Patents by Inventor Chin-Chung Lin

Chin-Chung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240179445
    Abstract: A telescopic structure of a headphone includes a headband, a cover, a slider, two damping elements and a cable. A front end of an inner surface of the headband defines a first concave surface. The cover is disposed to the front end of the inner surface of the headband. A front end of an internal surface of the cover is recessed inward to form a second concave surface. The second concave surface is corresponding to the first concave surface. The slider is disposed between the headband and the cover. The two damping elements are disposed to the first concave surface and the second concave surface, respectively. The two damping elements abut against two opposite areas of an outer surface of the slider. The cable is disposed between the headband and the cover.
    Type: Application
    Filed: September 12, 2023
    Publication date: May 30, 2024
    Inventor: CHIN-CHUNG LIN
  • Patent number: 11991859
    Abstract: An apparatus may include a heat pipe with a first portion residing in a first plane, a second portion residing in the first plane and a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane. The apparatus further includes a base plate including an opening and a clip plate having a first region, a second region and a third region positioned between the first and the second regions. The third portion of the heat pipe is positioned within the opening, and the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: May 21, 2024
    Assignee: Dell Products L.P.
    Inventors: Chin-Chung Wu, Chun-Han Lin, Che-Jung Chang, Yueh Ching Lu
  • Patent number: 11983475
    Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
  • Patent number: 11935894
    Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
  • Patent number: 11747011
    Abstract: A headphone includes a housing, a light emitting device and a printed circuit board. The light emitting device is mounted in the housing. The light emitting device includes a luminous unit, and a light guiding unit disposed close to the luminous unit. The light guiding unit has a base portion, an incident surface formed at an inner surface of an inner end of the base portion, an emitting surface formed at an outer surface of an outer end of the base portion, a first refracting surface, a first reflecting surface, a second reflecting surface, a second refracting surface, a light transmitting column, a positioning wall, an upper buckling arm and a lower buckling arm. The printed circuit board is mounted in the housing.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: September 5, 2023
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Ming Tseng, Chin-Chung Lin, Ming-Han Kuo
  • Publication number: 20230220988
    Abstract: A headphone includes a housing, a light emitting device and a printed circuit board. The light emitting device is mounted in the housing. The light emitting device includes a luminous unit, and a light guiding unit disposed close to the luminous unit. The light guiding unit has a base portion, an incident surface formed at an inner surface of an inner end of the base portion, an emitting surface formed at an outer surface of an outer end of the base portion, a first refracting surface, a first reflecting surface, a second reflecting surface, a second refracting surface, a light transmitting column, a positioning wall, an upper buckling arm and a lower buckling arm. The printed circuit board is mounted in the housing.
    Type: Application
    Filed: November 16, 2022
    Publication date: July 13, 2023
    Inventors: CHI-MING TSENG, CHIN-CHUNG LIN, MING-HAN KUO
  • Publication number: 20230179900
    Abstract: A headphone includes an arc-shaped headband, a sliding bar slidably arranged at a tail end of the headband, a hanger pivotally arranged at a tail end of the sliding bar, an earphone unit hanged to the hanger, and a light emitting unit. The earphone unit is fastened to the hanger. The earphone unit includes a housing. A peripheral edge of an outer surface of the housing protrudes outward to form a protruding ring. The light emitting unit is fastened to the housing. The light emitting unit includes a light guiding module and a light emitter. The light guiding module includes a light guider and a light blocker. An inner end of the light blocker is provided with a contacting portion which is closely cooperated with the protruding ring, and an inner end of the light guider closely abuts against the protruding ring.
