Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.

Abstract: An image labeling apparatus, method, and computer program product are provided. The image labeling apparatus generates several image features of several to-be-processed images and classifies them into several groups. For each group, the image labeling apparatus: (a) selects the image feature closest to the center as a representative feature and a compared feature, (b) selects the image feature farthest to the compared feature as a candidate feature, and (c) compares the similarity between the candidate feature and each representative feature with a threshold. When all the similarities are smaller than the threshold, adopts the candidate feature as another representative feature and the compared feature and repeats (b) and (c). The group(s) whose number of representative features is more than another threshold will be re-classified.

Abstract: A yield-rate assessment apparatus for a manufacture system including a plurality of machines, each machine participating in one or more manufacture steps of a batch of products in the manufacture system, performs for each machine: calculating a bad-piece expectation value and a quantity of potential bad pieces at each corresponding manufacture step based on a quantity of bad pieces detected after the last one of the manufacture steps is finished and an initial yield rate of the current machine; calculating a good-piece expectation value based on a quantity of good pieces detected after the last one of the manufacture steps is finished and a summation of all quantities of potential bad pieces calculated for the current machine; and assessing a yield rate according to the good-piece expectation value calculated for the current machine and a summation of the bad-piece expectation value calculated for the current machine at each corresponding step.

Abstract: An image labeling apparatus, method, and computer program product are provided. The image labeling apparatus generates several image features of several to-be-processed images and classifies them into several groups. For each group, the image labeling apparatus: (a) selects the image feature closest to the center as a representative feature and a compared feature, (b) selects the image feature farthest to the compared feature as a candidate feature, and (c) compares the similarity between the candidate feature and each representative feature with a threshold. When all the similarities are smaller than the threshold, adopts the candidate feature as another representative feature and the compared feature and repeats (b) and (c). The group(s) whose number of representative features is more than another threshold will be re-classified.

Abstract: A yield-rate assessment apparatus for a manufacture system including a plurality of machines, each machine participating in one or more manufacture steps of a batch of products in the manufacture system, performs for each machine: calculating a bad-piece expectation value and a quantity of potential bad pieces at each corresponding manufacture step based on a quantity of bad pieces detected after the last one of the manufacture steps is finished and an initial yield rate of the current machine; calculating a good-piece expectation value based on a quantity of good pieces detected after the last one of the manufacture steps is finished and a summation of all quantities of potential bad pieces calculated for the current machine; and assessing a yield rate according to the good-piece expectation value calculated for the current machine and a summation of the bad-piece expectation value calculated for the current machine at each corresponding step.

Abstract: A high-heat-load vacuum device and method for manufacturing the same are provided. The high-heat-load vacuum device includes a high-heat-load component and a vacuum component connected to the high-heat-load component. A material of the vacuum component and a material of the high-heat-load component comprise CuCrZr alloy.

Abstract: A method for welding dissimilar metals is provided. A first metal workpiece and a second metal workpiece having different physical characteristics are provided. A surface of the first metal workpiece and a surface of the second metal workpiece are abutted to form a pre joint surface between the first metal workpiece and the second metal workpiece. The first metal workpiece and the second metal workpiece are welded with a welding apparatus moving substantially along an axis, wherein the axis is offset from the pre-joint surface and proximal to the first metal workpiece than to the second metal workpiece.