Patents by Inventor Chin-Ju Wu

Chin-Ju Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152679
    Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Inventors: Rachid Salik, Chin-Chang Hsu, Cheng-Chi Wu, Chien-Wen Chen, Wen-Ju Yang
  • Publication number: 20240118316
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Applicant: MPI Corporation
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Publication number: 20240065765
    Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Inventors: Alvin Chao-Yu CHEN, Yi-Sheng CHAN, Chi-Pin HSU, Shang-Chih LIN, Chin-Ju WU, Jeng-Ywan JENG
  • Patent number: 11914941
    Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Rachid Salik, Chin-Chang Hsu, Cheng-Chi Wu, Chien-Wen Chen, Wen-Ju Yang
  • Publication number: 20110133670
    Abstract: A street lamp capable of adjusting illuminating range thereof and having LEDs as its light source is provided. The street lamp comprises: a main supporting member; a substrate, one end of the substrate being pivotally fixed to the main supporting member by a first fastening member, and an LED light source being provided on the surface opposite to the main supporting member; and an adjusting member provided between the main supporting member and the substrate, one end of the adjusting member being pivotally fixed to the main supporting member by a second fastening member, wherein a fixing member for adjusting the angle of the substrate to adjust the illuminating angle is provided between the substrate and the adjusting member when the first fastening member and the second fastening member are pivotally movable.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 9, 2011
    Applicant: QBAS TECH. CO., LTD.
    Inventors: Ming-Hai Lee, Chin-Ju Wu, Tung-Huang Lu