rotating, the gas spring is pressed. The gas spring is able to have various levels of elastic force and thus the display is adapted to stop at any height between a raised position and a lowered position.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: December 3, 2019
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Yi-Xin Lee, Ching-Hui Yen, Chin-Chuan Lu
  • Publication number: 20190107244
    Abstract: A supporting frame is disclosed for holding a display. The supporting frame comprises a fixed base, a gas spring, a cam, a cantilever arm and a connecting element. The gas spring extends along a first direction and is disposed on the fixed base. The cam is against a pressure bearing head of the gas spring. The cantilever arm has a first end connecting to the cam. The connecting element is pivoted on the cantilever arm so as to hold the display. When the cantilever arm rotates to the fixed base to cause the cam rotating, the gas spring is pressed respectively. The gas spring is able to have various levels of elastic force correspondingly and thus the display is adapted to stop at any height.
    Type: Application
    Filed: September 13, 2018
    Publication date: April 11, 2019
    Inventors: Yi-Xin LEE, Ching-Hui YEN, Chin-Chuan LU
  • Patent number: 10190724
    Abstract: A supporting frame is disclosed, which comprises a base, a shaft, a cantilever arm, an elastic body, a mounting unit and at least one cam. The shaft is disposed on the base. The cantilever arm has a first end and a second end. The cam is formed on the first end. The first end of the cantilever arm is pivoted on the shaft, and the elastic body is sleeved on the shaft for providing an elastic force to the cam. The mounting unit holds the display device. The cantilever arm rotates toward the base around a pivot point where the shaft is pivoted on the cantilever arm to cause the cam deforming the elastic body so that elastic force of the elastic body is increased.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: January 29, 2019
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Ching-Hui Yen, Chien-Cheng Yeh, Chin-Chuan Lu, Yi-Xin Lee
  • Publication number: 20180356023
    Abstract: A supporting frame is disclosed, which comprises a base, a shaft, a cantilever arm, an elastic body, a mounting unit and at least one cam. The shaft is disposed on the base. The cantilever arm has a first end and a second end. The cam is formed on the first end. The first end of the cantilever arm is pivoted on the shaft, and the elastic body is sleeved on the shaft for providing an elastic force to the cam. The mounting unit holds the display device. The cantilever arm rotates toward the base around a pivot point where the shaft is pivoted on the cantilever arm to cause the cam deforming the elastic body so that elastic force of the elastic body is increased.
    Type: Application
    Filed: March 27, 2018
    Publication date: December 13, 2018
    Inventors: Ching-Hui YEN, Chien-Cheng YEH, Chin-Chuan LU, Yi-Xin LEE
  • Patent number: 7690084
    Abstract: The present invention provides a supporting rack, one lateral end thereof is provided with a connecting section and the base thereof is provided with an extending section, at least one clamping ring is formed at the free end of the extending section and an opening is provided between the clamping ring and the extending section; an auxiliary connecting member used to connect a reinforcing sheet to the extending section, a positioning sheet is formed by vertically bending one end of the reinforcing sheet and is formed as one piece with the reinforcing sheet; a core hole is axially provided on the positioning sheet, with respect to a location of a shaft hole of the clamping ring and with respect to a size of a shaft rod; a pivotal shaft, the shaft rod is axially extended from the pivotal shaft; the shaft rod passes through the core hole of the positioning sheet and is tightly connected thereon, and is covered by at least one clamping ring.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: April 6, 2010
    Assignee: Jarllytec Co., Ltd.
    Inventor: Chin Chuan Lu
  • Publication number: 20090011840
    Abstract: The present invention provides a supporting rack one lateral end thereof is provided with a connecting section and the base thereof is provided with an extending section at least one clamping ring is formed at the free end of the extending section and an opening is provided between the clamping ring and the extending section; an auxiliary connecting member used to connect a reinforcing sheet to the extending section a positioning sheet is formed by vertically bending one end of the reinforcing sheet and is formed as one piece with the reinforcing sheet; a core hole is axially provided on the positioning sheet, with respect to a location of a shaft hole of the clamping ring and with respect to a size of a shaft rod; a pivotal shaft the shaft rod is axially extended from the pivotal shaft; the shaft rod passes through the core hole of the positioning sheet and is tightly connected thereon, and is covered by at least one clamping ring.
    Type: Application
    Filed: May 19, 2008
    Publication date: January 8, 2009
    Inventor: Chin Chuan Lu