Abstract: A carrier for solid state devices includes a plurality of panels, at least one gate, and an addition. The plurality of panels includes a first panel, a second panel, and a third panel. The at least one gate is attached to the second panel and the third panel. The at least one gate is configured to be in one of a first position or a second position. When the at least one gate is in the first position, an opening for receiving solid state devices is at least partially occluded to a first width that is smaller than a length of one of the solid state devices. When the at least one gate is in the second position, the opening for receiving the solid state devices is increased to a second width that is larger than the length of the one of the solid state devices.

Abstract: A deflecting plate includes a silicon-on-insulator (SOI) substrate. The SOI substrate includes: an insulator layer having a top surface and a bottom surface; a device layer coupled to the insulator layer at the top surface, wherein multiple deflecting apertures are disposed in the device layer, each of which extending from a top open end to a bottom open end through the device layer, and wherein the bottom open end is coplanar with the top surface of the insulator layer; and a handle substrate coupled to the insulator layer at the bottom surface, wherein a cavity is disposed in the handle substrate and extends from a cavity open end to a cavity bottom wall, and wherein the bottom wall is coplanar with the top surface of the insulator layer, such that the bottom open end of each deflecting aperture is exposed to the cavity.

Abstract: Methods of testing, manufacturing, and packaging semiconductor devices are disclosed. In some embodiments, a method of testing a semiconductor device includes providing an integrated circuit die having contacts disposed thereon, forming an insulating material over the integrated circuit die and the contacts, and forming an opening in the insulating material over the contacts. A eutectic material is formed in the openings over the contacts, and the integrated circuit die is electrically tested by contacting the eutectic material disposed over the contacts. The eutectic material is removed.

Abstract: Methods of testing, manufacturing, and packaging semiconductor devices are disclosed. In some embodiments, a method of testing a semiconductor device includes providing an integrated circuit die having contacts disposed thereon, forming an insulating material over the integrated circuit die and the contacts, and forming an opening in the insulating material over the contacts. A eutectic material is formed in the openings over the contacts, and the integrated circuit die is electrically tested by contacting the eutectic material disposed over the contacts. The eutectic material is removed.

Abstract: A mechanism device includes a hinge mechanism, a holding base, a guiding member and a fixing member. The holding base is pivoted to the frame by the hinge mechanism and includes a main casing, a first holding casing and a second holding casing. The first holding casing and the second holding casing extend from two opposite sides of the main casing along a direction away from the hinge mechanism, such that the main casing, the first holding casing and the second holding casing cooperatively define a holding slot with openings formed on two sides thereof, so as to hold an electronic device. The guiding member is disposed within the holding slot and for guiding the electronic device into the holding slot. The fixing member is disposed within the holding slot and for fixing the electronic device inside the holding slot after the electronic device enters the holding slot.

Abstract: An adjustable docking device includes a hinge mechanism, a holding base, a guiding member, and a fixing mechanism. The hinge mechanism is installed on a frame. The holding base is pivoted to the frame by the hinge mechanism. The holding base includes a main casing, a first holding casing and a second holding casing. The first holding casing and the second holding casing respectively extends from the main casing. The main casing, the first holding casing, and a second holding casing cooperatively define a clamping slot for holding an electronic device. The guiding member is disposed inside the clamping slot and for guiding the electronic device into the clamping slot. The fixing mechanism is disposed inside the holding base and capable of switching between a locking status and a releasing status, so as to lock or release the electronic device.

Abstract: An adjustable docking device includes a hinge mechanism, a holding base, a guiding member, and a fixing mechanism. The hinge mechanism is installed on a frame. The holding base is pivoted to the frame by the hinge mechanism. The holding base includes a main casing, a first holding casing and a second holding casing. The first holding casing and the second holding casing respectively extends from the main casing. The main casing, the first holding casing, and a second holding casing cooperatively define a clamping slot for holding an electronic device. The guiding member is disposed inside the clamping slot and for guiding the electronic device into the clamping slot. The fixing mechanism is disposed inside the holding base and capable of switching between a locking status and a releasing status, so as to lock or release the electronic device.

Abstract: A mechanism device includes a hinge mechanism, a holding base, a guiding member and a fixing member. The holding base is pivoted to the frame by the hinge mechanism and includes a main casing, a first holding casing and a second holding casing. The first holding casing and the second holding casing extend from two opposite sides of the main casing along a direction away from the hinge mechanism, such that the main casing, the first holding casing and the second holding casing cooperatively define a holding slot with openings formed on two sides thereof, so as to hold an electronic device. The guiding member is disposed within the holding slot and for guiding the electronic device into the holding slot. The fixing member is disposed within the holding slot and for fixing the electronic device inside the holding slot after the electronic device enters the holding slot.

