Abstract: A wearable device includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a fifth radiation element. The first radiation element has a feeding point, and is coupled to a first grounding point on the ground element. A slot region is surrounded by the first radiation element and the ground element. The second radiation element is coupled to a second grounding point on the ground element. The third radiation element is coupled to the second grounding point. The third radiation element and the second radiation element substantially extend in opposite directions. The fourth radiation element and the fifth radiation element are disposed inside the slot region. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, the fourth radiation element, and the fifth radiation element.

Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, and a nonconductive support element. The first radiation element is coupled to a first grounding point on the ground element. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the second radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The second radiation element is at least partially surrounded by the first radiation element. The third radiation element is at least partially surrounded by the second radiation element.

Abstract: A deflecting plate includes a silicon-on-insulator (SOI) substrate. The SOI substrate includes: an insulator layer having a top surface and a bottom surface; a device layer coupled to the insulator layer at the top surface, wherein multiple deflecting apertures are disposed in the device layer, each of which extending from a top open end to a bottom open end through the device layer, and wherein the bottom open end is coplanar with the top surface of the insulator layer; and a handle substrate coupled to the insulator layer at the bottom surface, wherein a cavity is disposed in the handle substrate and extends from a cavity open end to a cavity bottom wall, and wherein the bottom wall is coplanar with the top surface of the insulator layer, such that the bottom open end of each deflecting aperture is exposed to the cavity.

Abstract: A system includes a measuring device, a processing device and a signal generating device. The measuring device is configured to measure a voltage difference between a first node and a second node. The processing device is coupled between the first node and the second node. The signal generating device is configured to provide a first clock signal to the processing device to adjust the voltage difference, configured to generate the first clock signal according to a first enable signal and a second clock signal, and configured to align an edge of the first enable signal with an edge of the second clock signal. A method and a device are also disclosed herein.

Abstract: A consumer electronic device includes a battery module and a system chip. The battery module includes: battery cells, a heater adjacent to the battery cells, a battery management circuit coupled to the battery cells and the heater, and an electrical connector including an information transmission interface and a power transmission interface. The information transmission interface is coupled to the battery management circuit, and the power transmission interface is coupled to the battery cells. The system chip is coupled to the information transmission interface, and is configured to receive battery information from the battery management circuit through the information transmission interface. When a battery temperature of the battery information is lower than a first threshold, the system chip sends an activation signal to the battery management circuit through the information transmission interface, for the battery management circuit to activate the heater according to the activation signal.

Abstract: A sense amplifier includes a first pair of transistors having gate terminals respectively coupled to a first input terminal for receiving a first input signal and to a second input terminal for receiving a second input signal, source terminals coupled to a first power supply terminal, and drain terminals. The sense amplifier also includes a second pair of transistors having gate terminals coupled to a clock terminal, source terminals respectively coupled to the drain terminals of the first pair of transistors, and drain terminals. The sense amplifier also includes a third pair of transistors having gate terminals coupled to the clock terminal, drain terminals respectively coupled to the drain terminals of the second pair of transistors, and source terminals coupled to a second power supply terminal. In addition, the sense amplifier includes an output circuit coupled to the drain terminals of the second pair of transistors and having an output terminal.

Abstract: An impedance measurement circuit and an operating method thereof are provided. The impedance measurement circuit includes a current source, a voltage controlled oscillator (VCO), an operation circuit, and a first delay circuit. The current source, electrically connected to a power rail, is able to sink a current from the power rail according to the delayed clock signal. The VCO is configured to generate an oscillation signal according to a power voltage on the power rail. The operation circuit is electrically connected to the VCO and is configured to receive a sampling clock signal and the oscillation signal, sense the power voltage to generate a sampled signal, and accumulate the sampled signal to generate a measurement result. The first delay circuit, electrically connected to the current source and the operation circuit, is able to receive the sampling clock signal and transmit the delayed clock signal to the current source.

Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated thin-film transistors. The diode may be coupled to drive transistor circuitry, a data loading transistor, and emission transistors. The drive transistor circuitry may include at least two transistor portions connected in series. The data loading transistor has a drain region connected to a data line and a source region connected directly to the drive transistor circuitry. The data line may be connected to and overlap the drain region of the data loading transistor. The data line and the source region of the data loading transistor are non-overlapping to reduce row-to-row crosstalk.