    Type: Application
    Filed: September 2, 2022
    Publication date: June 8, 2023
    Inventors: Chi-Ming TSENG, Chin-Chung LIN
  • Patent number: 11528548
    Abstract: A headphone includes a base, an accommodating space, a bracket, a circuit board accommodated in the accommodating space, a signal cable, a microphone assembly accommodated in the accommodating space, and a sound chamber unit accommodated in the accommodating space. The base has a sidewall and an outer wall surrounding the accommodating space. A junction portion between the sidewall and the outer wall is recessed inward to form a recess. At least one connection wall has a through hole communicated with the accommodating space. The bracket is received in the recess. The bracket includes an outer cover and an inner cover. A cable path is formed between the outer cover and the inner cover. One end of the bracket has a guiding slot connected to the cable path. The guiding slot is corresponding to the through hole. The signal cable is arranged along the cable path.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: December 13, 2022
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Ming Tseng, Chin-Chung Lin
  • Patent number: 11368779
    Abstract: A headset includes a curved headband, at least one sliding rod slidably arranged to one end of the headband, at least one suspension bracket rotatably connected to the at least one sliding rod, at least one insertion hole penetrating through the at least one suspension bracket, at least one fastening shaft mounted in the at least one insertion hole, and at least one elastic element. The at least one insertion hole has an assembling end, a buffering end, and a pivot block located between the assembling end and the buffering end. The at least one fastening shaft has a fixing portion, an extending portion, and an interfering portion located between the fixing portion and the extending portion. The pivot block clamps the interfering portion. The at least one elastic element is fastened between the extending portion and the buffering end.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: June 21, 2022
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Ming Tseng, Chin-Chung Lin
  • Publication number: 20220191609
    Abstract: A headphone includes a base, an accommodating space, a bracket, a circuit board accommodated in the accommodating space, a signal cable, a microphone assembly accommodated in the accommodating space, and a sound chamber unit accommodated in the accommodating space. The base has a sidewall and an outer wall surrounding the accommodating space. A junction portion between the sidewall and the outer wall is recessed inward to form a recess. At least one connection wall has a through hole communicated with the accommodating space. The bracket is received in the recess. The bracket includes an outer cover and an inner cover. A cable path is formed between the outer cover and the inner cover. One end of the bracket has a guiding slot connected to the cable path. The guiding slot is corresponding to the through hole. The signal cable is arranged along the cable path.
    Type: Application
    Filed: August 11, 2021
    Publication date: June 16, 2022
    Inventors: CHI-MING TSENG, CHIN-CHUNG LIN
  • Publication number: 20220172445
    Abstract: An image positioning system capable of real-time positioning compensation includes a 3D marking device, a photographing device, a 3D scanning device, a beam splitter, and a processing unit. The 3D marking device has a polyhedral cube. The beam splitter is configured to cause the photographing device and the 3D scanning device to capture an image of and scan the 3D marking device respectively from the same field of view. The processing unit is configured to calculate image data and 3D scanning data generated respectively by the photographing device and the 3D scanning device to obtain a positioning compensation amount and perform positioning compensation.
    Type: Application
    Filed: July 28, 2021
    Publication date: June 2, 2022
    Inventors: Chieh-Hua CHEN, Po-Chi HU, Chin-Chung LIN, Wen-Hui HUANG, Yan-Ting CHEN
  • Patent number: 11350201
    Abstract: A headband structure for headphones, comprising: a headband set, and an adjustment module arranged at an end of the headband set, wherein the adjustment module includes: an earphone hanger which is consisted of a hanger frame, a fixing base arranged at an end of the hanger frame, a spring arranged on the fixing base and a convex face arranged on the spring, a first cap body arranged at a side of the earphone hanger, a wave form fastener arranged on the first cap body to contact with the convex face, a second cap body arranged at another side of the earphone hanger, and a sliding space formed between the first cap body and the second cap body for accommodating an end of the earphone hanger.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: May 31, 2022
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Ming Tseng, Chin-Chung Lin
  • Publication number: 20220095028
    Abstract: A headset includes a curved headband, at least one sliding rod slidably arranged to one end of the headband, at least one suspension bracket rotatably connected to the at least one sliding rod, at least one insertion hole penetrating through the at least one suspension bracket, at least one fastening shaft mounted in the at least one insertion hole, and at least one elastic element. The at least one insertion hole has an assembling end, a buffering end, and a pivot block located between the assembling end and the buffering end. The at least one fastening shaft has a fixing portion, an extending portion, and an interfering portion located between the fixing portion and the extending portion. The pivot block clamps the interfering portion. The at least one elastic element is fastened between the extending portion and the buffering end.
    Type: Application
    Filed: July 15, 2021
    Publication date: March 24, 2022
    Inventors: CHI-MING TSENG, CHIN-CHUNG LIN
  • Publication number: 20220078536
    Abstract: A headband structure for headphones, comprising: a headband set, and an adjustment module arranged at an end of the headband set, wherein the adjustment module includes: an earphone hanger which is consisted of a hanger frame, a fixing base arranged at an end of the hanger frame, a spring arranged on the fixing base and a convex face arranged on the spring, a first cap body arranged at a side of the earphone hanger, a wave form fastener arranged on the first cap body to contact with the convex face, a second cap body arranged at another side of the earphone hanger, and a sliding space formed between the first cap body and the second cap body for accommodating an end of the earphone hanger.