Abstract: A 6H-indeno[2,1-b]quinoline derivative has a structure of formula (I). Each of Ar1 and Ar2 is a member selected from the group consisting of a substituted or non-substituted aryl group and a substituted or non-substituted heteroaryl group and R1 to R9 are substituents. The 6H-indeno[2,1-b]quinoline derivative of the present invention is provided with thermal stability. Chemical compounds of the present invention are adequate for the materials of the light-emitting layer of an OLED device with high device performance.

Abstract: An electronic device includes a casing and a fan received in the casing. The fan includes a cover plate, a bottom plate and a side wall. An air outlet is defined in the side wall. The bottom plate defines an air inlet. The casing includes a bottom cover and a top cover. The bottom cover includes a base plate, and a side plate extending upwardly from a periphery of the base plate. The bottom plate includes a horizontal first area and a second area inclining relative to the first area. A height of the base plate relative to a horizontal plane gradually increases from one side of the casing to another side of the casing. A height of the second area relative to the horizontal plane also gradually increases from the one side of the casing to another side of the casing.

Abstract: A backlight module includes a flexible circuit board. The flexible circuit board includes a conductive layer and an insulating layer covering the conductive layer. The backlight module further includes a plurality of light emitting diodes respectively disposed on two sides of the flexible circuit board and electrically connected to the conductive layer of the flexible circuit board for emitting light towards the two sides of the flexible circuit board.

Abstract: An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.

Abstract: A 6H-indeno[2,1-b]quinoline derivative has a structure of formula (I). Each of Ar1 and Ar2 is a member selected from the group consisting of a substituted or non-substituted aryl group and a substituted or non-substituted heteroaryl group and R1 to R9 are substituents. The 6H-indeno[2,1-b]quinoline derivative of the present invention is provided with thermal stability. Chemical compounds of the present invention are adequate for the materials of the light-emitting layer of an OLED device with high device performance.

Abstract: The present disclosure relates to a bipolar compound represented by the following formula (I); and an organic luminescent diode device containing the same. wherein A represents a phenyl, a biphenyl, or a terphenyl group; and Ra, Rb, and Rc are independently selected from a group consisting of a hydrogen, a halo, a cyano, a trifluoromethyl, an amino, a C1-C10 alkyl, a C2-C10 alkenyl, a C2-C10 alkynyl, a C3-C20 cycloalkyl, a C3-C20 cycloalkenyl, a C1-C20 heterocyclic alkyl, a C1-C20 hetercyclic alkenyl, an aryl, and a heteroaryl groups.

Abstract: The present invention discloses a phosphor material for organic optoelectronic devices. The phosphor is a complex comprising a metal (Ir or Pt) and an aryl-modified beta-diketone ligand. The complexes of this invention are useful to function as an emitter in the emissive layer of an organic light emitting diode, even as the complex is the main component of this layer.

Abstract: A method for evaluating failure rate, which is applied to a plurality of semiconductor chips with error checking and correcting function includes the following steps. A first read-write test operation is applied to the semiconductor chips, thereby obtaining a plurality of first failure bit counting values. The error checking and correcting function of each of the semiconductor chips is off. An aging test is applied to the semiconductor chips. A second read-write test operation as the first read-write test operation is applied to the semiconductor chips, thereby obtaining a plurality of second failure bit counting values. The number of the semiconductor chips, the first failure bit counting values, the second failure bit counting values and an error checking and correcting coefficient are calculated to obtain a failure rate of the semiconductor chips.

Abstract: An electronic device includes a casing and a fan received in the casing. The fan includes a cover plate, a bottom plate and a side wall. An air outlet is defined in the side wall. The bottom plate defines an air inlet. The casing includes a bottom cover and a top cover. The bottom cover includes a base plate, and a side plate extending upwardly from a periphery of the base plate. The bottom plate includes a horizontal first area and a second area inclining relative to the first area. A height of the base plate relative to a horizontal plane gradually increases from one side of the casing to another side of the casing. A height of the second area relative to the horizontal plane also gradually increases from the one side of the casing to another side of the casing.

Abstract: An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.

Abstract: Disclosed is a carbazole serial compound, having a general formula as: wherein X is selected from a halogen atom, a cyano group, a substituted or non-substituted C1-40 alkyl group, a substituted or non-substituted C2-40 alkenyl group, a substituted or non-substituted C2-40 alkynyl group, a substituted or non-substituted C6-40 aryl group, a substituted or non-substituted C4-40 hetero aryl group, a substituted or non-substituted C6-40 aryl amino group, or a substituted or non-substituted C1-40 alkyl amino group. Each R is independently selected from a hydrogen atom, a cyano group, a substituted or non-substituted C1-40 alkyl group, a substituted or non-substituted C2-40 alkenyl group, a substituted or non-substituted C2-40 alkynyl group, a substituted or non-substituted C6-40 aryl group, a substituted or non-substituted C4-40 hetero aryl group, a substituted or non-substituted C6-40 aryl amino group, or a substituted or non-substituted C1-40 alkyl amino group.