Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.

Abstract: An aluminum fire-resistant honeycomb-shaped plate and its manufacturing method includes an aluminum intermediate honeycomb-shaped layer, a layer of gauze adhered respectively on an upper and a lower surface of the intermediate honeycomb-shaped layer, an outer solid aluminum plate adhered respectively on an outer surface of each layer of gauze. The gauze endures high temperature and percolates air. Then the outer surface of each outer solid aluminum plate is anodized with a layer of a chemical to prevent it from getting rusted and then sprayed with a layer of silicon glue to increase hardness of the outer surfaces and beautiful appearance.