    Type: Application
    Filed: April 15, 2021
    Publication date: March 10, 2022
    Inventors: CHI-MING TSENG, CHIN-CHUNG LIN
  • Publication number: 20210401912
    Abstract: A method for modulating an immune system in a subject in need thereof, comprising: administering to a subject an effective amount of a pharmaceutical composition comprising an Antrodia cinnamomea composition, wherein the Antrodia cinnamomea composition comprises: 50 wt % to 100 wt % of Antrodia cinnamomea mycelium; and 0 wt % to 50 wt % of an extract of fruiting body of Antrodia cinnamomea.
    Type: Application
    Filed: August 26, 2020
    Publication date: December 30, 2021
    Inventors: Chin-Chung LIN, Tzung-Hsien LAI, Wan-Jing CHEN, Jent-Turn LEE
  • Publication number: 20210174950
    Abstract: A stereoscopic marker device includes: a polyhedral cube, including at least four flat surfaces, wherein the at least four flat surfaces are used as one primary marker and at least three secondary markers respectively, the primary marker includes a primary graphic code, the three secondary markers individually include a first secondary graphic code, a second secondary graphic code, and a third secondary graphic code, and the primary graphic code is used for providing spatial coordinate information, which is used for calculating six degrees of freedom (DOF) attitude data; and a spike-shaped body, combined with the polyhedral cube and configured to be fixed on a surgery site.
    Type: Application
    Filed: October 6, 2020
    Publication date: June 10, 2021
    Inventors: Po-Chi HU, Yan-Ting CHEN, Chin-Chung LIN, Wen-Hui HUANG, Keng-Ta LIN
  • Publication number: 20210100860
    Abstract: The present invention relates a use of Antrodia cinnamomea composition, consisting of 50-99% (W/W) of Antrodia cinnamomea solid-state cultivated mycelium water/alcohol extracts and 1-50% (W/W) of cut-log wood cultivated fruiting body water/alcohol extracts, in the preparation of auxiliary agents for chemotherapy. The Antrodia cinnamomea composition of the present invention has proven effects on improving the anti-cancer effects when combined with chemotherapy drugs, and reducing the toxicity and side effects caused by chemotherapy treatments. The composition of present invention can be applied to use as an auxiliary for anti-cancer agents.
    Type: Application
    Filed: October 28, 2020
    Publication date: April 8, 2021
    Inventors: Chin-Chung LIN, Chiu-Ping LO, Yun-Yu CHEN, Tzung-Hsien LAI, Li-Chuan HSU
  • Patent number: 10972839
    Abstract: A head band structure of headset includes a retractable adjusting block and a head band group. The retractable adjusting block includes an upper cover, a sliding slice, an elastic piece and a lower cover. The sliding slice has at least one blocking portion. A substantial middle of the elastic piece is arched upward to form a convex surface. The head band group is connected with the retractable adjusting block. The head band group has a head band, and two end covers disposed to two opposite ends of the head band. A surface of each end cover has a waveform locking portion, and at least one stopping frame disposed at one end of the waveform locking portion. The convex surface keeps contacting with the waveform locking portion.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: April 6, 2021
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Chi Ming Tseng, Chin Chung Lin
  • Publication number: 20210051408
    Abstract: A head band structure of headset includes a retractable adjusting block and a head band group. The retractable adjusting block includes an upper cover, a sliding slice, an elastic piece and a lower cover. The sliding slice has at least one blocking portion. A substantial middle of the elastic piece is arched upward to form a convex surface. The head band group is connected with the retractable adjusting block. The head band group has a head band, and two end covers disposed to two opposite ends of the head band. A surface of each end cover has a waveform locking portion, and at least one stopping frame disposed at one end of the waveform locking portion. The convex surface keeps contacting with the waveform locking portion.
    Type: Application
    Filed: December 9, 2019
    Publication date: February 18, 2021
    Inventors: Chi Ming Tseng, Chin Chung Lin
  • Patent number: 10452160
    Abstract: A mouse device includes at least one electronic switch and at least one button module. The at least one electronic switch includes a switch assembly, and a lower magnet mounted to the switch assembly. The at least one electronic switch is disposed under the at least one button module. A bottom surface of the at least one button module is equipped with an upper magnet disposed over a top of the lower magnet. Magnetic poles of the top of the lower magnet and a bottom of the upper magnet are the same. When the at least one button module is pressed downward, the lower magnet drives the switch assembly to convert a switch-off state into a switch-on state by virtue of a repelling force of the upper magnet pushing against the lower magnet, so that the at least one electronic switch is triggered.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: October 22, 2019
    Assignee: CHENG UEI PRECISION INDUSTRY CO. LTD.
    Inventors: Chi-Ming Tseng, Chin-Chung Lin