Abstract: A casing structure including a plastic casing, at least one metal component, and a conductive layer is provided. The at least one metal component is disposed on the plastic casing, and at least one side surface of the at least one metal component is covered by the plastic casing. The conductive layer is disposed on the metal component and extends to the plastic casing. In addition, a manufacturing method of the casing structure is also provided.

Abstract: A linkage mechanism includes a pivoting assembly, a cam, a sliding assembly and at least one linkage. The cam pivots coaxially with the rotating axis of the pivoting assembly. A leaning element is located on one side of the cam. A sliding frame pivots the leaning element and has at least one limiting area. The linkage includes a main body portion, a first linkage portion protruded beyond the limiting area and a second linkage portion. When the pivoting assembly drives the cam to pivot from a first position to a second position, the cam pushes against the leaning element to slide the sliding frame in a first direction relative to a plate, and the limiting area interferes with the first linkage portion of the linkage to rotate the main body portion in a first clock direction to allow the second linkage portion to provide a thrust in a second direction.

Abstract: An electronic device includes a first body, a second body, a touch pad module and a speaker module. The first body has an assembling region. The second body is pivoted to the first body. The touch pad module and the speaker module are disposed in the assembling region, wherein the touch pad module includes a first extending circuit board which is configured with a conductive pad. The speaker module is located at one side of the touch pad module. The speaker module includes a speaker and a conductive elastic component, and the conductive elastic component contacts the conductive pad. An assembling method of an electronic device is also provided.

Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

Abstract: A linkage mechanism includes a pivoting assembly, a cam, a sliding assembly, and a linkage assembly. The cam pivots coaxially with the rotating axis. The sliding assembly is assembled on a plate member and has a leaning surface and a sliding slot. The linkage assembly includes a linkage passing through the sliding slot and a carrier base including at least one bump and fastened to the linkage. When the pivoting assembly drives the cam to pivot from a first position to a second position, the cam pushes against the leaning surface to slide the sliding assembly relative to the plate member in a first direction, and the linkage rotates in the sliding slot to drive the carrier base to move in a second direction, and the bump gradually enters into a cavity of a frame from leaning the frame to move the frame in a third direction.

Abstract: A linkage mechanism includes a pivoting assembly, a cam, a sliding assembly and at least one linkage. The cam pivots coaxially with the rotating axis of the pivoting assembly. A leaning element is located on one side of the cam. A sliding frame pivots the leaning element and has at least one limiting area. The linkage includes a main body portion, a first linkage portion protruded beyond the limiting area and a second linkage portion. When the pivoting assembly drives the cam to pivot from a first position to a second position, the cam pushes against the leaning element to slide the sliding frame in a first direction relative to a plate, and the limiting area interferes with the first linkage portion of the linkage to rotate the main body portion in a first clock direction to allow the second linkage portion to provide a thrust in a second direction.

Abstract: A linkage mechanism includes a pivoting assembly, a cam, a sliding assembly, and a linkage assembly. The cam pivots coaxially with the rotating axis. The sliding assembly is assembled on a plate member and has a leaning surface and a sliding slot. The linkage assembly includes a linkage passing through the sliding slot and a carrier base including at least one bump and fastened to the linkage. When the pivoting assembly drives the cam to pivot from a first position to a second position, the cam pushes against the leaning surface to slide the sliding assembly relative to the plate member in a first direction, and the linkage rotates in the sliding slot to drive the carrier base to move in a second direction, and the bump gradually enters into a cavity of a frame from leaning the frame to move the frame in a third direction.

Abstract: A casing structure including a plastic casing, at least one metal component, and a conductive layer is provided. The at least one metal component is disposed on the plastic casing, and at least one side surface of the at least one metal component is covered by the plastic casing. The conductive layer is disposed on the metal component and extends to the plastic casing. In addition, a manufacturing method of the casing structure is also provided.

Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.

Abstract: An electronic device includes a first body, a second body, a touch pad module and a speaker module. The first body has an assembling region. The second body is pivoted to the first body. The touch pad module and the speaker module are disposed in the assembling region, wherein the touch pad module includes a first extending circuit board which is configured with a conductive pad. The speaker module is located at one side of the touch pad module. The speaker module includes a speaker and a conductive elastic component, and the conductive elastic component contacts the conductive pad. An assembling method of an electronic device is also provided.

Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.

Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.