Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.

Abstract: A host system initiates an abort of a command that has been placed into a submission queue (SQ) of the host system. The host system identifies at least one of a first outcome and a second outcome. When the first outcome indicates that the command is not completed and the second outcome indicates that the SQ entry has been fetched from the SQ, the host system sends an abort request to a storage device, and issues a cleanup request to direct the host controller to reclaim host hardware resources allocated to the command. The host system adds a completion queue (CQ) entry to a CQ and sets an overall command status (OCS) value of the CQ entry based on at least one of the first outcome and the second outcome.

Abstract: The invention provides a housing for an electrical card, which is an RSMMC memory card. The housing includes a metal cover and a frame integrally formed at a periphery of the metal cover by way of injection molding. A long frame is formed with a long slot for accommodating a control chip. The long slot has a length ranging from 7 to 9 mm to accommodate various types of control chips. The structure intensity of the long slot can be increased by forming through hole slots to be pressed by push needles at the bottom of the long slot when the frame is injected to cover a metal sheet. Then, the substrate formed with the IC is closed and fixed from the other surface. Thus, it is possible to effectively increase the structure intensity of the long slot to improve the function thereof.

Abstract: The invention provides a housing for an electrical card, which is an RSMMC memory card. The housing includes a metal cover and a frame integrally formed at a periphery of the metal cover by way of injection molding. A long frame is formed with a long slot for accommodating a control chip. The long slot has a length ranging from 7 to 9 mm to accommodate various types of control chips. The structure intensity of the long slot can be increased by forming through hole slots to be pressed by push needles at the bottom of the long slot when the frame is injected to cover a metal sheet. Then, the substrate formed with the IC is closed and fixed from the other surface. Thus, it is possible to effectively increase the structure intensity of the long slot to improve the function thereof.

Abstract: The present invention provides an improved packaging structure of a memory card, such as mini SD memory card. The packaging structure comprises a substrate having a plurality of integrated circuit devices and passive devices located therein, and a metal cover having an insulating layer formed on a top portion of the metal cover. A plurality of protruding plates bending downward are formed around a circumferential area of the metal cover, and a roll-shaped fixing part is formed at a bottom portion of a particular protruding plate. The roll-shaped fixing part and the protruding plates are utilized to engage the frame with the metal cover to form a sealed structure so that the frame covers all the protruding plates and the roller-shaped fixing part of the metal cover. The integrated circuit devices and the passive devices are located within the space of the frame to form a mini SD memory card package.

Abstract: The present invention provides an improved Micro SD memory card, wherein the Micro SD memory card comprises a memory unit, a frame and a cover. The memory card comprises a package of a complete integrated circuit and essential electrical devices, wherein one side of the memory unit further comprises a plurality of contact pieces, and a protruding portion is formed on a circumferential side of the memory unit. The frame has a locating area for positioning the memory unit, wherein a trench is formed on a circumferential edge of one side of the frame. A channel part is formed on another side of the frame and corresponds to the protruding portion of the memory unit. The cover locating onto one side of the frame, wherein an inserting portion is formed and is integrated into the trench of the frame. The frame's structure can be integrated either on the complete integrated package or the unpacking package.

Abstract: A MICRO SD card includes a casing composed of a base and a top cover, an insertion slot is defined in an end of the casing and a plurality of first recesses are defined in an inner surface of the base. A recessed area is defined in the inner surface of the base so as to receive a circuit board therein. The top cover has a plurality of ridges extending from an underside thereof and each ridge has a second recess defined therein. A plurality of terminals each have a projection which is engaged with one of the second recesses. A first leg and a second leg respectively extend from two ends of each of the projections. The first leg extends into the insertion slot and the second leg has a protrusion which is compressed onto the circuit board by the ridge corresponding thereto.

Abstract: The present invention provides an improved packaging structure of a memory card, such as mini SD memory card. The packaging structure comprises a substrate having a plurality of integrated circuit devices and passive devices located therein, and a metal cover having an insulating layer formed on a top portion of the metal cover. A plurality of protruding plates bending downward are formed around a circumferential area of the metal cover, and a roll-shaped fixing part is formed at a bottom portion of a particular protruding plate. The roll-shaped fixing part and the protruding plates are utilized to engage the frame with the metal cover to form a sealed structure so that the frame covers all the protruding plates and the roller-shaped fixing part of the metal cover. The integrated circuit devices and the passive devices are located within the space of the frame to form a mini SD memory card package.

Abstract: The present invention provides a packaging structure of a RSMMC memory card. The packaging structure comprises a substrate having a plurality of integrated circuit (IC) devices and passive devices located therein. A frame engaging with the substrate is surrounded with the IC devices and the passive devices. A metal cover having an insulating layer is engaged with the frame to form a thin layer of structure. A plurality of fixed plates bending downward are formed around a circumferential area of the metal cover, and a protruding plate and fixing slots are formed on one end of the pre-selected fixed plates bending outward. The frame and the metal cover are integrated together to form a sealed structure. The integrated circuit devices and the passive devices are located within the space of the frame to form a RSMMC memory card package.

Abstract: A multimedia memory card comprises a cover body having a top surface and a side wall extending from the periphery of the top surface and a control circuit. The top surface and the side wall form a holding space. The circuit board has at least a first flash memory, a second flash memory, a control chip, and a plurality of passive components. The first flash memory is disposed adjacent to the second flash memory. The control chip and the passive components are disposed on one side of the first flash memory or second flash memory. The holding space of the cover body is designed to hold the first flash memory, the second flash memory, the control chip, and the passive components of the circuit board.