Patents by Inventor Chin Feng Su

Chin Feng Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240085647
    Abstract: An optical fiber combiner includes optical fiber components including a predetermined area and a refractive index portion formed on the predetermined area; a housing including a channel with the optical fiber components disposed through, fastening members for fastening the optical fiber components, and a cover for sealing the channel; and a conductive material disposed in the channel. In response to laser beams impinging on the optical fiber components, heat is generated by the refractive index portion, the heat is absorbed by the conductive material, and the heat is further transferred to the housing and the cover by thermal conduction for dissipation.
    Type: Application
    Filed: October 17, 2023
    Publication date: March 14, 2024
    Inventors: Yu-Hsiang Lin, Chin-Feng Su
  • Patent number: 9482391
    Abstract: An omnidirectional LED bulb has a base, a light-transmitting shell, a heat-dissipating pillar and an LED module. The light-transmitting shell is mounted on the base and has a lateral surface and a top surface. The heat-dissipating pillar is mounted on the base and has multiple mounting surfaces facing toward the lateral surface and the top surface of the light-transmitting shell. The LED module is mounted on the mounting surfaces of the heat-dissipating pillar. The LED module emits light through the lateral surface and the top surface of the light-transmitting shell to form an omnidirectional illumination.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: November 1, 2016
    Inventor: Chin-Feng Su
  • Publication number: 20150098223
    Abstract: An omnidirectional LED bulb has a base, a light-transmitting shell, a heat-dissipating pillar and an LED module. The light-transmitting shell is mounted on the base and has a lateral surface and a top surface. The heat-dissipating pillar is mounted on the base and has multiple mounting surfaces facing toward the lateral surface and the top surface of the light-transmitting shell. The LED module is mounted on the mounting surfaces of the heat-dissipating pillar. The LED module emits light through the lateral surface and the top surface of the light-transmitting shell to form an omnidirectional illumination.
    Type: Application
    Filed: December 16, 2014
    Publication date: April 9, 2015
    Inventor: Chin-Feng Su
  • Patent number: 7318658
    Abstract: A high power LED color bulb with infrared remote function has a reflector having front and rear openings and a light guide hole, a light guide bar received inside light guide hole, an LED module with LED chips and a bulb cover with a controlling circuit board. The LED module is mounted on a rear end of the reflector with the LED chips inside the reflector. The controlling circuit board is inside the bulb cover, is connected electronically to the LED module and has an infrared sensor aligned with the light guide bar of the reflector. When an infrared signal comes through the front opening of the reflector, the infrared signal passes through the light guide bar and is received by the infrared sensor. Since the infrared sensor is behind the reflector and the LED chips, the infrared sensor avoids overheating from heat produced by the LED chips and does not have to be replaced simultaneously with the color bulb.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: January 15, 2008
    Assignees: Anteya Technology Corporation, Color Stars, Inc.
    Inventors: Hsu Cheng Wang, Wei Rur Chen, Chin Feng Su, Ting Feng Wu