Patents by Inventor Chin H. Cheng

Chin H. Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925235
    Abstract: A method of forming an electrorheological fluid structure with attached conductor and method of fabrication. A polymeric housing may have a channel defined therein. A first conductive trace may at least partially coincide with the channel. A first wire may have a first conductor surrounded by a first insulating jacket. The first conductor may be in electrical communication with the first conductive trace. A jacket bonding region of the first jacket may be welded to a housing bonding region of the housing. The jacket bonding region and the housing bonding region may be formed from a common type of polymer.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: March 12, 2024
    Assignee: NIKE, Inc.
    Inventors: Steven H. Walker, Chin-yuan Cheng
  • Patent number: 4745015
    Abstract: An improved vacuum panel of double wall construction comprising:(a) two walls of a structurally stable material containing at least one metal layer of at least 0.125 mm in thickness;(b) edges of a normally solid plastic material which have been rendered substantially impermeable to gases, said edges being affixed by means of an adhesive layer to the walls such that an evacuated space is enclosed between the walls of the panel, and(c) a gas-absorbing material residing in the evacuated space.
    Type: Grant
    Filed: April 18, 1983
    Date of Patent: May 17, 1988
    Assignee: The Dow Chemical Company
    Inventors: Chin H. Cheng, Wilhelm E. Walles